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US4392893A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for controlling characteristics of a semiconductor integrated by circuit X-ray bombardment

Assignee: Texas Instruments Inc
•
Filing: 1980-11-17
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Granted: 1983-07-12
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Expires: 2000-11-17
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Abstract

Abstract The characteristics of integrated circuits, such as the gate threshold voltage (Vtx) of insulated gate field effect transistors, or the current amplification factor (h FE ) of bipolar transistors are altered by the irradiation of the X-ray with predetermined amount. The X-ray irradiation is used to make the integrated circuits with very accurate characteristics with high yield of production. It is also used to make variety of sample information by changing the characteristics of the same device one after another.

Inventors

  • 👤 Nguyen T. Du
  • 👤 Akihide Asao

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 23:36
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/26; G01R31/265

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 96 words
A method for manufacturing a semiconductor integrated circuit to provide a specific value of an electrical characteristic, comprising the steps of preparing a silicon substrate for said integrated circuit having a substrate resistivity of no more than 10Ω. cm at least at a portion of said substrate, forming a semiconductor device at an area including said portion of said substrate, testing said electrical characteristic of said integrated circuit, and thereafter irradiating a predetermined amount of X-ray to a surface of said semiconductor device of said integrated circuit to alter said electrical characteric measured in said test.
Claim 2
Independent Claim 96 words
A method for manufacturing a semiconductor integrated circuit to provide a specific value of an electrical characteristic, comprising the steps of preparing a silicon substrate for said integrated circuit having a substrate resistivity of no more than 10Ω. cm at least at a portion of said substrate, forming a semiconductor device at an area including said portion of said substrate, testing said electrical characteristic of said integrated circuit, and thereafter irradiating a predetermined amount of X-ray to a surface of said semiconductor device of said integrated circuit to alter said electrical characteric measured in said test.
Claim 3
Independent Claim 53 words
A method for manufacturing a semiconductor integrated circuit to provide a specific value of an electrical characteristic, comprising the steps of checking said specific electrical characteristics of a semiconductor device of said integrated circuit, and thereafter respectively irradiating an X-ray to said semiconductor device to alter said electrical characteristics of said semiconductor device.
Claim 4
Independent Claim 53 words
A method for manufacturing a semiconductor integrated circuit to provide a specific value of an electrical characteristic, comprising the steps of checking said specific electrical characteristics of a semiconductor device of said integrated circuit, and thereafter respectively irradiating an X-ray to said semiconductor device to alter said electrical characteristics of said semiconductor device.
Claim 5
Dependent Claim 25 words
A method according to claim 1 wherein said semiconductor device is an insulated gate field effect transistor, and said electrical characteristic is gate threshold voltage.
Claim 6
Dependent Claim 25 words
A method according to claim 3 wherein said step of irradiating is at a level of at least 60 kilovolts for at least ten minutes.
Claim 7
Dependent Claim 25 words
A method according to claim 2 wherein said semiconductor device is an insulated gate field effect transistor, and said electrical characteristic is gate threshold voltage.
Claim 8
Dependent Claim 25 words
A method according to claim 5 wherein said step of irradiating is at a level of at least 60 kilovolts for at least ten minutes.

References Cited (Backward Citations)

US3570112A Cited
US3688389A Cited
US4184896A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-07-11 1987-01-10 1987-07-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-07-11 1991-01-10 1991-07-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-07-11 1995-01-10 1995-07-12 $7700.00 Window Closed / Lapsed

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