Water soluble photosensitive resin composition comprising a polyamide or its ammonium salt

Claim 2

A water-soluble photosensitive resin composition which comprises a polyamide or its ammonium salt having recurring amide groups in the main chain thereof and basic nitrogen atoms in the main or side chain thereof, from 5 to 150% by weight with respect to said polyamide or its ammonium salt of a photopolymerizable unsaturated monomer and from 0.1 to 5% by weight with respect to the total amount of said polyamide or its ammonium salt and the photopolymerizable unsaturated monomer, of a photosensitizer, said polyamide being prepared by the polycondensation of starting monomers comprising from 10 to 100 mol % of a compound having the following formula: ##STR9## wherein R and R' are each a hydrogen atom or a hydrocarbon group, R 1 a and R 2 a are each an alkylene group, and A and B are each --NH 2 , --COOH or --COOR" wherein R" is a hydrocarbon group, and in which the group --R 2 a --B may represent a hydrogen atom, and said ammonium salt being prepared by the treatment of said polyamide with a protonic acid, a quaternizing agent or an epoxy compound and a protonic acid.

Claim 3

The photosensitive resin composition according to claim 1, wherein said starting monomer is the one of the formula (I), wherein A and B are each --NH 2 .

Claim 4

The photosensitive resin composition according to claim 1, wherein said starting monomer is N,N'-bis(γ-aminopropyl)piperazine.

Claim 5

The photosensitive resin composition according to claim 3, wherein N,N'-bis(γ-aminopropyl)piperazine is used in the form of adipate.

Claim 6

The photosensitive resin composition according to claim 1, wherein the amount of the photopolymerizable unsaturated monomer in said composition is from 10 to 100% by weight with respect to said polyamide or its ammonium salt.

Claim 7

The photosensitive resin composition according to claim 1, wherein the amount of the photosensitizer in said composition is from 0.1 to 2% by weight with respect to the total amount of said polyamide or its ammonium salt and the photopolymerizable unsaturated monomer.

Claim 8

The photosensitive resin composition according to claim 1, which further comprises a thermal polymerization inhibitor in an amount of not more than 2% by weight with respect to the total amount of said polyamide or its ammonium salt and the photopolymerizable unsaturated monomer.

Claim 9

A shaped photosensitive material developable with water comprising the photosensitive resin composition according to claim 1.

Claim 10

The photosensitive material according to claim 8, which is shaped in a sheet.

Claim 11

The photosensitive material according to claim 8, which comprises a layer of said photosensitive resin composition and a support therefor.

Claim 12

The photosensitive material according to claim 8, which is used as a photosensitive printing plate.

Claim 13

In a photosensitive resin composition comprising a polyamide having recurring amide groups in the main chain and prepared through the step of polycondensation of one or more of dicarboxylic acids, diamines, ω-amino acids and lactams as the starting monomers under the condition that the carboxyl groups and the amino groups therein are substantially in equivalent amounts, from 5 to 150% by weight with respect to said polyamide of a photopolymerizable unsaturated monomer and from 0.01 to 5% by weight with respect to the total amount of said polyamide and the photopolymerizable unsaturated monomer of a photosensitizer, an improvement wherein the starting monomers comprise at least one compound of the formula: ##STR10## wherein R and R' are each a hydrogen atom or a hydrocarbon group, R 1 a and R 2 a are each an alkylene group, and A and B are each --NH 2 , --COOH or --COOR" wherein R" is a hydrocarbon group, and in which the group --R 2 a --B may represent a hydrogen atom, in an amount of from 10 to 100 mol % of the starting monomers, so that the polyamide has basic nitrogen atoms in the main or side chain thereof and is water-soluble, whereby the photosensitive resin composition is made substantially water-soluble.

Claim 14

In a photosensitive resin composition comprising a polyamide having recurring amide groups in the main chain and prepared through the step of polycondensation of one or more of dicarboxylic acids, diamines, ω-amino acids and lactams as the starting monomers under the condition that the carboxyl groups and the amino groups therein are substantially in equivalent amounts, from 5 to 150% by weight with respect to said polyamide of a photopolymerizable unsaturated monomer and from 0.01 to 5% by weight with respect to the total amount of said polyamide and the photopolymerizable unsaturated monomer of a photosensitizer, an improvement wherein the starting monomers comprise at least one compound of the formula: ##STR10## wherein R and R' are each a hydrogen atom or a hydrocarbon group, R 1 a and R 2 a are each an alkylene group, and A and B are each --NH 2 , --COOH or --COOR" wherein R" is a hydrocarbon group, and in which the group --R 2 a --B may represent a hydrogen atom, in an amount of from 10 to 100 mol % of the starting monomers, so that the polyamide has basic nitrogen atoms in the main or side chain thereof and is water-soluble, whereby the photosensitive resin composition is made substantially water-soluble.

Claim 15

The improvement according to claim 12, wherein the polyamide is present in an ammonium salt form.

Claim 16

The improvement according to claim 13, wherein the ammonium salt form is prepared by treatment of the corresponding polyamide in a free form with a protonic acid, a quaternizing agent or an epoxy compound and a protonic acid.

Claim 17

The improvement according to claim 12, wherein the compound (I) is N,N'-bis(ω-aminopropyl)piperazine.

Claim 18

The improvement according to claim 15, wherein the N,N'-bis(ω-aminopropyl)piperazine is used in an adipate form.