Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
84 words
A method of wave soldering an assembly comprised of a plurality of electrical conductors disposed on a surface of a sheet of insulating material comprising contacting said surface of said sheet and said conductors with a stationary wave consisting essentially of molten solder and a polyether admixed therewith and floating on the surface thereof, said polyether being the heteric or block copolymer of a dihydroxyphenol and at least one lower alkylene oxide, said copolymer containing at least about 20 percent by weight oxyethylene groups.
Claim 2
Independent Claim
84 words
A method of wave soldering an assembly comprised of a plurality of electrical conductors disposed on a surface of a sheet of insulating material comprising contacting said surface of said sheet and said conductors with a stationary wave consisting essentially of molten solder and a polyether admixed therewith and floating on the surface thereof, said polyether being the heteric or block copolymer of a dihydroxyphenol and at least one lower alkylene oxide, said copolymer containing at least about 20 percent by weight oxyethylene groups.
Claim 3
Dependent Claim
16 words
The method of claim 1 wherein said lower alkylene oxide contains 2 to 4 carbon atoms.
Claim 4
Dependent Claim
11 words
The method of claim 2 wherein said dihydroxy phenol is 2,2-bis(4-hydroxyphenyl)propane.
Claim 5
Dependent Claim
17 words
The method of claim 2 wherein said copolymer has a molecular weight of about 500 to 3000.
Claim 6
Dependent Claim
22 words
The method of claim 4 wherein the amount of said copolymer is about 0.05 to 2.0 percent by weight of said solder.
Claim 7
Dependent Claim
11 words
The method of claim 5 wherein said dihydroxy phenol is 2,2-bis(4-hydroxyphenyl)propane.
Claim 8
Dependent Claim
19 words
The method of claim 5 wherein said molten solder is at a temperature of about 350° to 650° F.
Claim 9
Dependent Claim
17 words
The method of claim 5 wherein said solder also contains a copolymer of dicyclopentadiene and para cresol.
Claim 10
Dependent Claim
21 words
The method of claim 5 wherein said solder also contains an organic acid of from about 12 to 22 carbon atoms.
Claim 11
Dependent Claim
17 words
The method of claim 9 wherein said solder also contains a copolymer of dicyclopentadiene and para cresol.
Claim 12
Dependent Claim
11 words
The method of claim 9 wherein said dihydroxy phenol is 2,2-bis(4-hydroxyphenyl)propane.
Claim 13
Dependent Claim
18 words
The method of claim 9 wherein said solder is at a temperature of about 350° to 650° F.
Claim 14
Dependent Claim
18 words
The method of claim 10 wherein said solder is at a temperature of about 350° to 650° F.
Claim 15
Dependent Claim
11 words
The method of claim 13 wherein said dihydroxy phenol is 2,2-bis(4-hydroxyphenyl)propane.
Claim 16
Dependent Claim
12 words
The method of claim 14 wherein said organic acid is oleic acid.
Claim 17
Dependent Claim
97 words
In a method of wave soldering an assembly comprised of a plurality of electrical conductors disposed on a surface of a sheet of insulating material comprising contacting said surface of said sheet and said conductors with a stationary wave consisting essentially of molten solder and a polyether admixed therewith and floating on the surface thereof, the improvement for eliminating or substantially reducing fuming at elevated temperatures wherein said polyether is the heteric or block copolymer of a dihydroxyphenol and at least one lower alkylene oxide, said copolymer containing at least about 20 percent by weight oxyethylene groups.
Claim 18
Dependent Claim
97 words
In a method of wave soldering an assembly comprised of a plurality of electrical conductors disposed on a surface of a sheet of insulating material comprising contacting said surface of said sheet and said conductors with a stationary wave consisting essentially of molten solder and a polyether admixed therewith and floating on the surface thereof, the improvement for eliminating or substantially reducing fuming at elevated temperatures wherein said polyether is the heteric or block copolymer of a dihydroxyphenol and at least one lower alkylene oxide, said copolymer containing at least about 20 percent by weight oxyethylene groups.