Patent US744559A successfully refreshed from Google Patents.
Patent US4375606A successfully refreshed from Google Patents.
US4375606A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microelectronic device
Assignee: AT&T Inc
•
Filing: 1982-01-18
•
Granted: 1983-03-01
•
Expires: 2002-01-18
Abstract
Abstract A method of bonding microelectronic components (10, 23, 24) is disclosed. A light emitting diode (10) is bonded to a conductive lead (24) and/or a portion of a lead frame (23) using an adhesive having no metallic particles therein. The diode (10) is clamped to the conductive lead (24) and/or the lead frame (23) as the epoxy is cured. Such bonds have been found to exhibit low contact resistance in addition to long life and reliability.
Inventors
- 👤 Daniel A. Di Leo
- 👤 Samuel E. Kurtz
- 👤 John J. Svitak
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 13:37
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/857; H10W; H10W20/00; H10W20/40; H10W70/00; H10W70/40; H10W70/481; H10W72/00; H10W72/01; H10W72/0198; H10W72/30; H10W72/60; H10W72/071; H10W72/073; H10W72/07331; H10W72/076; H10W72/07631; H10W72/07637; H10W72/351; H10W72/353; H10W72/354; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/761; H10W90/766
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
64 words
A light emitting diode assembly comprising: a light emitting diode having a thin coating of a noble metal deposited on a portion thereof; at least one electrically conductive lead having a thin coating of a noble metal deposited thereon; and an unfilled epoxy connecting the noble metal coated portion of the light emitting diode to the noble metal coating of the electrically conductive lead.
Claim 2
Dependent Claim
64 words
A light emitting diode assembly comprising: a light emitting diode having a thin coating of a noble metal deposited on a portion thereof; at least one electrically conductive lead having a thin coating of a noble metal deposited thereon; and an unfilled epoxy connecting the noble metal coated portion of the light emitting diode to the noble metal coating of the electrically conductive lead.
Claim 3
Dependent Claim
14 words
The assembly as set forth in claim 1, wherein: the noble metal is gold.
Claim 4
Dependent Claim
49 words
A microelectronic device having first and second electrically conductive sections, the device further comprising: a thin coating of a noble metal on at least a portion of each of the sections; and an unfilled adhesive bonding the coated conductive sections to form a mechanical and electrical conductive connection therebetween.
Claim 5
Dependent Claim
49 words
A microelectronic device having first and second electrically conductive sections, the device further comprising: a thin coating of a noble metal on at least a portion of each of the sections; and an unfilled adhesive bonding the coated conductive sections to form a mechanical and electrical conductive connection therebetween.
Claim 6
Dependent Claim
27 words
The device as set forth in claim 3, wherein: one of the sections is a light emitting diode; and the other section is an electrically conductive lead.
Claim 7
Dependent Claim
14 words
The device as set forth in claim 3, wherein: the noble metal is gold.
Claim 8
Dependent Claim
77 words
An improved semiconductor array comprising at least one semiconductor device and an opposed lead member, wherein the improvement comprises an improved means of mechanically and electrically interconnecting the device to the member, said interconnecting means consisting essentially of: (a) a noble metal contact on a surface of a device; (b) a noble metal contact on a facing surface of the member; and (c) an unfilled adhesive intermediate the noble metal contacts of the device and the member.
Claim 9
Dependent Claim
77 words
An improved semiconductor array comprising at least one semiconductor device and an opposed lead member, wherein the improvement comprises an improved means of mechanically and electrically interconnecting the device to the member, said interconnecting means consisting essentially of: (a) a noble metal contact on a surface of a device; (b) a noble metal contact on a facing surface of the member; and (c) an unfilled adhesive intermediate the noble metal contacts of the device and the member.
References Cited (Backward Citations)
US2244771A
Cited
US2774747A
Cited
US3100080A
Cited
US3139364A
Cited
US3202596A
Cited
US3536546A
Cited
US3923581A
Cited
US3905094A
Cited
US3795047A
Cited
US3863075A
Cited
US3839783A
Cited
US3889286A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-02-28 | 1986-08-30 | 1987-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-02-28 | 1990-08-30 | 1991-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-02-28 | 1994-08-30 | 1995-03-01 | $7700.00 | Window Closed / Lapsed |