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US4210472A Expired / Lapsed US ⏱️ 0.0 years remaining

Manufacturing process of semiconductor devices

Assignee: Micronas Semiconductor Holding AG
•
Filing: 1978-11-16
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Granted: 1980-07-01
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Expires: 1998-11-16
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Abstract

Abstract Process of manufacturing semiconductor devices by providing on the surface of a substrate of one conductivity at first only a covering with a doping agent of the other conductivity and then, after the building of mesas, the PN-junction is formed by diffusion in an oxidizing atmosphere whereby simultaneously a protecting SiO 2 layer is formed on the free surface of the mesa.

Inventors

  • 👤 Hans Hoffmann
  • 👤 Peter Krieger

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 10:27
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6302; H10P14/6304; H10P14/6306; H10P14/6308; H10P14/6309; H10D; H10D8/00; H10D8/422; H10P32/00; H10P32/10; H10P32/14; H10P32/1404; H10P32/17; H10P32/171; H10W; H10W74/00; H10W74/01

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 71 words
A method of manufacturing a semiconductor device comprising the steps of: coating to one conductivity type by means of a doping agent the surface layer of a semiconductor substrate of the other conductivity type whereby a PN-junction is formed; forming a mesa structure from said substrate; and diffusing in said doping agent so as to fix the depth of the PN-junction within the semiconductor substrate while simultaneously passivating said mesa structure.
Claim 2
Independent Claim 71 words
A method of manufacturing a semiconductor device comprising the steps of: coating to one conductivity type by means of a doping agent the surface layer of a semiconductor substrate of the other conductivity type whereby a PN-junction is formed; forming a mesa structure from said substrate; and diffusing in said doping agent so as to fix the depth of the PN-junction within the semiconductor substrate while simultaneously passivating said mesa structure.
Claim 3
Dependent Claim 18 words
The method of claim 1 wherein passivating said mesa comprises forming an oxide layer thereon by thermal oxidation.
Claim 4
Dependent Claim 26 words
The method of claim 1 or 2 wherein said forming said mesa structure comprises etching said substrate through a patterned mask formed on said surface layer.
Claim 5
Dependent Claim 20 words
The method of claim 1 or 2 further including forming a contact on the surface layer of said mesa structure.
Claim 6
Dependent Claim 15 words
The method of claim 1 or 2 wherein said semiconductor substrate comprises a P-type conductivity.
Claim 7
Independent Claim 87 words
A method of manufacturing a semiconductor diode comprising the steps of: coating to one conductivity type by means of a doping agent the surface layer of a semiconductor substrate of the other conductivity type whereby a PN-junction is formed; etching said substrate to produce a mesa; and diffusing said doping agent into said mesa to fix the depth of the PN-junction therein while simultaneously forming an oxide layer on said mesa thereby preventing out-diffusion of said doping agent by carrying out said diffusing in an oxidizing atmosphere.
Claim 8
Independent Claim 87 words
A method of manufacturing a semiconductor diode comprising the steps of: coating to one conductivity type by means of a doping agent the surface layer of a semiconductor substrate of the other conductivity type whereby a PN-junction is formed; etching said substrate to produce a mesa; and diffusing said doping agent into said mesa to fix the depth of the PN-junction therein while simultaneously forming an oxide layer on said mesa thereby preventing out-diffusion of said doping agent by carrying out said diffusing in an oxidizing atmosphere.
Claim 9
Dependent Claim 13 words
The method of claim 6 wherein said doping agent comprises an N-type dopant.
Claim 10
Dependent Claim 22 words
The method of claim 6 or 7 wherein doping said surface layer comprises doping the entire surface layer with said doping agent.

References Cited (Backward Citations)

US3354008A Cited
US3737702A Cited
US3972113A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1983-07-01 1983-12-31 1984-07-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1987-07-01 1987-12-31 1988-07-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1991-07-01 1991-12-31 1992-07-01 $7700.00 Window Closed / Lapsed

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