Thermal protection circuit for the die of a transistor

Claim 2

A thermal protection circuit for a die of a transistor having a heat sink, said circuit comprising means for multiplying a signal proportional to the dissipative input current to said transistor by a signal proportional to the dissipative applied voltage of the transistor to produce a signal representative of the applied power to the transistor, means responsive to said representative applied power signal for simulating the differential in temperature between said die and heat sink, means for substantially simultaneously determining the temperature of said heat sink, means for summing said heat sink temperature and said differential in temperature between said die and heat sink to determine a sensed die temperature, and means for reducing said applied power to the transistor in response to said sensed die temperature, said multiplying means including a differential pair of transistors having common emitter junctions, resistance means for applying an input current to said common emitter junctions proportional to said dissipative applied voltage of the transistor.

Claim 3

The protection circuit of claim 1 and a current sensing means responsive to said dissipated input current to the transistor for producing a base input voltage to said differential pair of transistors.

Claim 4

The protection circuit of claim 1 and current mirror means for converting the output of said differential pair of transistors into a single-ended output constituting said applied power to the transistor.

Claim 5

The protection circuit of claim 3 wherein said means for determining said sink temperature produces a representative signal received by said current mirror means.

Claim 6

A thermal protection circuit for a die of a means for multiplying a signal proportional to the dissipative input current to said transistor by a signal proportional to the dissipative applied voltage of the transistor to produce a signal representative of the applied power to the transistor, means responsive to said representative applied power signal for simulating the differential in temperature between said die and heat sink, means for substantially simultaneously determining the temperature of said heat sink, means for summing said heat sink temperature and said differential in temperature between said die and heat sink to determine a sensed die temperature, and means for reducing said applied power to the transistor in response to said sensed die temperature, said temperature differential simulating means being an electrical analog means for determining the thermal impedance of said die, said summing means being an inverting operational amplifier having a feedback network, said feedback network constituting said electrical analog means, said analog means including a series connected network of resistors and capacitors with each resistor being connected in parallel with a capacitor, said signal of the multiplying means being received by said inverting operational amplifier.

Claim 7

A thermal protection circuit for a die of a means for multiplying a signal proportional to the dissipative input current to said transistor by a signal proportional to the dissipative applied voltage of the transistor to produce a signal representative of the applied power to the transistor, means responsive to said representative applied power signal for simulating the differential in temperature between said die and heat sink, means for substantially simultaneously determining the temperature of said heat sink, means for summing said heat sink temperature and said differential in temperature between said die and heat sink to determine a sensed die temperature, and means for reducing said applied power to the transistor in response to said sensed die temperature, said temperature differential simulating means being an electrical analog means for determining the thermal impedance of said die, said summing means being an inverting operational amplifier having a feedback network, said feedback network constituting said electrical analog means, said analog means including a series connected network of resistors and capacitors with each resistor being connected in parallel with a capacitor, said signal of the multiplying means being received by said inverting operational amplifier.

Claim 8

The protection circuit of claim 5 wherein said means for determining said sink temperature produces a representative signal received by said inverting operational amplifier.

Claim 9

A thermal protection circuit for a die of a transistor having a heat sink, said circuit comprising means for multiplying a signal proportional to the dissipative input current to said transistor by a signal proportional to the dissipative applied voltage of the transistor to produce a signal representative of the applied power to the transistor, means responsive to said representative applied power signal for simulating the differential in temperature between said die and heat sink, means for substantially simultaneously determining the temperature of said heat sink, means for summing said heat sink temperature and said differential in temperature between said die and heat sink to determine a sensed die temperature, and means for reducing said applied power to the transistor in response to said sensed die temperature, said temperature differential simulating means being an electrical analog means for determining the thermal impedance of said die, said summing means being an inverting operational amplifier having a feedback network, said feedback network constituting said electrical analog means, said inverting operational amplifier being biased to saturate at an actual die temperature below which no monitoring of the die is required.

Claim 10

A thermal protection circuit for a die of a transistor having a heat sink, said circuit comprising means for multiplying a signal proportional to the dissipative input current to said transistor by a signal proportional to the dissipative applied voltage of the transistor to produce a signal representative of the applied power to the transistor, means responsive to said representative applied power signal for simulating the differential in temperature between said die and heat sink, means for substantially simultaneously determining the temperature of said heat sink, means for summing said heat sink temperature and said differential in temperature between said die and heat sink to determine a sensed die temperature, and means for reducing said applied power to the transistor in response to said sensed die temperature, said temperature differential simulating means being an electrical analog means for determining the thermal impedance of said die, said summing means being an inverting operational amplifier having a feedback network, said feedback network constituting said electrical analog means, said inverting operational amplifier being biased to saturate at an actual die temperature below which no monitoring of the die is required.