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US4380490A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of preparing semiconductor surfaces

Assignee: Agere Systems LLC
•
Filing: 1981-03-27
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Granted: 1983-04-19
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Expires: 2001-03-27
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Abstract

Abstract A method of treating semiconductor surfaces to produce an abrupt dielectric discontinuity between the semiconductor bulk and the ambient is described.

Inventors

  • 👤 David E. Aspnes
  • 👤 Ambrose A. Studna

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-01 21:35
CPC Classifications
H; H10; H10P; H10P70/00; H10P70/10; H10P70/15; C; C23; C23F; C23F3/00; H10P52/00; H10P52/40; H10P52/402

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 73 words
A method of treating a semiconductor surface comprising the steps pretreating said surface, said semiconductor being selected from the group consisting of Si, Ge, Ga-Group V compounds, and In-Group V compounds, chemomechanically polishing said surface with a mixture of a halogen and an organic solvent, said mixture consists essentially of bromine and methanol, said polishing step comprises diluting said bromine-methanol mixture from 0.05 volume percent bromine to pure methanol, and stripping residual layers.
Claim 2
Independent Claim 73 words
A method of treating a semiconductor surface comprising the steps pretreating said surface, said semiconductor being selected from the group consisting of Si, Ge, Ga-Group V compounds, and In-Group V compounds, chemomechanically polishing said surface with a mixture of a halogen and an organic solvent, said mixture consists essentially of bromine and methanol, said polishing step comprises diluting said bromine-methanol mixture from 0.05 volume percent bromine to pure methanol, and stripping residual layers.
Claim 3
Dependent Claim 21 words
A method as recited in claim 1 in which said semiconductor is selected from the group consisting of Si and Ge.
Claim 4
Dependent Claim 39 words
A method as recited in claim 2 in which said surface is Si<111> and said stripping step comprises flowing solutions of HF in methanol and NH 4 OH in H 2 O and HF in methanol over said surface.
Claim 5
Dependent Claim 29 words
A method as recited in claim 2 in which said surface is Si<110> and said stripping step comprises flowing a solution of buffered HF in methanol over said surface.
Claim 6
Dependent Claim 28 words
A method as recited in claim 2 in which said surface is Si<100> and said stripping step comprises flowing a solution of HF in methanol over said surface.
Claim 7
Dependent Claim 21 words
A method as recited in claim 1 in which said semiconductor is selected from the group consisting of Ga-Group V compounds.
Claim 8
Dependent Claim 13 words
A method as recited in claim 6 in which said compound is GaAs.
Claim 9
Dependent Claim 19 words
A method as recited in claim 7 comprising the further step of stripping residual layers with H 2 O.
Claim 10
Dependent Claim 21 words
A method as recited in claim 1 in which said semiconductor is selected from the group consisting of In-Group V compounds.

References Cited (Backward Citations)

US2619414A Cited
US3156596A Cited
US3262825A Cited
US3577286A Cited
US3629023A Cited
US3869324A Cited
US3969164A Cited
US4184908A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-04-18 1986-10-18 1987-04-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-04-18 1990-10-18 1991-04-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-04-18 1994-10-18 1995-04-19 $7700.00 Window Closed / Lapsed

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