US4127692A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Jig for mass soldering system
Assignee: HOLLIS AUTOMATION Co A Corp OF
•
Filing: 1974-09-23
•
Granted: 1978-11-28
•
Expires: 1994-09-23
Abstract
Abstract A printed circuit board has a coating comprising a selected deformable material which is solder-compatible, and has a melting point below that of solder. Electrical and electronic components are then loaded in position on the board with their leads extending through holes in the board, and imbedded into or through the coating. The coating acts as a jig to steady or stabilize the components in position in the board so that the component leads may then be trimmed to finish length, and the components are then soldered in place. Alternatively the board may be placed in storage for future soldering operation. The coating is melted and displaced simultaneously with soldering. Preferred as coating material are naturally occurring and synthetic waxes having a melting point in the range of about 120°-195° F. In a preferred embodiment of the invention compatible flux active agents are intermixed with the coating material.
Inventors
- 👤 Kenneth G. Boynton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 07:45
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; B; B23; B23K; B23K35/00; B23K35/22; B23K35/36; B23K35/3612; B23K35/3613; H05K13/00; H05K13/04; H05K13/046; H05K13/0465; H05K3/306; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K3/22; H05K3/28; H05K3/282; H05K3/32; H05K3/34; H05K3/3447; H05K3/3489; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/4914; Y10T29/49142; Y10T29/49144; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53183; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 48
Claim 1
Independent Claim
175 words
A method of treating a perforated circuit board in preparation for mass joining with solder electrical and electronic components by their leads to said board, said board having adjacent at least some of its perforations a metallic pattern to which the component leads can be joined by said solder, said method comprising applying to said board so as to at least partially cover (i) at least some of said perforations and (ii) said metallic pattern, a material which acts as a jig to stabilize said components in position relative to said board, said material being applied in liquid state, said material in solid form being substantially deformable, compatible with said solder and having a melting point below that of said solder, and at least hardening the material covering said perforations and said metallic pattern whereby to form a meltable, deformable coating compatible with said solder, and forcing said leads into said perforations for a distance sufficient to penetrate the said material covering said perforations so that said material supports said leads relative to said board.
Claim 2
Independent Claim
175 words
A method of treating a perforated circuit board in preparation for mass joining with solder electrical and electronic components by their leads to said board, said board having adjacent at least some of its perforations a metallic pattern to which the component leads can be joined by said solder, said method comprising applying to said board so as to at least partially cover (i) at least some of said perforations and (ii) said metallic pattern, a material which acts as a jig to stabilize said components in position relative to said board, said material being applied in liquid state, said material in solid form being substantially deformable, compatible with said solder and having a melting point below that of said solder, and at least hardening the material covering said perforations and said metallic pattern whereby to form a meltable, deformable coating compatible with said solder, and forcing said leads into said perforations for a distance sufficient to penetrate the said material covering said perforations so that said material supports said leads relative to said board.
Claim 3
Dependent Claim
23 words
A method according to claim 1 wherein said components are loaded into said coating after said liquid material is at least partially hardened.
Claim 4
Dependent Claim
28 words
A method according to claim 1 wherein said material is in the form of a melt, and said melt is hardened by cooling to below its liquidus temperature.
Claim 5
Dependent Claim
23 words
A method according to claim 1 further including the step of applying a flux to said board prior to treating with said material.
Claim 6
Dependent Claim
14 words
A method according to claim 1 wherein said coating comprises a resiliently deformable material.
Claim 7
Dependent Claim
14 words
A method according to claim 1 wherein said coating comprises a non-elastically deformable material.
Claim 8
Independent Claim
244 words
A method of mass joining with solder electrical and electronic components assembled in a perforated circuit board, said board having adjacent at least some of its perforations a metallic pattern with which the component leads can be joined by said solder and wherein the component leads extend through at least some of the perforations in said board and excess lengths of said component leads are trimmed prior to soldering, said method comprising the steps in sequence of: (a) forming on said board so as to cover at least in part (i) at least some of said perforations and (ii) said metallic pattern, a coating of a stabilizer material which (1) is compatible with said solder when said solder is in a molten state, (2) has a melting point below that of said solder; and (3) is physically deformable by said leads; (b) loading said components in position on said board by forcing said leads into said perforations for a distance sufficient for said leads to penetrate the material covering said perforations so that said material acts as a jig to support said leads relative to said board; (c) trimming said leads; (d) immersing said boards and trimmed leads at least in part in a molten body of solder so as substantially simultaneously to cause said material to melt and said solder to replace the melted material on said metallic portions on said board and to wet said metallic portions on said board and leads.
