Dual-in-line package extraction tool

Claim 1

An extraction tool for sequentially removing and gathering a plurality of dual-in-line multipin integrated circuit packages from a plurality of dual-in-line integrated circuit sockets rectinlinearly arranged in end-to-end configuration on a planar supporting surface, each of said sockets being provided with a rectangular central slot, of substantially uniform width and depth, running parallel to the rows of pins of said each of said sockets, said extraction tool comprising; a. a substantially rigid longitudinal member having a pair of substantially parallel wedge-shaped side faces, bridged by an upper edge of a thickness less than the minimum distance between the two parallel rows of pins of any one of said integrated circuit packages and having a lower edge of a thickness less than the width of the rectangular central slot of any one of said sockets, the thickness of said lower edge less than the thickness of said upper edge by a groove running longitudinally along the portion of each wedge-shaped side face near the lower edge of said longitudinal member to form a rigid longitudinal member of substantially T-shaped cross-section, the wedge-shaped side faces having a width increasingly tapering from a first measure less than the depth of the rectangular central slot of any one of said sockets to a second measure greater than the maximum distance the pins of said packages extend into the dual-in-line sockets; b. a resilient longitudinal cover connected to said wedge like member and overlying, in spaced relationship, the upper edge and a portion of at least one wedge-shaped side face thereof by a distance sufficient to permit a row of dual-in-line integrated circuit packages to straddle said upper edge and readily slide along the length of said longitudinal member without buckling sufficiently to jam out of sequence; whereby, by sliding the lower edge of said longitudinal member along the rectangular central slots of the dual-in-line integrated circuit sockets, the dual-in-line integrated circuit packages are sequentially removed from their corresponding dual-in-line integrated circuit sockets and slid astraddle and along the upper edge of said longitudinal member into the space bounded by said longitudinal member and said longitudinal cover.