Patent US4226281A successfully refreshed from Google Patents.
US4226281A
Expired / Lapsed
US
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Thermal conduction module
Assignee: International Business Machines Corp
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Filing: 1979-06-11
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Granted: 1980-10-07
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Expires: 1999-06-11
Abstract
Abstract A matrix of small diameter holes are located in the module housing adjacent each of the integrated circuit chips to be cooled. A pin or rod is located in each of the holes and extends therefrom into contact with the exposed surface of the chip. A spring means is located between the housing and the pin to provide a predetermined spring loading of the pin-piston against the exposed surface of the chip. A header is located at the outer end of the pin-piston in contact with the exposed surface of the chip thereby, providing multiple pin-piston contact with the exposed surface of the chip regardless of the chip tilt which improves the heat transfer. The heat transfer can be controlled by including or removing pin-pistons in accordance with the heat transfer desired.
Inventors
- 👤 Richard C. Chu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 16:49
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/774; H10W40/40; H10W40/47
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
147 words
In a thermal conduction module for providing cooling of one or more integrated circuit chips having an exposed surface comprising: a housing having a surface adjacent the exposed surface of said circuit chips; a plurality of cylindrical openings adjacent each chip extending into said housing from the surface facing said circuit chips; a plurality of pin-pistons, one located in each of said plurality of cylindrical openings adjacent each chip and extending therefrom into contact with the exposed surface of said circuit chip; a spring means located between said housing and each of said pin-pistons to provide a predetermined spring loading force of said pin-piston against the exposed chip surface; and header means located at the outer end of each of said pin-pistons in contact with the exposed chip surface; said pin-pistons contacting the exposed chip surface even when the chip is tilted thereby providing improved heat transfer.
Claim 2
Dependent Claim
147 words
In a thermal conduction module for providing cooling of one or more integrated circuit chips having an exposed surface comprising: a housing having a surface adjacent the exposed surface of said circuit chips; a plurality of cylindrical openings adjacent each chip extending into said housing from the surface facing said circuit chips; a plurality of pin-pistons, one located in each of said plurality of cylindrical openings adjacent each chip and extending therefrom into contact with the exposed surface of said circuit chip; a spring means located between said housing and each of said pin-pistons to provide a predetermined spring loading force of said pin-piston against the exposed chip surface; and header means located at the outer end of each of said pin-pistons in contact with the exposed chip surface; said pin-pistons contacting the exposed chip surface even when the chip is tilted thereby providing improved heat transfer.
Claim 3
Dependent Claim
41 words
In a thermal conduction module according to claim 1, wherein said plurality of cylindrical openings extend sufficiently far into said housing so that the spring loaded pin-piston does not abut the opening inner end surface when engaged by said spring means.
Claim 4
Dependent Claim
44 words
In a thermal conduction module according to claim 1, wherein said plurality of cylindrical openings are of a large enough diameter and said pin-pistons are of a small enough diameter to fit into said cylindrical openings with a minimum pin-piston cylindrical opening wall gap.
Claim 5
Dependent Claim
28 words
In a thermal conduction module according to claim 1, wherein said housing and said pin-pistons are made of a good heat conducting material such as copper or aluminum.
Claim 6
Dependent Claim
50 words
In a thermal conduction module according to claim 1, wherein said spring means is a coil spring having one end mounted against the back side of said header means and the other end bearing against said housing when said exposed chip surface is contacted by the end of said pin-piston.
Claim 7
Dependent Claim
46 words
In a thermal conduction module according to claim 1, wherein said spring means comprises a plurality of leaf springs having sufficient resiliency to apply the desired force of said pin-piston against said chip surface when located lengthwise between the back of said header and said housing.
Claim 8
Dependent Claim
46 words
In a thermal conduction module according to claim 1, wherein said cylindrical openings are located in a matrix within said housing opposite each of said chips such that said pin-pistons when mounted therein contact said chip surface at evenly spaced positions over the entire chip surface.
Claim 9
Dependent Claim
50 words
In a thermal conduction module according to claim 1, wherein said header means is a flat square head at the end of and orthogonal to said pin-piston longitudinal center line, said head covering the maximum area of said exposed surface of said chip limited by the density of said pin-pistons.
Claim 10
Dependent Claim
45 words
In a thermal conduction module according to claim 1, wherein said header means comprises a head at the end of said pin-piston having a crowned outer surface to give the same area contact of said head with said chip exposed surface regardless of chip tilt.
Claim 11
Dependent Claim
29 words
In a thermal conduction module according to claim 1, wherein preselected pin-pistons are not included in said cylindrical openings thereby providing a control means for the amount of cooling.
References Cited (Backward Citations)
US3128419A
Cited
US3387191A
Cited
US3390717A
Cited
US3993123A
Cited
US4156458A
Cited
US4153107A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-10-07 | 1984-04-07 | 1984-10-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-10-07 | 1988-04-07 | 1988-10-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-10-07 | 1992-04-07 | 1992-10-07 | $7700.00 | Window Closed / Lapsed |