US4309267A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Reactive sputter etching apparatus
Assignee: AT&T Inc
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Filing: 1980-07-21
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Granted: 1982-01-05
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Expires: 2000-07-21
Abstract
Abstract An rf sputter etch or reactive sputter etch apparatus which can be used for etching substrates at oblique angles utilizes a cathode formed from a metal grid and an equipotential enclosure. The substrate is supported in the enclosure either parallel to or at an oblique angle to the surface of the grid.
Inventors
- 👤 Gary D. Boyd
- 👤 Larry A. Coldren
- 👤 Frederick G. Storz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 14:01
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/32; H01J37/34
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
95 words
Apparatus for etching a substrate (2) which comprises: anode means (6) disposed parallel to cathode means (5) in a chamber (110); means (106) for introducing a gaseous etchant between said anode and said cathode means in said chamber; means (102) for applying an rf voltage between said anode and said cathode means; characterized in that: said cathode means comprises grid means (1) and an equipotential enclosure (8, 9 and 10), and means for supporting said substrate in said enclosure below said grid at an oblique angle to said grid, whereby said substrate may be etched.
Claim 2
Dependent Claim
95 words
Apparatus for etching a substrate (2) which comprises: anode means (6) disposed parallel to cathode means (5) in a chamber (110); means (106) for introducing a gaseous etchant between said anode and said cathode means in said chamber; means (102) for applying an rf voltage between said anode and said cathode means; characterized in that: said cathode means comprises grid means (1) and an equipotential enclosure (8, 9 and 10), and means for supporting said substrate in said enclosure below said grid at an oblique angle to said grid, whereby said substrate may be etched.
Claim 3
Dependent Claim
20 words
Apparatus as defined in claim 1 which further includes means (12) for adjusting the orientation of said substrate during etching.
Claim 4
Dependent Claim
37 words
Apparatus as defined in claim 1 which further includes a layer (11) of material which is not susceptible to etching by said etchant, which layer of material covers the surface of said enclosure facing said anode means.
Claim 5
Dependent Claim
19 words
Apparatus as defined in claims 2 or 3 wherein the side walls (10) of said enclosure are stainless steel.
Claim 6
Dependent Claim
24 words
Apparatus as defined in claims 2 or 3 wherein the side walls (10) of said enclosure comprise a wire grid and a glass wall.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-01-04 | 1985-07-06 | 1986-01-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-01-04 | 1989-07-06 | 1990-01-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-01-04 | 1993-07-06 | 1994-01-05 | $7700.00 | Window Closed / Lapsed |