Patent US4249941A successfully refreshed from Google Patents.
US4249941A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper base alloy for leads of integrated circuit
Assignee: Mitsubishi Shindoh Co Ltd
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Filing: 1979-11-13
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Granted: 1981-02-10
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Expires: 1999-11-13
Abstract
Abstract A copper base alloy for leads of an integrated circuit consisting essentially of from 0.5 to 1.5% by weight of iron, from 0.5 to 1.5% by weight of tin, from 0.01 to 0.35% by weight of phosphorus, and the balance of copper and inevitable impurities. Said alloy possesses satisfactory properties which are required of leads of integrated circuits.
Inventors
- 👤 Rensei Futatsuka
- 👤 Tadao Sakakibara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 15:56
CPC Classifications
C; C22; C22C; C22C9/00; C22C9/02
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
45 words
A copper base alloy for leads of an integrated circuit, which consists of from 0.5 to 1.5% by weight of iron, from 0.5 to 1.5% by weight of tin, from 0.01 to 0.35% by weight of phosphorus, and the balance of copper and inevitable impurities.
Claim 2
Dependent Claim
45 words
A copper base alloy for leads of an integrated circuit, which consists of from 0.5 to 1.5% by weight of iron, from 0.5 to 1.5% by weight of tin, from 0.01 to 0.35% by weight of phosphorus, and the balance of copper and inevitable impurities.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-02-10 | 1984-08-11 | 1985-02-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-02-10 | 1988-08-11 | 1989-02-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-02-10 | 1992-08-11 | 1993-02-10 | $7700.00 | Window Closed / Lapsed |