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US4330343A Expired / Lapsed US ⏱️ 0.0 years remaining

Refractory passivated ion-implanted GaAs ohmic contacts

Assignee: United States Department of the Navy
•
Filing: 1980-12-10
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Granted: 1982-05-18
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Expires: 2000-12-10
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Abstract

Abstract A method of attaining n + regions with fine planar geometry in the soe and drain of GaAs devices utilizing ion implantation which improves ohmic contact with a refractory film. A layer of TiW refractory film is deposited on GaAs. 29 Si ions are implanted in the GaAs through the refractory film so that the peak concentration is no more than approximately 100A below the TiW-GaAs interface. The entire structure is then annealed. A gold overlay is then deposited on the TiW layer to which electrical contacts may be attached and by which the contact resistivity is measured. Typical specific contact resistivity values are in the low 10 -6 ohm/cm 2 range.

Inventors

  • 👤 Aristos Christou
  • 👤 John E. Davey

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 05:50
CPC Classifications
H; H10; H10P; H10P30/00; H10P30/20; H10P30/202; H10P30/206; H10D; H10D64/00; H10D64/01; H10D64/011; H10D64/0116; H10P30/21; H10P30/212; H10P30/28; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/064; Y; Y10; Y10S; Y10S148/00; Y10S148/003; Y10S148/02

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 79 words
A method for forming an improved ohmic contact for semiconductors comprising the steps of: depositing a layer of refractory material on a N-type GaAs base material to form a refractory mask; implanting ions through the refractory mask to establish an n + region in the GaAs base material with a peak concentration within about 100 A of the refractory mask-GaAs interface. annealing the implanted structure to activate the implanted ions; and depositing a gold overlay on the refractory mask.
Claim 2
Independent Claim 79 words
A method for forming an improved ohmic contact for semiconductors comprising the steps of: depositing a layer of refractory material on a N-type GaAs base material to form a refractory mask; implanting ions through the refractory mask to establish an n + region in the GaAs base material with a peak concentration within about 100 A of the refractory mask-GaAs interface. annealing the implanted structure to activate the implanted ions; and depositing a gold overlay on the refractory mask.
Claim 3
Dependent Claim 33 words
The method according to claim 1 comprising the step of depositing a refractory mask selected from the group consisting of TiW, Ta, W, Pt, and Mo to a thickness of from 400-800 A.
Claim 4
Dependent Claim 26 words
The method according to claim 1 or 2 comprising the step of selecting an implantation material from the group consisting of 29 Si, Se and Ge.
Claim 5
Dependent Claim 42 words
The method according to claim 3 where said ions are implanted at 60 KeV with a minimum dosage of 1×10 14 ions per cm 2 until the ion concentration within said GaAs is at least 1×10 14 ions per cm 2 .
Claim 6
Dependent Claim 21 words
The method according to claim 3 comprising the step of annealing the structure at about 700° C. for about 30 minutes.
Claim 7
Dependent Claim 21 words
The method according to claim 4 comprising the step of annealing the structure at about 700° C. for about 30 minutes.
Claim 8
Dependent Claim 23 words
The method according to claim 1 or 2 comprising the step of annealing the structure at about 700° C. for about 30 minutes.
Claim 9
Dependent Claim 19 words
The invention according to claim 1 wherein the gold overlay is deposited to a thickness of about 3000 A.
Claim 10
Dependent Claim 16 words
The invention according to claim 1 or 8 wherein the gold overlay is deposited by evaporation.
Claim 11
Dependent Claim 16 words
The invention according to claim 1 or 8 wherein the gold overlay is deposited by sputtering.
Claim 12
Dependent Claim 16 words
The invention according to claim 1 or 8 wherein the gold overlay is deposited by electroplating.

References Cited (Backward Citations)

US3987480A Cited
US3943556A Cited
US3909307A Cited
US4141022A Cited
US4298403A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1985-05-17 1985-11-16 1986-05-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1989-05-17 1989-11-16 1990-05-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1993-05-17 1993-11-16 1994-05-18 $7700.00 Window Closed / Lapsed

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