Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
121 words
A tool for use in removing integrated circuit packages from a burn-in board or the like in which a plurality of sockets are mounted in a plurality of spaced parallel rows for receiving the leads of integrated circuit packages, said tool comprising an end bracket, a plurality of enlongated prongs attached to and extending from said end bracket, said prongs being spaced by an amount corresponding to the distance between adjacent rows of sockets on the burn-in board, a cover pivotally mounted to said end bracket, and means for releasably securing said cover to the free ends of said prongs when said prongs are placed along the spaces between the sockets and the underlying integrated circuit packages mounted in the sockets.
Claim 2
Dependent Claim
121 words
A tool for use in removing integrated circuit packages from a burn-in board or the like in which a plurality of sockets are mounted in a plurality of spaced parallel rows for receiving the leads of integrated circuit packages, said tool comprising an end bracket, a plurality of enlongated prongs attached to and extending from said end bracket, said prongs being spaced by an amount corresponding to the distance between adjacent rows of sockets on the burn-in board, a cover pivotally mounted to said end bracket, and means for releasably securing said cover to the free ends of said prongs when said prongs are placed along the spaces between the sockets and the underlying integrated circuit packages mounted in the sockets.
Claim 3
Dependent Claim
17 words
The tool of claim 1, further comprising a protective layer secured to the underside of said cover.
Claim 4
Dependent Claim
39 words
The tool of claim 2, in which said releasable securing means includes a wire loosely mounted to the end of said cover, said prongs each having a reduced width camming portion at their free ends to receive said wire.
Claim 5
Dependent Claim
39 words
The tool of claim 1, in which said releasable securing means includes a wire loosely mounted to the end of said cover, said prongs each having a reduced width camming portion at their free ends to receive said wire.
Claim 6
Independent Claim
105 words
A method of removing printed circuit packages from a burn-in board in which integrated circuit packages are mounted in sockets arranged along a plurality of spaced parallel rows, said method comprising the steps of inserting a plurality of elongated prongs in the spaces between adjacent rows of sockets and underlying the integrated circuit packages, securing the free end of a cover to the free ends of said prongs, lifting said cover and prongs as thus secured away from the burn-in board, thereby removing the integrated circuit packages from the sockets, and thereafter releasing the cover from said prongs to allow access to the integrated packages.
Claim 7
Independent Claim
105 words
A method of removing printed circuit packages from a burn-in board in which integrated circuit packages are mounted in sockets arranged along a plurality of spaced parallel rows, said method comprising the steps of inserting a plurality of elongated prongs in the spaces between adjacent rows of sockets and underlying the integrated circuit packages, securing the free end of a cover to the free ends of said prongs, lifting said cover and prongs as thus secured away from the burn-in board, thereby removing the integrated circuit packages from the sockets, and thereafter releasing the cover from said prongs to allow access to the integrated packages.
Claim 8
Dependent Claim
33 words
The method of claim 5, further comprising the step of inserting a protective layer intermediate said cover and said prongs for protecting the packages which are positioned between said prongs and said cover.
Claim 9
Dependent Claim
55 words
The method of claim 6, further comprising the steps of interposing a foam board between said prongs and said cover, closing said cover over said foam board and said prongs, turning said tool over, and then opening said cover, whereby the integrated circuit packages are positioned on said foam board with their upper surfaces visible.