Patent US4345267A successfully refreshed from Google Patents.
US4345267A
Expired / Lapsed
US
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Active device substrate connector having a heat sink
Assignee: TE Connectivity Corp
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Filing: 1980-03-31
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Granted: 1982-08-17
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Expires: 2000-03-31
Abstract
Abstract The present invention is to a heat sink device designed to conduct heat away from an active device substrate housed in a connector of the type having a hinged cover with spring elements thereon. More particularly the preferred embodiment includes a base member, in intimate contact with the substrate, positioned on the inside of the cover, and a heat exchanger attached to the base and extending above the cover.
Inventors
- 👤 Ned E. Corman
- 👤 Steven J. Kandybowski
- 👤 William S. Scheingold
- 👤 Frank C. Youngfleish
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 08:50
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H10; H10W; H10W40/00; H10W40/60; H10W40/641
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
150 words
An active device substrate connector incorporating a heat sink, comprising: a. a housing having a central cavity into which an active device substrate may be positioned; b. a cover hingedly connected to one side of the housing for covering the substrate-receiving cavity and having a plurality of spring fingers spaced around a centrally positioned opening through the cover; and c. a heat sink of thermally conductive material comprising: i. a base plate removably positionable in between the inside of the cover when closed over the housing and a substrate which may be positioned in the cavity, said spring fingers on the cover bearing against the plate to retain it in the housing and to bias it against the substrate; ii. a heat-exchanger consisting of a plurality of vertically stacked discs; and iii. means for mechanically and thermally removably connecting the heat exchanger to the base plate through the cover opening.
Claim 2
Dependent Claim
150 words
An active device substrate connector incorporating a heat sink, comprising: a. a housing having a central cavity into which an active device substrate may be positioned; b. a cover hingedly connected to one side of the housing for covering the substrate-receiving cavity and having a plurality of spring fingers spaced around a centrally positioned opening through the cover; and c. a heat sink of thermally conductive material comprising: i. a base plate removably positionable in between the inside of the cover when closed over the housing and a substrate which may be positioned in the cavity, said spring fingers on the cover bearing against the plate to retain it in the housing and to bias it against the substrate; ii. a heat-exchanger consisting of a plurality of vertically stacked discs; and iii. means for mechanically and thermally removably connecting the heat exchanger to the base plate through the cover opening.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-08-16 | 1986-02-15 | 1986-08-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-08-16 | 1990-02-15 | 1990-08-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-08-16 | 1994-02-15 | 1994-08-17 | $7700.00 | Window Closed / Lapsed |