Abstract A method of conditioning a nitride surface by treating it with ionized oxygen is disclosed. The nitride surface is placed in a vacuum and treated with the ionized oxygen for a period of time sufficient to condition the nitride for subsequent processing steps. The ionized oxygen treatment is performed substantially at ambient temperature. The conditioning method is included in a process for improving the adhesion characteristics of a photoresist film to a silicon nitride surface. A liquid solution of hexamethyldisilazane is applied to the conditioned nitride surface. Thereafter, a photoresist is applied, exposed through a photographic mask and developed in a known manner for the purpose of forming a photoresist masking film pattern. The photoresist film pattern typically serves as a mask during an etching process in which areas not covered by photoresist are removed by a suitable etching solution.
A method for treating the surface of a silicon nitride layer formed on a semiconductor wafer to enhance the adhesion of photoresist to the surface during etching in buffered hydrofluoric acid, comprising in sequence of steps of: exposing the surface of the silicon nitride layer to an ionized oxygen plasma for at least about 10 minutes; and applying to the nitride surface a liquid solution of hexalkyldisilazane wherein the alkyl group is selected from methyl, ethyl and propyl.
Claim 2
Independent Claim
78 words
A method for treating the surface of a silicon nitride layer formed on a semiconductor wafer to enhance the adhesion of photoresist to the surface during etching in buffered hydrofluoric acid, comprising in sequence of steps of: exposing the surface of the silicon nitride layer to an ionized oxygen plasma for at least about 10 minutes; and applying to the nitride surface a liquid solution of hexalkyldisilazane wherein the alkyl group is selected from methyl, ethyl and propyl.
Claim 3
Dependent Claim
64 words
The method as recited in claim 1 wherein the steps of exposing the surface of the nitride layer to an oxygen plasma comprises the steps of: subjecting the wafer to a flow of oxygen stabilized at a pressure of about 1.2 mm. of mercury; and bombarding the oxygen with a radio frequency field of about 250 watts energy to produce an ionized oxygen plasma.
Claim 4
Dependent Claim
58 words
The method of claim 1 or 2 wherein the step of applying a liquid solution of hexalkyldisilazane to the surface of the nitride layer comprises: applying to the surface of the nitride layer a solution of hexalkyldisilazane and xylene comprising at least fifty percent by volume hexalkyldisilazane; and spinning the wafer to distribute the solution over the surface.