Claim 9
Independent Claim
244 words
A method of mass joining with solder electrical and electronic components assembled in a perforated circuit board, said board having adjacent at least some of its perforations a metallic pattern with which the component leads can be joined by said solder and wherein the component leads extend through at least some of the perforations in said board and excess lengths of said component leads are trimmed prior to soldering, said method comprising the steps in sequence of: (a) forming on said board so as to cover at least in part (i) at least some of said perforations and (ii) said metallic pattern, a coating of a stabilizer material which (1) is compatible with said solder when said solder is in a molten state, (2) has a melting point below that of said solder; and (3) is physically deformable by said leads; (b) loading said components in position on said board by forcing said leads into said perforations for a distance sufficient for said leads to penetrate the material covering said perforations so that said material acts as a jig to support said leads relative to said board; (c) trimming said leads; (d) immersing said boards and trimmed leads at least in part in a molten body of solder so as substantially simultaneously to cause said material to melt and said solder to replace the melted material on said metallic portions on said board and to wet said metallic portions on said board and leads.
Claim 10
Dependent Claim
15 words
A method according to claim 7 wherein said solder-compatible, deformable material comprises an amorphous material.
Claim 11
Dependent Claim
14 words
A method according to claim 7 wherein said solder-compatible, deformable material comprises crystalline material.
Claim 12
Dependent Claim
23 words
A method according to claim 7 wherein said solder-compatible, deformable material has a melting point temperature in the range of about 120°-195° F.
Claim 13
Dependent Claim
22 words
A method according to claim 7 wherein said solder-compatible, deformable material is selected from the group consisting of waxes, resins and polymers.
Claim 14
Dependent Claim
14 words
A method according to claim 11 wherein said material comprises a naturally occuring wax.
Claim 15
Dependent Claim
15 words
A method according to claim 11 wherein said naturally occuring wax comprises a vegetable wax.
Claim 16
Dependent Claim
15 words
A method according to claim 11 wherein said naturally occuring wax comprises an animal wax.
Claim 17
Dependent Claim
17 words
A method according to claim 11 wherein said naturally occuring wax comprises a petroleum derived mineral wax.
Claim 18
Dependent Claim
18 words
A method according to claim 11 wherein said material comprises a synthetic wax derived from a Fischer-Tropsch synthesis.
Claim 19
Dependent Claim
23 words
A method according to claim 11 wherein said material comprises a resin selected from the group consisting of alkyl resins and dipentene resins.
Claim 20
Dependent Claim
22 words
A method according to claim 11 wherein said polymer is selected from the group consisting of polyethylene, polybutene, polyindene and polyethylene glycol.
Claim 21
Dependent Claim
14 words
A method according to claim 11 wherein said material comprises a water soluble polymer.
Claim 22
Dependent Claim
14 words
A method according to claim 7 wherein said coating comprises a resiliently deformable material.
Claim 23
Dependent Claim
14 words
A method according to claim 7 wherein said coating comprises a non-elastically deformable material.
Claim 24
Dependent Claim
32 words
Method according to claim 5 wherein said solder-compatible, deformable material is applied to said circuit board as a selected liquid material, and including the step of at least partially hardening said liquid.
Claim 25
Dependent Claim
19 words
A method according to claim 5 including the step of applying a flux to said circuit board and leads.
Claim 26
Dependent Claim
19 words
A method according to claim 19 wherein said flux is applied prior to the application of said liquid material.
Claim 27
Dependent Claim
19 words
A method according to claim 19 wherein said flux is applied simultaneously with the application of said liquid material.
Claim 28
Dependent Claim
50 words
A method according to claim 7 including the steps of heating said coating after the components are loaded in position so as to at least partially melt the said coating and then cooling said melted coating so as to resolidify said melted coating onto said leads and said metallic pattern.
Claim 29
Independent Claim
216 words
A system for joining with solder, a perforated circuit board, said board having a metallic pattern adjacent at least some of its perforations, and electrical and electronic components assembled in said circuit board wherein the component leads extend through at least some of said perforations in said board and can be soldered to said metallic pattern, and comprising in combination means for applying to said board so as to at least partially cover (i) at least some of said perforations and (ii) said metallic pattern, a coating of a selected material which is (1) deformable, (2) compatible with molten solder when said solder is in a molten state and (3) has a melting point below that of said solder; means for positioning said components on said board and for forcing said leads into said perforations so as to penetrate the said material covering said perforations whereby said material acts as a jig to support said leads relative to said board; means for trimming said leads to a predetermined length; and means adapted to contain a body of said solder in molten state and for applying said molten solder to said board and trimmed leads so as to cause said material to melt and to substantially simultaneously replace the melted material in said perforations with molten solder.
