US4303935A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor apparatus with electrically insulated heat sink
Assignee: Robert Bosch GmbH
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Filing: 1978-12-04
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Granted: 1981-12-01
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Expires: 1998-12-04
Abstract
Abstract A semiconductor element, either a diode or a controlled rectifier, is electrically insulated relative to the heat sink on which it is mounted by either an insulating layer or an insulating diode of high thermal conductivity. A single unit including the heat sink with a plurality of diodes is used as a bridge rectifier in single phase or polyphase circuits.
Inventors
- 👤 Istvan Ragaly
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 03:32
CPC Classifications
H; H10; H10W; H10W72/00; H02; H02M; H02M7/00; H02M7/003; H10W40/00; H10W40/20; H10W40/25; H10W40/251; H10W70/00; H10W70/20; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/136; H10W90/00; Y; Y10; Y10S; Y10S257/00; Y10S257/909
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
109 words
In a semiconductor arrangement having a single metallic base member (11) constituting a heat sink, a plurality of first semiconductor elements (13) mounted on said single metallic base member and electrical conductor means connected to at least one of said semiconductor elements for providing electrical contact thereto, the improvement comprising electrical insulator means (19) having a high thermal conductivity interposed between said first semiconductor elements and said metallic base member for electrically insulating said single metallic base member from said semiconductor elements, said electrical insulator means comprising a plurality of second semiconductor elements connected to said first semiconductor elements, said second semiconductor elements being always in the blocked state.
Claim 2
Dependent Claim
109 words
In a semiconductor arrangement having a single metallic base member (11) constituting a heat sink, a plurality of first semiconductor elements (13) mounted on said single metallic base member and electrical conductor means connected to at least one of said semiconductor elements for providing electrical contact thereto, the improvement comprising electrical insulator means (19) having a high thermal conductivity interposed between said first semiconductor elements and said metallic base member for electrically insulating said single metallic base member from said semiconductor elements, said electrical insulator means comprising a plurality of second semiconductor elements connected to said first semiconductor elements, said second semiconductor elements being always in the blocked state.
Claim 3
Dependent Claim
21 words
A semiconductor arrangement as set forth in claim 1, wherein said electrical conductor means (15) is soldered to said semiconductor elements.
Claim 4
Dependent Claim
29 words
A semiconductor arrangement as set forth in claim 1, wherein each of said second semiconductor elements is connected to one of said first semiconductor elements with opposite polarity thereto.
Claim 5
Dependent Claim
61 words
A semiconductor arrangement as set forth in claim 3, wherein said plurality of second semiconductor elements comprises a plurality of insulating diodes; and wherein said plurality of insulating diodes comprises a first set of insulating diodes (22) having a p layer and a second set of insulating diodes (22) having an n layer in contact with said metallic base member (25).
Claim 6
Dependent Claim
65 words
A semiconductor arrangement as set forth in claim 3, wherein said plurality of first semiconductor elements comprises a first set of active diodes directly mounted on said metallic base member and a second set of active diodes; and wherein said plurality of second semiconductor elements comprises a set of insulating diodes (22) connected between said second set of active diodes and said metallic base member.
Claim 7
Dependent Claim
56 words
A semiconductor arrangement as set forth in claim 3, wherein said plurality of first semiconductor elements comprises six active diodes and said plurality of second semiconductor elements comprises six insulating diodes connected between said six active diodes and said metallic base member; further comprising connecting means for interconnecting said diodes to form an AC bridge rectifier.
Claim 8
Dependent Claim
73 words
A semiconductor arrangement as set forth in claim 6, wherein said AC bridge rectifier has a first, second and third AC input terminal and a positive and negative bridge output terminal; and wherein said connecting means comprises means for connecting a first, second and third of said six active diodes to said negative bridge output terminal and a fourth, fifth and sixth of said six active diodes to said positive bridge output terminal.
Claim 9
Dependent Claim
94 words
A semiconductor arrangement as set forth in claim 5, wherein said first set of active diodes comprises three diodes and said second set of active diodes comprises three diodes; further comprising three additional diodes, each connected with opposite polarity to one of said first set of active diodes, thereby creating three diode pairs; wherein said second set of active diodes and said plurality of insulating diodes constitute three diode pairs substantially indentical to said first-mentioned three diode pairs; further comprising connecting means for interconnecting said active diodes to form an AC bridge rectifier circuit.
