Patent US4259564A successfully refreshed from Google Patents.
US4259564A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated thermal printing head and method of manufacturing the same
Assignee: NEC Corp
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Filing: 1979-08-15
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Granted: 1981-03-31
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Expires: 1999-08-15
Abstract
Abstract A thermal printing head having a heating resistor prepared according to a thin-film technique and a wiring circuit prepared according to a thick-film technique achieves a high printing quality at a low cost. A thin-film resistor is formed on a heat-insulating dielectric layer which is, in turn, provided partially on a dielectric substrate, while thick-film lead electrodes, which are connected to a driving circuit, are formed on the dielectric substrate so as to make contact with the edge portion of the heat-insulating dielectric layer. Thin-film lead electrodes electrically connect the thick-film lead electrodes to the opposite ends of the thin-film resistor. The heat-insulating dielectric layer and the thick-film lead electrodes are provided by means of thick-film technique such as screen-printing and succeeding firing processes and the thin-film resistor and the thin-film lead electrodes are formed through thin-film technique such as sputtering or vacuum-evaporating process.
Inventors
- 👤 Toshio Ohkubo
- 👤 Hidehiko Katoh
- 👤 Yuji Kajiwara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 12:04
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/315; B41J2/32; B41J2/335; B41J2/33505; B41J2/3351; B41J2/33525; B41J2/33555; B41J2/3357; B41J2/3359; H; H05; H05K; H05K1/00; H05K1/16; H05K1/167
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
93 words
A thermal printing head comprising: a dielectric substrate; a plurality of thick-film lead electrode layers formed on said substrate and spaces from each other; an insulative layer means of low thermal conductive material filling spaces between said thick-film electrode layers; thin-film resistive layers formed on said insulative layer means; thin-film lead electrode layers formed on said insulative layer means and electrically connected to said thick-film lead electrode layers and the opposite ends of said resistive layers, respectively; and a protective dielectric layer formed over said resistive layers and said thin-film lead electrode layers.
Claim 2
Dependent Claim
93 words
A thermal printing head comprising: a dielectric substrate; a plurality of thick-film lead electrode layers formed on said substrate and spaces from each other; an insulative layer means of low thermal conductive material filling spaces between said thick-film electrode layers; thin-film resistive layers formed on said insulative layer means; thin-film lead electrode layers formed on said insulative layer means and electrically connected to said thick-film lead electrode layers and the opposite ends of said resistive layers, respectively; and a protective dielectric layer formed over said resistive layers and said thin-film lead electrode layers.
Claim 3
Dependent Claim
36 words
A thermal printing head as set forth in claim 1, wherein said substrate includes on its surface another insulative layer of low thermal conductive material having a softnening point higher than that of said insulating means.
Claim 4
Dependent Claim
170 words
A thermal printing head comprising: a first thick-film heat insulating layer laid over the flat main surface of an insulating substrate, said heat-insulating layer being made of glass ceramic of a high softening point; at least two sets of thick-film lead electrodes, one of said sets including two opposed thick-film lead electrodes provided over said first heat-insulating layer; a second thick-film heat-insulating layer having a thickness near that of said thick-film lead electrodes and made of glass having a softening point lower than that of said first heat-insulating layer so as to provide flat top surface, said second thick-film heat-insulating layer being positioned between said opposed thick-film lead electrodes; thin-film heating resistors provided on said second heat-insulating layer in number commensurate with the number of sets of said thick-film lead electrodes; a thin-film lead electrode electrically connecting the opposite ends of said heating resistor to said thick-film lead electrodes; and oxidation-preventive film covering said thin-film resistors and said thin-film lead electrodes; and a protective layer coated over said oxidation-preventive film.
Claim 5
Dependent Claim
170 words
A thermal printing head comprising: a first thick-film heat insulating layer laid over the flat main surface of an insulating substrate, said heat-insulating layer being made of glass ceramic of a high softening point; at least two sets of thick-film lead electrodes, one of said sets including two opposed thick-film lead electrodes provided over said first heat-insulating layer; a second thick-film heat-insulating layer having a thickness near that of said thick-film lead electrodes and made of glass having a softening point lower than that of said first heat-insulating layer so as to provide flat top surface, said second thick-film heat-insulating layer being positioned between said opposed thick-film lead electrodes; thin-film heating resistors provided on said second heat-insulating layer in number commensurate with the number of sets of said thick-film lead electrodes; a thin-film lead electrode electrically connecting the opposite ends of said heating resistor to said thick-film lead electrodes; and oxidation-preventive film covering said thin-film resistors and said thin-film lead electrodes; and a protective layer coated over said oxidation-preventive film.
Claim 6
Dependent Claim
256 words
An integrated thermal printing head, comprising: a dielectric substrate having a flat main surface; a heat insulating dielectric layer formed in part of a region of said main surface; at least two first thick-film lead electrodes screen-printed on said substrate in opposed relation on one side of said heat insulating layer region; a dielectric layer for use in a matrix wiring, which is formed on said substrate so as to coat the ends of said first lead electrodes on the other side; at least two second thick-film lead electrodes screen-printed on said dielectric layer for said matrix wiring, in a manner to connect with said first respective lead electrodes through a through-hole provided in said dielectric layer for said matrix wiring; at least two third thick-film lead electrodes screen-printed on said substrate in opposed relation to the other side of said heat insulating layer; a common, electrically conductive layer formed on said substrate in a manner to electrically connect with said third lead electrodes; at least two thin-film resistors formed on said heat insulating dielectric layer in a manner to provide a spacing smaller than that of the arrangement of said first and third thick-film lead electrodes with reference to the center line thereof; and, at least two first thin film lead electrodes which electrically connect the ends of said respective resistors on one side, to said first respective lead electrodes; and at least two second thin film lead electrodes which electrically connect the other ends of said respective resistors to said third respective lead electrodes.
Claim 7
Dependent Claim
256 words
An integrated thermal printing head, comprising: a dielectric substrate having a flat main surface; a heat insulating dielectric layer formed in part of a region of said main surface; at least two first thick-film lead electrodes screen-printed on said substrate in opposed relation on one side of said heat insulating layer region; a dielectric layer for use in a matrix wiring, which is formed on said substrate so as to coat the ends of said first lead electrodes on the other side; at least two second thick-film lead electrodes screen-printed on said dielectric layer for said matrix wiring, in a manner to connect with said first respective lead electrodes through a through-hole provided in said dielectric layer for said matrix wiring; at least two third thick-film lead electrodes screen-printed on said substrate in opposed relation to the other side of said heat insulating layer; a common, electrically conductive layer formed on said substrate in a manner to electrically connect with said third lead electrodes; at least two thin-film resistors formed on said heat insulating dielectric layer in a manner to provide a spacing smaller than that of the arrangement of said first and third thick-film lead electrodes with reference to the center line thereof; and, at least two first thin film lead electrodes which electrically connect the ends of said respective resistors on one side, to said first respective lead electrodes; and at least two second thin film lead electrodes which electrically connect the other ends of said respective resistors to said third respective lead electrodes.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-03-30 | 1984-09-29 | 1985-03-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-03-30 | 1988-09-29 | 1989-03-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-03-30 | 1992-09-29 | 1993-03-31 | $7700.00 | Window Closed / Lapsed |