Patent US4212959A successfully refreshed from Google Patents.
US4212959A
Expired / Lapsed
US
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Heat resistant resin composition
Assignee: Mitsubishi Electric Corp
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Filing: 1978-05-09
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Granted: 1980-07-15
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Expires: 1998-05-09
Abstract
Abstract A heat resistant resin composition comprises 100 wt. parts of a mixture [I] and 0 to 10 wt. parts of a phenoxy resin [II] wherein the mixture [I] comprises 80 to 5 wt. parts of (a) a mixture of 0 to 95 wt. parts of the first maleimide compound obtained by reacting an aromatic amine with maleic anhydride and/or a maleic anhydride derivative and 100 to 5 wt. parts of the second maleimide obtained by reacting an aromatic amine with a cyclic acid anhydride having no unsaturated double bond and maleic anhydride and/or a maleic anhydride derivative and 20 to 95 wt. parts of (b) and epoxy resin.
Inventors
- 👤 Akira Fukami
- 👤 Hiroyuki Nakajima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 04:30
CPC Classifications
C; C08; C08L; C08L79/00; C08L79/04; C08L79/08; C08L79/085; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/4007; C08G59/4014; C08G59/4042; C08L63/00; Y; Y10; Y10S; Y10S525/00; Y10S525/93
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
248 words
A heat resistant resin composition, comprising: (a) 80 to 5 parts by weight of a mixture of (i) 0 to 95 parts by weight of a first maleimide compound selected from the group consisting of ##STR11## wherein R 1 is alkyl, R 2 is a monovalent organic group, R 3 is a divalent organic group and n is an average of 0.5 to 5 and (ii) 100 to 5 parts by weight of a second maleimide compound formed by reacting an aromatic amine selected from the group consisting of aniline, o-toluidine, p-toluidine, chloroaniline, bromoaniline, aminochlorotoluene, aminoxylene, aminoethylbenzene, aminodiphenylether, aminodiphenylsulfone, aminodiphenylester, aminodiphenylsulfide, ##STR12## wherein R 4 and R 5 represent alkyl, chlorine or bromine; Z is alkylene, --O--,--NH--, --S--, --SO 2 --, --COO--, --CONH--, --OCOO-- or --COOCO--; k+1 represents an integer of 1 to 4 and m and n each represents 0 or an integer of 1 to 5 and mixtures thereof with a maleic anhydride compound of the formula: ##STR13## wherein R 1 is hydrogen or alkyl and a cyclic anhydride compound of the formula: ##STR14## wherein R 6 is ##STR15## the weight ratio of said maleic anhydride compound to said cyclic anhydride compound ranging from 2:8 to 8:2 and the amounts of said aromatic amine and maleic anhydride compound and cyclic anhydride being such that the total amount of anhydride is the stoichiometric amount necessary to react with the amino groups of said aromatic amine; and (b) 20 to 95 parts by weight of a diepoxy compound.
Claim 2
Dependent Claim
248 words
A heat resistant resin composition, comprising: (a) 80 to 5 parts by weight of a mixture of (i) 0 to 95 parts by weight of a first maleimide compound selected from the group consisting of ##STR11## wherein R 1 is alkyl, R 2 is a monovalent organic group, R 3 is a divalent organic group and n is an average of 0.5 to 5 and (ii) 100 to 5 parts by weight of a second maleimide compound formed by reacting an aromatic amine selected from the group consisting of aniline, o-toluidine, p-toluidine, chloroaniline, bromoaniline, aminochlorotoluene, aminoxylene, aminoethylbenzene, aminodiphenylether, aminodiphenylsulfone, aminodiphenylester, aminodiphenylsulfide, ##STR12## wherein R 4 and R 5 represent alkyl, chlorine or bromine; Z is alkylene, --O--,--NH--, --S--, --SO 2 --, --COO--, --CONH--, --OCOO-- or --COOCO--; k+1 represents an integer of 1 to 4 and m and n each represents 0 or an integer of 1 to 5 and mixtures thereof with a maleic anhydride compound of the formula: ##STR13## wherein R 1 is hydrogen or alkyl and a cyclic anhydride compound of the formula: ##STR14## wherein R 6 is ##STR15## the weight ratio of said maleic anhydride compound to said cyclic anhydride compound ranging from 2:8 to 8:2 and the amounts of said aromatic amine and maleic anhydride compound and cyclic anhydride being such that the total amount of anhydride is the stoichiometric amount necessary to react with the amino groups of said aromatic amine; and (b) 20 to 95 parts by weight of a diepoxy compound.
