Patent US4213141A successfully refreshed from Google Patents.
US4213141A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hybrid transistor
Assignee: Allegro Microsystems LLC
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Filing: 1978-05-12
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Granted: 1980-07-15
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Expires: 1998-05-12
Abstract
Abstract A semiconductor device which provides in an input circuit a substantially low reactance and a relatively high resistance within a range of operating frequencies to improve the impedance match between the device and an energy source. The device has a semiconductor die with at least a first and a second bonding terminal having capacitance and resistance between the bonding terminals. At least a first bond lead electrically connects the first bonding terminal to a first metallic contact area. Means connects at least a second bond lead between the second bonding terminal and a second metallic contact area. At least a third bond lead electrically connects the first bonding terminal to the second metallic contact area to form an inductance to interact with the capacitance of the semiconductor die within the operating range of frequencies thereby to increase the input impedance.
Inventors
- 👤 Elio J. Colussi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 14:26
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W44/226; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5445; H10W72/59; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
173 words
A semiconductor device to provide in an input circuit a substantially low reactance and a relatively high resistance within a range of operating frequencies to improve the impedance match between the semiconductor device and an energy source comprising an electrically insulating body member, said body member having disposed thereon an input and an additional metallic contact area in an electrically insulated and spaced relationship with each other, a semiconductor die disposed on the body member and having at least an input and a common bonding terminal having capacitance and resistance between said bonding terminals, at least a first bond lead electrically connecting said input bonding terminal to said input metallic contact area, means connecting at least a second bond lead between said common bonding terminal and said additional metallic contact area, and at least a third bond lead electrically connecting said input bonding terminal to said additional metallic contact area forming an inductance to interact with said capacitance of said semiconductor die within the operating range of frequencies for increasing the input impedance.
Claim 2
Dependent Claim
173 words
A semiconductor device to provide in an input circuit a substantially low reactance and a relatively high resistance within a range of operating frequencies to improve the impedance match between the semiconductor device and an energy source comprising an electrically insulating body member, said body member having disposed thereon an input and an additional metallic contact area in an electrically insulated and spaced relationship with each other, a semiconductor die disposed on the body member and having at least an input and a common bonding terminal having capacitance and resistance between said bonding terminals, at least a first bond lead electrically connecting said input bonding terminal to said input metallic contact area, means connecting at least a second bond lead between said common bonding terminal and said additional metallic contact area, and at least a third bond lead electrically connecting said input bonding terminal to said additional metallic contact area forming an inductance to interact with said capacitance of said semiconductor die within the operating range of frequencies for increasing the input impedance.
Claim 3
Dependent Claim
34 words
The semiconductor device of claim 1 in which said at least input and common bonding terminals comprise respectively sets of input common bonding terminals having capacitance and resistance between said sets of bonding terminals.
Claim 4
Dependent Claim
36 words
The semiconductor device of claim 2 in which said at least a first bond lead comprises a set of first bond leads electrically connecting said set of input bonding terminals to said input metallic contact area.
Claim 5
Dependent Claim
47 words
The semiconductor device of claim 3 in which said at least a second bond lead comprises a set of second bond leads, said connecting means couples at least said set of common bond leads between said set of second bonding terminals and said additional metallic contact area.
Claim 6
Dependent Claim
36 words
The semiconductor device of claim 4 in which said at least a third bond lead comprises a set of third bond leads electrically connecting said set of input bonding terminals to said additional metallic contact area.
Claim 7
Dependent Claim
16 words
The semiconductor device of claim 1 in which semiconductor die comprises an RF power transistor die.
Claim 8
Dependent Claim
45 words
The semiconductor device of claim 6 in which there is provided a further metallic contact area in electrically insulated and spaced relationship with said input and additional metallic contact areas, said transistor die having a third bonding terminal coupled to said third metallic contact area.
Claim 9
Dependent Claim
26 words
The semiconductor device of claim 1 in which said connecting means includes a direct connection between said second bond lead and said additional metallic contact area.
Claim 10
Dependent Claim
40 words
The semiconductor device of claim 1 in which said connecting means includes a capacitor having a first capacitor contact area forming said additional metallic contact area and having a second capacitor contact area directly coupled to said second bond lead.
Claim 11
Dependent Claim
39 words
The semiconductor device of claim 7 in which said input, additional and further metallic contact areas are respectively base, emitter and collector contact areas and said input and common bonding terminals are respectively said base and emitter bonding terminals.
Claim 12
Independent Claim
173 words
The method of making a semiconductor device having a body member and having in an input circuit a substantially low reactance and a relatively high resistance within a range of operating frequencies to improve the impedance match between the semiconductor device and an energy source which comprises the steps of (a) disposing on the body member an input and an additional metallic contact area in an electrically insulated spaced relationship with each other, (b) positioning a semiconductor die on the body member having at least an input and a common bonding terminal with capacitance and resistance between the bonding terminals, (c) electrically connecting at least a first bond connector between the input bonding terminal and the input metallic contact area, (d) electrically connecting at least a second bond connector between the common bonding terminal and the additional metallic contact area, and (e) electrically connecting the input and additional bonding terminals forming an inductance to interact with the capacitance of the semiconductor die within the operating range of frequencies for increasing the input impedance.
Claim 13
Independent Claim
173 words
The method of making a semiconductor device having a body member and having in an input circuit a substantially low reactance and a relatively high resistance within a range of operating frequencies to improve the impedance match between the semiconductor device and an energy source which comprises the steps of (a) disposing on the body member an input and an additional metallic contact area in an electrically insulated spaced relationship with each other, (b) positioning a semiconductor die on the body member having at least an input and a common bonding terminal with capacitance and resistance between the bonding terminals, (c) electrically connecting at least a first bond connector between the input bonding terminal and the input metallic contact area, (d) electrically connecting at least a second bond connector between the common bonding terminal and the additional metallic contact area, and (e) electrically connecting the input and additional bonding terminals forming an inductance to interact with the capacitance of the semiconductor die within the operating range of frequencies for increasing the input impedance.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-07-15 | 1984-01-14 | 1984-07-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-07-15 | 1988-01-14 | 1988-07-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-07-15 | 1992-01-14 | 1992-07-15 | $7700.00 | Window Closed / Lapsed |