Abstract A novel laminate adapted for use in the manufacture of capacitors comprising layers of microthin pin-hole free electroformed copper bonded together by a thin layer of hardened dielectric material, said bonded surfaces of said microthin copper having first been treated to form thereon a superficial coating of cupric oxide, bonded to the outer surfaces of said microthin copper, layers of self-sustaining copper foil, the bonded surfaces of said copper foil having been passivated under reducing or cathodic conditions in an aqueous solution of chromic oxide to passivate the surface thereof and to render said copper foil peelably removable from said microthin copper. A method of forming capacitor networks which comprises establishing a laminate having layers of microthin pin-hole free electroformed copper bonded together by a thin layer of hardened dielectric material, said bonded surfaces of said microthin copper having first been treated to form thereon a superficial coating of cupric oxide, bonded to the outer surfaces of said microthin copper, layers of self-sustaining copper foil, the bonded surfaces of said copper foil having been passivated under reducing or cathodic conditions in an aqueous solution of chromic oxide to passivate the surface thereof and to render said copper foil peelably removable from said microthin copper, peeling away one of said copper foils, photoprocessing the exposed microthin copper to a desired pattern, bonding a reinforced plastic material to said pattern to form an adherent substrate in abutment thereto, removing the other copper foil, and photoprocessing the second exposed microthin copper to a desired pattern.
A laminate adapted for use in the manufacture of capacitors comprising layers of microthin pin-hole and stain free electroformed copper bonded together by a thin layer of hardened dielectric material, said bonded surfaces of said microthin copper having first been treated to form thereon a superficial coating of cupric oxide, bonded to the outer surfaces of said microthin copper, layers of self-sustaining copper foil, the bonded surfaces of said copper foil having been passivated under cathodic or reducing conditions in an aqueous solution of chromic oxide to passivate the surface thereof and to render said copper foil peelably removable from said microthin copper.
Claim 2
Dependent Claim
103 words
A laminate adapted for use in the manufacture of capacitors comprising layers of microthin pin-hole and stain free electroformed copper bonded together by a thin layer of hardened dielectric material, said bonded surfaces of said microthin copper having first been treated to form thereon a superficial coating of cupric oxide, bonded to the outer surfaces of said microthin copper, layers of self-sustaining copper foil, the bonded surfaces of said copper foil having been passivated under cathodic or reducing conditions in an aqueous solution of chromic oxide to passivate the surface thereof and to render said copper foil peelably removable from said microthin copper.
Claim 3
Dependent Claim
10 words
The laminate of claim 1 wherein the laminate is rigid.
Claim 4
Dependent Claim
18 words
The laminate of claim 1 wherein the microthin copper is from about 25 to 100 microinches in thickness.
Claim 5
Dependent Claim
18 words
The laminate of claim 1 wherein the dielectric material has a thickness of from 0.1 to 0.5 mils.
Claim 6
Dependent Claim
26 words
The laminate of claim 1 wherein the laminate after removal of the copper foil has a capacitance of from 400 to 1000 picofarads per square centimeter.