Claim 30
Independent Claim
216 words
A system for joining with solder, a perforated circuit board, said board having a metallic pattern adjacent at least some of its perforations, and electrical and electronic components assembled in said circuit board wherein the component leads extend through at least some of said perforations in said board and can be soldered to said metallic pattern, and comprising in combination means for applying to said board so as to at least partially cover (i) at least some of said perforations and (ii) said metallic pattern, a coating of a selected material which is (1) deformable, (2) compatible with molten solder when said solder is in a molten state and (3) has a melting point below that of said solder; means for positioning said components on said board and for forcing said leads into said perforations so as to penetrate the said material covering said perforations whereby said material acts as a jig to support said leads relative to said board; means for trimming said leads to a predetermined length; and means adapted to contain a body of said solder in molten state and for applying said molten solder to said board and trimmed leads so as to cause said material to melt and to substantially simultaneously replace the melted material in said perforations with molten solder.
Claim 31
Dependent Claim
27 words
A system according to claim 27 wherein said means for applying said material comprises a container adapted for maintaining a body of said material in liquid state.
Claim 32
Dependent Claim
24 words
A system according to claim 27 wherein said container includes means for heating said material so as to maintain said material in molten condition.
Claim 33
Dependent Claim
16 words
A system according to claim 29 including means for forming said liquid as a moving body.
Claim 34
Dependent Claim
24 words
A system according to claim 29 further including means for at least partially hardening said material after the latter is applied to said board.
Claim 35
Dependent Claim
14 words
A system according to claim 31 wherein said means for hardening comprises cooling means.
Claim 36
Dependent Claim
14 words
A system according to claim 31 wherein said means for hardening comprises heating means.
Claim 37
Dependent Claim
22 words
A system according to claim 31 wherein said means for hardening comprises means for treating said material with a chemical hardening agent.
Claim 38
Dependent Claim
20 words
A system according to claim 31 wherein said means for hardening comprises means for exposing said material to ultra-violet light.
Claim 39
Dependent Claim
16 words
A system according to claim 27 further including means for applying a flux to said board.
Claim 40
Dependent Claim
20 words
A system according to claim 27 wherein said means for applying said material is adapted to simultaneously apply said flux.
Claim 41
Dependent Claim
111 words
An article of manufacture comprising a circuit board having a plurality of perforations and a metallic pattern adjacent at least some of said perforations to which component leads can be mounted to said board by solder, said board having a deformable coating which is adapted to act as a jig to stabilize components in position relative to said board, said coating at least partially covering (i) at least some of said perforations and (ii) said metallic pattern, said coating (a) being normally solid under ambient conditions, (b) having a melting point below that of said solder and (c) being compatible with said solder when said solder is in a molten state.
Claim 42
Dependent Claim
111 words
An article of manufacture comprising a circuit board having a plurality of perforations and a metallic pattern adjacent at least some of said perforations to which component leads can be mounted to said board by solder, said board having a deformable coating which is adapted to act as a jig to stabilize components in position relative to said board, said coating at least partially covering (i) at least some of said perforations and (ii) said metallic pattern, said coating (a) being normally solid under ambient conditions, (b) having a melting point below that of said solder and (c) being compatible with said solder when said solder is in a molten state.
Claim 43
Dependent Claim
15 words
An article of manufacture according to claim 38 wherein said coating also includes a flux.
Claim 44
Dependent Claim
16 words
An article of manufacture according to claim 38 wherein said coating comprises a resiliently deformable material.
Claim 45
Dependent Claim
16 words
An article of manufacture according to claim 38 wherein said coating comprises a non-elastically deformable material.
Claim 46
Independent Claim
93 words
A method of treating a circuit board having a plurality of perforations and a metallic pattern adjacent at least some of said perforations to which component leads can be mounted to said board by solder, so as to preserve said metallic pattern from oxidation, said method comprising coating said metallic pattern at least in part with a deformable material, said material (a) being normally solid under ambient conditions, (b) having a melting point below that of said solder, and (c) being compatible with said solder when said solder is in a molten state.
Claim 47
Independent Claim
93 words
A method of treating a circuit board having a plurality of perforations and a metallic pattern adjacent at least some of said perforations to which component leads can be mounted to said board by solder, so as to preserve said metallic pattern from oxidation, said method comprising coating said metallic pattern at least in part with a deformable material, said material (a) being normally solid under ambient conditions, (b) having a melting point below that of said solder, and (c) being compatible with said solder when said solder is in a molten state.
Claim 48
Dependent Claim
24 words
A method according to claim 42 including the step of admixing a flux with said material, and applying the resulting mixture to said board.
References Cited (Backward Citations)
US3005099A
Cited
US3117101A
Cited
US2983853A
Cited
US3158927A
Cited
US3350250A
Cited
US3388465A
Cited
US3381081A
Cited
US3307442A
Cited
US3538389A
Cited
US3560420A
Cited
US3655496A
Cited
US3704515A
Cited
US3693052A
Cited
US3780431A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-11-27 | 1982-05-29 | 1982-11-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-11-27 | 1986-05-29 | 1986-11-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-11-27 | 1990-05-29 | 1990-11-28 | $7700.00 | Window Closed / Lapsed |