Patent US4214966A successfully refreshed from Google Patents.
US4214966A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process useful in the fabrication of articles with metallized surfaces
Assignee: AT&T Inc
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Filing: 1979-03-20
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Granted: 1980-07-29
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Expires: 1999-03-20
Abstract
Abstract A method has been devised for metallizing a desired area on a substrate during the manufacture of semiconductor devices. This process includes the steps of depositing a material such as a polymer resist on the substrate to delineate the area to be metallized. Then a suitable metal is deposited onto the coated substrate leaving a metallic film on both the exposed area of the substrate and on the delineating material. This metallic film is then substantially removed only from the delineating material by a technique which includes ion milling at an acute angle to the plane of the substrate. Conventional techniques are then employed to remove the delineating material.
Inventors
- 👤 Gerard E. Mahoney
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:47
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/061; H10D30/0612; C; C23; C23C; C23C14/00; C23C14/04; C23C14/042; H10P; H10P50/00; H10P50/20; H10P50/26; H10P50/262; H10P76/00; H10P76/20; H10P76/202; Y; Y10; Y10S; Y10S148/00; Y10S148/10; Y10S438/00; Y10S438/942; Y10S438/948; Y10S438/951
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
108 words
A process for depositing metallic material to form a metallic layer on a prescribed area of a substrate comprising the steps of masking the regions of said substrate bounding said area with a delineating material, depositing said metallic material, and removing said delineating material with its coating of said metallic material from said substrate CHARACTERIZED IN THAT the method of removing said delineating material comprises the step of removing at least a portion of said metallic material deposited on said delineating material by ion milling said deposited metallic material at an acute angle to said substrate such that said metallic layer on said prescribed area is substantially unaffected.
Claim 2
Dependent Claim
108 words
A process for depositing metallic material to form a metallic layer on a prescribed area of a substrate comprising the steps of masking the regions of said substrate bounding said area with a delineating material, depositing said metallic material, and removing said delineating material with its coating of said metallic material from said substrate CHARACTERIZED IN THAT the method of removing said delineating material comprises the step of removing at least a portion of said metallic material deposited on said delineating material by ion milling said deposited metallic material at an acute angle to said substrate such that said metallic layer on said prescribed area is substantially unaffected.
Claim 3
Dependent Claim
20 words
The process of claim 1 wherein said deposited metallic material comprises successively deposited layers of platinum, titanium, platinum, and gold.
Claim 4
Dependent Claim
18 words
The process of claim 1 wherein said acute angle is in the range 30 degrees to 8 degrees.
Claim 5
Dependent Claim
11 words
The process of claim 1 wherein said substrate is gallium arsenide.
Claim 6
Dependent Claim
20 words
The process of claim 4 wherein said deposited metallic material includes successively deposited layers of platinum, titanium, platinum, and gold.
Claim 7
Dependent Claim
13 words
The process of claim 1 wherein said delineating material is a polymeric resist.
Claim 8
Dependent Claim
13 words
The process of claim 6 wherein said polymeric resist is a photolithographic resist.
Claim 9
Dependent Claim
18 words
The process of claim 6 including the removal of said delineating material after said ion milling by solvation.
Claim 10
Dependent Claim
25 words
The process of claim 1 wherein said acute angle is sufficiently small to prevent any removal of said metallic layer deposited on said prescribed area.
Claim 11
Dependent Claim
14 words
The process of claim 1 wherein said acute angle is less than 80 degrees.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-07-29 | 1984-01-28 | 1984-07-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-07-29 | 1988-01-28 | 1988-07-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-07-29 | 1992-01-28 | 1992-07-29 | $7700.00 | Window Closed / Lapsed |