Water soluble photosensitive resin compositions comprising a polyamide or its salt

Claim 2

A water-soluble photosensitive resin composition which comprises a polyamide or its ammonium salt having recurring amide groups in the main chain thereof and basic nitrogen atoms in the main or side chain thereof, from 5 to 150% by weight with respect to said polyamide or its ammonium salt of a photopolymerizable unsaturated monomer and from 0.01 to 5% by weight with respect to the total amount of said polyamide or its ammonium salt and the photopolymerizable unsaturated monomer, of a photosensitizer, said polyamide being prepared by the polycondensation of starting monomers comprising from 10 to 100 mol % of a compound having the following formula: ##STR9## wherein R is a hydrogen atom or a hydrocarbon group, R 1 a and R 2 a are each an alkylene group, and A and B are each --NH 2 , --COOH or --COOR" wherein R" is a hydrocarbon group, said ammonium salt being prepared by the treatmnt of said polyamide with a protonic acid, a quaternizing agent or an epoxy compound and a protonic acid.

Claim 3

The photosensitive resin composition according to claim 1, wherein said polyamide is prepared by the polycondensation of the starting monomer of the formula (II) wherein A and B are each --NH 2 with a dicarboxylic acid.

Claim 4

The photosensitive resin composition according to claim 1, wherein A and B are each --NH 2 .

Claim 5

The photosensitive resin composition according to claim 3, wherein said starting monomer is N,N-bis(3-aminopropyl)methylamine.

Claim 6

The photosensitive resin composition according to claim 2, wherein said dicarboxylic acid is adipic acid.

Claim 7

The photosensitive resin composition according to claim 1, wherein the amount of the photopolymerizable unsaturated monomer in said composition is from 10 to 100% by weight with respect to said polyamide or its ammonium salt.

Claim 8

The photosensitive resin composition according to claim 1, wherein the amount of the photosensitizer in said composition is from 0.1 to 2% by weight with respect to the total amount of said polyamide or its ammonium salt and the photopolymerizable unsaturated monomer.

Claim 9

The photosensitive resin composition according to claim 1, which further comprises a thermal polymerization inhibitor in an amount of not more than 2% by weight with respect to the total amount of said polyamide or its ammonium salt and the photopolymerizable unsaturated monomer.

Claim 10

A shaped photosensitive material developable with water comprising the photosensitive resin composition according to claim 1.

Claim 11

The photosensitive material according to claim 9, which is shaped in a sheet.

Claim 12

The photosensitive material according to claim 9, which comprises a layer of said photosensitive resin composition and a support therefor.

Claim 13

The photosensitive material according to claim 9, which is used as a photosensitive printing plate.

Claim 14

The photosensitive resin composition according to claim 1, wherein said starting monomer is N,N-bis(3-aminopropyl)isopropylamine.

Claim 15

In a photosensitive resin composition comprising a polyamide having recurring amide groups in the main chain and prepared through the step of polycondensation of one or more of dicarboxylic acids, diamines, ω-amino acids and lactams as the starting monomers under the condition that the carboxyl groups and the amino groups therein are substantially in equivalent amounts, from 5 to 150% by weight with respect to said polyamide of a photopolymerizable unsaturated monomer and from 0.01 to 5% by weight with respect to the total amount of said polyamide and the photopolymerizable unsaturated monomer of a photosensitizer, the improvement wherein the starting monomers comprise a compound having the following formula: ##STR10## wherein R is a hydrogen atom or a hydrocarbon group, R 1 a and R 2 a are each an alkylene group, and A and B are each --NH 2 , --COOH or --COOR" wherein R" is a hydrocarbon group, in an amount of from 10 to 100 mol % of the starting monomers, so that the polyamide has basic nitrogen atoms in the main or side chain thereof and is water-soluble, whereby the photosensitive resin composition is made substantially water-soluble.

Claim 16

In a photosensitive resin composition comprising a polyamide having recurring amide groups in the main chain and prepared through the step of polycondensation of one or more of dicarboxylic acids, diamines, ω-amino acids and lactams as the starting monomers under the condition that the carboxyl groups and the amino groups therein are substantially in equivalent amounts, from 5 to 150% by weight with respect to said polyamide of a photopolymerizable unsaturated monomer and from 0.01 to 5% by weight with respect to the total amount of said polyamide and the photopolymerizable unsaturated monomer of a photosensitizer, the improvement wherein the starting monomers comprise a compound having the following formula: ##STR10## wherein R is a hydrogen atom or a hydrocarbon group, R 1 a and R 2 a are each an alkylene group, and A and B are each --NH 2 , --COOH or --COOR" wherein R" is a hydrocarbon group, in an amount of from 10 to 100 mol % of the starting monomers, so that the polyamide has basic nitrogen atoms in the main or side chain thereof and is water-soluble, whereby the photosensitive resin composition is made substantially water-soluble.

Claim 17

The composition according to claim 14, wherein A and B are each --NH 2 .

Claim 18

The composition according to claim 15, wherein said starting monomer is N,N-bis(3-aminopropyl)isopropylamine.

Claim 19

The composition according to claim 14, wherein the compound of the formula (II) is N,N-bis(3-aminopropyl)methylamine.

Claim 20

The composition according to claim 17, wherein the N,N-bis(3-aminopropyl)methylamine is used in the form of the adipate.

Claim 21

Thecomposition according to claim 3, wherein the polyamide is present in an ammonium salt form.

Claim 22

The composition according to claim 19, wherein the ammonium salt form is prepared by treatment of the corresponding polyamide in a free form with a protonic acid, a quaternizing agent or an epoxy compound and a protonic acid.