Claim 3
Dependent Claim
35 words
The heat resistant resin composition according to claim 1, which further comprises from 0 to 10 parts by weight of a phenoxy resin incorporated in 100 parts by weight of the composition of claim 10.
Claim 4
Dependent Claim
26 words
The heat resistant resin composition according to claim 1 or 2 wherein said aromatic amine is a mixture of an aromatic monoamine and an aromatic polyamine.
Claim 5
Dependent Claim
25 words
The heat resistant resin composition according to claim 1 or 2 wherein R 2 represents an alkyl, aryl, aralkyl or haloalkyl, haloaryl or haloaralkyl group.
Claim 6
Dependent Claim
21 words
The heat resistant resin composition according to claim 1 or 2 wherein R 3 represents an alkylene, arylene or aralkylene group.
Claim 7
Dependent Claim
25 words
The heat resistant resin composition according to claim 1 or 2, wherein the second maleimide compound has average 0.5 to 3.0 maleimido group per molecule.
Claim 8
Dependent Claim
25 words
The heat resistant resin composition according to claim 1 or 2, wherein the cyclic anhydride is succinic anhydride, phthalic anhydride, hexahydrophthalic anhydride or glutaric anhydride.
Claim 9
Dependent Claim
27 words
The heat resistant resin composition according to claim 1, wherein said diepoxy compound is butadieneoxide, dimethylmethanedioxide, diglycidylether, butanedioldiglycidylether, diethyleneglycoldiglycidylether, vinylcyclohexenedioxide, divinylbenzenedioxide, bis(2,3-epoxycyclopental)ether, 3,4-epoxy-6-methylcyclohexylmethyl-3,4-epoxymethylcyclohexenecarboxylate, resorcineglycidylether, 2-glycidylphenylglycidylether or 2,6-diglycidylphenylglycidylether.
Claim 10
Dependent Claim
28 words
The heat resistant resin composition according to claim 2, wherein said phenoxy resin has the formula: ##STR16## and which has a molecular weight ranging from 10,000 to 60,000.
Claim 11
Dependent Claim
23 words
The heat resistant resin composition according to claim 1, which further comprises a hardener of the formula: ##STR17## wherein R 7 is ##STR18##
Claim 12
Dependent Claim
51 words
The heat resistant resin composition according to claim 1, wherein said diepoxy compound is a compound having a 1,2-epoxy group selected from the group consisting of epoxidized diolefins, dienes, cyclic dienes and diolefinic unsaturated carboxylic acid esters or a chained epoxy group selected from the group consisting of polyglycidylethers and polyglycidylesters.
Claim 13
Dependent Claim
43 words
The heat resistant resin composition according to claim 11, wherein said polyglycidylether is a polyglycidylether produced by condensing epichlorohydrin or β-methyl epichlorohydrin with an aliphatic diol, a polyhydric alcohol, a bis-phenol, or a phenol-novolak or a cresol-novolak resin prepared under alkaline condensation conditions.
Claim 14
Dependent Claim
30 words
The heat resistant resin composition according to claim 11, wherein said polyglycidylester is a polyglycidylester produced by reacting a dicarboxylic acid with epichlorohydrin or β-methyl epichlorohydrin under alkaline reaction conditions.
References Cited (Backward Citations)
US3177090A
Cited
US3424707A
Cited
US3637901A
Cited
DE2123638A1
Cited
US3880811A
Cited
US3839493A
Cited
US3883486A
Cited
US3875113A
Cited
JPS5013497A
Cited
US3978152A
Cited
US3985928A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-07-15 | 1984-01-14 | 1984-07-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-07-15 | 1988-01-14 | 1988-07-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-07-15 | 1992-01-14 | 1992-07-15 | $7700.00 | Window Closed / Lapsed |