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US4379834A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for cleaning copper-containing metal surfaces

Assignee: Hoechst AG
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Filing: 1982-06-23
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Granted: 1983-04-12
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Expires: 2002-06-23
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Abstract

Abstract A process and an aqueous treatment solution for cleaning copper surfaces, in particular for removing residues of photoresist layers, which residues still adhere after development to the cleared copper areas, are described. The solution contains a water-soluble aliphatic sulfonic acid having 8 to 30 carbon atoms or a water-soluble salt thereof.

Inventors

  • 👤 Walter Herwig
  • 👤 Kurt Klupfel
  • 👤 Helga Sikora
  • 👤 Heide Sprengel

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 19:25
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G03F7/42; G03F7/422; G03F7/426; C; C23; C23G; C23G1/00; C23G1/02; C23G1/10; C23G1/103; C25; C25D; C25D5/00; C25D5/34

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 97 words
In the process for the production of a photoresist image, in which a photopolymerizable photoresist layer is applied to a support of copper or a copper alloy, is exposed imagewise and is washed out of the unexposed areas by means of an aqueous-alkaline developer solution, the improvement which comprises treating the surface of the support, after the development as a separate cleaning step, with a solution which contains a water-soluble aliphatic sulfonic acid, or a water-soluble salt of such a sulfonic acid, having 8 to 30 carbon atoms, the photoresist stencil remaining unattacked during this cleaning step.
Claim 2
Dependent Claim 97 words
In the process for the production of a photoresist image, in which a photopolymerizable photoresist layer is applied to a support of copper or a copper alloy, is exposed imagewise and is washed out of the unexposed areas by means of an aqueous-alkaline developer solution, the improvement which comprises treating the surface of the support, after the development as a separate cleaning step, with a solution which contains a water-soluble aliphatic sulfonic acid, or a water-soluble salt of such a sulfonic acid, having 8 to 30 carbon atoms, the photoresist stencil remaining unattacked during this cleaning step.
Claim 3
Dependent Claim 33 words
A process as claimed in claim 1 which comprises treating the surface with a solution which contains 0.05 to 15 percent by weight of the sulfonic acid or of the sulfonic acid salt.
Claim 4
Dependent Claim 27 words
A process as claimed in claim 1 which comprises treating the surface with a solution of a saturated or mono-unsaturated sulfonic acid or of a salt thereof.
Claim 5
Dependent Claim 26 words
A process as claimed in claim 1 which comprises treating the surface with a solution which additionally contains a mineral acid or a water-soluble carboxylic acid.
Claim 6
Dependent Claim 23 words
A process as claimed in claim 4 which comprises treating the surface with a solution which contains phosphoric acid as the mineral acid.
Claim 7
Dependent Claim 22 words
A process as claimed in claim 1 which comprises treating the surface with a solution which additionally contains a water-miscible organic solvent.
Claim 8
Dependent Claim 21 words
A process as claimed in claim 1 which comprises treating the surface with a solution which additionally contains an anti-foaming agent.
Claim 9
Dependent Claim 17 words
A process as claimed in claim 1 in which the photopolymerizable photoresist layer includes an adhesion promoter.
Claim 10
Dependent Claim 25 words
A process as claimed in claim 1 in which the photopolymerizable photoresist layer is applied to the support by lamination of a prefabricated solid layer.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-04-11 1986-10-11 1987-04-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-04-11 1990-10-11 1991-04-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-04-11 1994-10-11 1995-04-12 $7700.00 Window Closed / Lapsed

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