Claim 10
Dependent Claim
86 words
A semiconductor arrangement as set forth in claim 8, wherein said connecting means comprises a first, second and third AC input terminal, means for connecting said first, second and third diode of said first set of active diodes to said first, second and third AC input terminal respectively, a positive bridge output terminal, a negative bridge output terminal, means for connecting said second set of diodes to said positive bridge output terminal and means for connecting said negative bridge output terminal to said metallic base member.
Claim 11
Dependent Claim
31 words
A semiconductor arrangement as set forth in claim 9, further comprising at least one control output terminal, and means for connecting said three additional diodes to said control output terminal (K).
Claim 12
Dependent Claim
18 words
A semiconductor arrangement as set forth in claim 1, wherein said first semiconductor element comprises a controllable rectifier.
Claim 13
Dependent Claim
27 words
A semiconductor arrangement as set forth in claim 1, further comprising a cooling plate (17); and wherein said metallic base member is set into said cooling plate.
Claim 14
Dependent Claim
22 words
A semiconductor arrangement as set forth in claim 12, wherein said metallic base member and said cooling plate constitute said heat sink.
Claim 15
Dependent Claim
101 words
In an AC generator having a plurality of AC terminals for furnishing an AC signal, a rectifier arrangement comprising a plurality of first button diodes (102) connected to said AC terminals (104) for rectifying said AC signal; support means (106) for supporting said first button diodes within said generator said support means also constituting a heat sink; and insulating means (103) comprising a plurality of second button diodes interconnected between said first button diodes and said support means for conducting heat from said first button diodes to said support means while electrically insulating said first button diodes from said support means.
Claim 16
Dependent Claim
101 words
In an AC generator having a plurality of AC terminals for furnishing an AC signal, a rectifier arrangement comprising a plurality of first button diodes (102) connected to said AC terminals (104) for rectifying said AC signal; support means (106) for supporting said first button diodes within said generator said support means also constituting a heat sink; and insulating means (103) comprising a plurality of second button diodes interconnected between said first button diodes and said support means for conducting heat from said first button diodes to said support means while electrically insulating said first button diodes from said support means.
Claim 17
Dependent Claim
69 words
A rectifier arrangement as set forth in claim 14, wherein said AC generator furnishes a three-phase signal; wherein two of said first button diodes are associated with each of said phases; and wherein each two of said first diodes associated with each of said phases and one of said second diodes are mounted one on top of the other within said support means, whereby three diode columns are formed.
Claim 18
Dependent Claim
29 words
A rectifier arrangement as set forth in claim 15, further comprising contact members (104, 105) for providing electrical contact among said first button diodes and constituting a rectifier terminal.
Claim 19
Dependent Claim
31 words
A rectifier arrangement as set forth in claim 16, wherein said rectifier column has a main axis; and wherein said contact member is resilient in the direction of said main axis.
Claim 20
Dependent Claim
22 words
A rectifier arrangement as set forth in claim 16, wherein said contact member further constitutes a thermal contact between diodes connected thereto.
Claim 21
Dependent Claim
34 words
A rectifier arrangement as set forth in claim 15, wherein said support member comprises a first unit (108) constituting a diode mounting and a second member (106a) constituting a heat sink and mounting support.
Claim 22
Dependent Claim
17 words
A rectifier arrangement as set forth in claim 15, further comprising a protective covering for said diodes.
Claim 23
Dependent Claim
17 words
A rectifier arrangement as set forth in claim 20, wherein said protective covering is an insulating lacquer.
Claim 24
Dependent Claim
19 words
A rectifier arrangement as set forth in claim 20, wherein said protective covering is an insulating potting compound (110).
Claim 25
Dependent Claim
26 words
A rectifier arrangement as set forth in claim 14, wherein said AC generator has a bearing plate; and wherein said bearing plate constitutes said heat sink.
Claim 26
Dependent Claim
47 words
A semiconductor arrangement as set forth in claim 1, further comprising sheathing means (16) connected to said base member for forming with said base member a housing surrounding said first semiconductor elements; and wherein said electrical conductor means (15) is insulated from said sheathing and passes therethrough.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-11-30 | 1985-06-01 | 1985-12-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-11-30 | 1989-06-01 | 1989-12-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-11-30 | 1993-06-01 | 1993-12-01 | $7700.00 | Window Closed / Lapsed |