Abstract The invention includes methods and apparatus for providing relatively long conductors on integrated chips with substantially reduced RC time constants. The preferred mode utilizes a substrate having a metallization pattern wherein etching or milling into the substrate creates a cavity with a metallization conductor disposed in the mouth of the cavity, said cavity being metallized to provide the second conductor. A similar structure may be formed by utilizing orientation dependent etchant which attacks the (111) surface much quicker than the (100) surface to provide an etched V-shaped cavity wherein the first conductor is still an elongated metallization segment in the mouth of the V, and the V is metallized to provide the second conductor. Also, a single conductor, such as the elongated metallization strip may be extended to a conductor on the reverse side of the substrate by providing a pyramid shaped hole from the first conductor through the substrate, which hole is metallized to extend the first conductor to the second conductor via the hole in the substrate.
An integrated chip interconnection which substantially reduces the RC time constant over current interconnections, comprising: a substrate having an elongated cavity etched therein; a conductive coating along said cavity to comprise a first conductor; and, a second conductor in spaced apart relation with said cavity and generally disposed in the mouth thereof, being formed from a metal layer applied to said substrate and etched through to form said cavity.
Claim 2
Dependent Claim
69 words
An integrated chip interconnection which substantially reduces the RC time constant over current interconnections, comprising: a substrate having an elongated cavity etched therein; a conductive coating along said cavity to comprise a first conductor; and, a second conductor in spaced apart relation with said cavity and generally disposed in the mouth thereof, being formed from a metal layer applied to said substrate and etched through to form said cavity.
Claim 3
Dependent Claim
19 words
A chip of claim 1 further comprising: chip webs supporting said second conductor at spaced apart locations there along.
Claim 4
Dependent Claim
66 words
A silicon integrated chip equipped with relatively long transmission lines exhibiting low RC time constants comprising: a substrate having an elongated cavity etched therein from one side; a first conductor disposed in the mouth of the cavity; a second conductor in the other side of the substrate; and; pyramidal shaped openings from said one side to said other side having a conductive coating connection said conductors.
Claim 5
Dependent Claim
66 words
A silicon integrated chip equipped with relatively long transmission lines exhibiting low RC time constants comprising: a substrate having an elongated cavity etched therein from one side; a first conductor disposed in the mouth of the cavity; a second conductor in the other side of the substrate; and; pyramidal shaped openings from said one side to said other side having a conductive coating connection said conductors.