US3839783A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermistor manufacturing method
Assignee: RODAN IND Inc
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Filing: 1972-07-12
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Granted: 1974-10-08
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Expires: 1992-07-12
Abstract
Abstract A solderless method of electrically connecting a pair of insulated electrical leads to the conductive electrode material on the opposite sides of a thermistor wafer comprising the steps of exposing the ends of the leads, crossing the leads so that they contact each other, positioning the wafer between the crossed leads so that the leads contact the electrode material, the wafer being held between the leads by the spring tension thereof, coating the leads and the wafer with an electrically insulating, thermally conductive material, and permitting the coating material to cure with the leads and the wafer therein. Preferably, the coating material shrinks during the curing step so that pressure is applied on the leads to urge them against the electrode material.
Inventors
- 👤 R Dankert
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 06:16
CPC Classifications
H; H01; H01C; H01C17/00; H01C17/28; H01C1/00; H01C1/14; H01C1/1406; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49085; Y10T29/49826; Y10T29/49863; Y10T29/49865
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
104 words
A solderless method of electrically connecting a pair of insulated electrical leads to the conductive electrode material on the opposite sides of a thermistor wafer consisting only of the steps of: exposing the ends of said leads; crossing said leads so that they contact each other; positioning said wafer between said crossed leads so that said leads contact said electrode material, said wafer being held between said leads by the spring tension thereof; coating said exposed ends of said leads and said wafer with an electrically insulating, thermally conductive materia; and curing said coating material thereby electrically connecting said leads to said electrode material.
Claim 2
Dependent Claim
104 words
A solderless method of electrically connecting a pair of insulated electrical leads to the conductive electrode material on the opposite sides of a thermistor wafer consisting only of the steps of: exposing the ends of said leads; crossing said leads so that they contact each other; positioning said wafer between said crossed leads so that said leads contact said electrode material, said wafer being held between said leads by the spring tension thereof; coating said exposed ends of said leads and said wafer with an electrically insulating, thermally conductive materia; and curing said coating material thereby electrically connecting said leads to said electrode material.
Claim 3
Dependent Claim
28 words
A method according to claim 1 wherein said coating matearial shrinks during said curing step to apply pressure on said leads to urge them against said electrode material.
Claim 4
Dependent Claim
15 words
A method according to claim 2 wherein said coating material is an aluminum oxide-loaded epoxy.
Claim 5
Dependent Claim
38 words
A method according to claim 1 wherein said step of coating said exposed ends of said leads and said wafer consists of: dipping said exposed ends and said wafer into said coating material while in a liquid state.
Claim 6
Dependent Claim
145 words
In a process for manufacturing a thermistor probe wherein the exposed ends of a pair of insulated electrical leads are electrically connected to the conductive electrode material on the opposite sides of a wafer of ceramic thermistor material, said wafer being positioned between said leads so that said leads contact said electrode material, said wafer being held between said leads by the spring tension thereof, the improvement wherein said leads are retained in contact with said electrode material only by: coating said exposed ends of said leads with said wafer therebetween with an electrically insulating, thermally conductive material; and permitting said coating material to cure with said leads and said wafer therein whereby said coating material holds said ends of said leads in contact with said opposite sides of said wafer thereby electrically connecting said leads to said electrode material without the use of solder.
Claim 7
Dependent Claim
145 words
In a process for manufacturing a thermistor probe wherein the exposed ends of a pair of insulated electrical leads are electrically connected to the conductive electrode material on the opposite sides of a wafer of ceramic thermistor material, said wafer being positioned between said leads so that said leads contact said electrode material, said wafer being held between said leads by the spring tension thereof, the improvement wherein said leads are retained in contact with said electrode material only by: coating said exposed ends of said leads with said wafer therebetween with an electrically insulating, thermally conductive material; and permitting said coating material to cure with said leads and said wafer therein whereby said coating material holds said ends of said leads in contact with said opposite sides of said wafer thereby electrically connecting said leads to said electrode material without the use of solder.
Claim 8
Dependent Claim
32 words
In a manufacturing process according to claim 5, the improvement wherein said coating material shrinks during said curing step to apply pressure on said leads to urge them against said electrode material.
Claim 9
Dependent Claim
38 words
A method according to claim 5 wherein said step of coating said exposed ends of said leads and said wafer consists of: dipping said exposed ends and said wafer into said coating material while in a liquid state.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-10-07 | 1978-04-08 | 1978-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-10-07 | 1982-04-08 | 1982-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-10-07 | 1986-04-08 | 1986-10-08 | $7700.00 | Window Closed / Lapsed |