Patent US4209358A successfully refreshed from Google Patents.
US4209358A
Expired / Lapsed
US
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Method of fabricating a microelectronic device utilizing unfilled epoxy adhesive
Assignee: AT&T Inc
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Filing: 1978-12-04
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Granted: 1980-06-24
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Expires: 1998-12-04
Abstract
Abstract A method of bonding microelectronic components (10, 23, 24) is disclosed. A light emitting diode (10) is bonded to a conductive lead (24) and/or a portion of a lead frame (23) using an adhesive having no metallic particles therein. The diode (10) is clamped to the conductive lead (24) and/or the lead frame (23) as the epoxy is cured. Such bonds have been found to exhibit low contact resistance in addition to long life and reliability.
Inventors
- 👤 Daniel A. DiLeo
- 👤 Samuel E. Kurtz
- 👤 John J. Svitak
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 21:22
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/857; H10W; H10W20/00; H10W20/40; H10W70/00; H10W70/40; H10W70/481; H10W72/00; H10W72/60; H10W72/01; H10W72/0198; H10W72/071; H10W72/073; H10W72/07331; H10W72/076; H10W72/07631; H10W72/07637; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/353; H10W72/354; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/761; H10W90/766
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
86 words
A method of providing an electrically conductive bond between substantially planar surfaces of first and second microelectronic components, comprising the steps of: coating at least a portion of the first and second components with a noble metal; applying an unfilled adhesive on the coated surface of at least one of the components; urging the components into intimate contact at the coated surfaces with the unfilled adhesive interposed therebetween; and applying a clamping force sufficient to provide an electrical connection between the components while curing the adhesive.
Claim 2
Independent Claim
86 words
A method of providing an electrically conductive bond between substantially planar surfaces of first and second microelectronic components, comprising the steps of: coating at least a portion of the first and second components with a noble metal; applying an unfilled adhesive on the coated surface of at least one of the components; urging the components into intimate contact at the coated surfaces with the unfilled adhesive interposed therebetween; and applying a clamping force sufficient to provide an electrical connection between the components while curing the adhesive.
Claim 3
Dependent Claim
14 words
The method as set forth in claim 1, wherein: the noble metal is gold.
Claim 4
Dependent Claim
26 words
The method as set forth in claim 1, wherein: the first component is a light emitting diode; and the second component is an electrically conductive lead.
Claim 5
Independent Claim
139 words
A method of fabricating a light emitting diode assembly (LED) having a light emitting diode bonded within a cup mounted on a first terminal, with an electrically conductive lead connecting the light emitting diode to a second terminal which is spaced from the first terminal, the method comprising: gold coating all surfaces to be bonded; depositing an unfilled epoxy in the cup; placing the LED in the epoxy; coating selected portions of the electrically conductive lead with unfilled epoxy; clamping the epoxy coated portions of the electrically conductive lead into intimate contact with the LED and the second terminal with a predetermined force sufficient to provide an electrical connection therebetween; subjecting the assembly to an elevated temperature for a predetermined period of time to cure the epoxy; and removing the clamping force at the end of said predetermined time.
Claim 6
Independent Claim
139 words
A method of fabricating a light emitting diode assembly (LED) having a light emitting diode bonded within a cup mounted on a first terminal, with an electrically conductive lead connecting the light emitting diode to a second terminal which is spaced from the first terminal, the method comprising: gold coating all surfaces to be bonded; depositing an unfilled epoxy in the cup; placing the LED in the epoxy; coating selected portions of the electrically conductive lead with unfilled epoxy; clamping the epoxy coated portions of the electrically conductive lead into intimate contact with the LED and the second terminal with a predetermined force sufficient to provide an electrical connection therebetween; subjecting the assembly to an elevated temperature for a predetermined period of time to cure the epoxy; and removing the clamping force at the end of said predetermined time.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-06-24 | 1983-12-24 | 1984-06-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-06-24 | 1987-12-24 | 1988-06-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-06-24 | 1991-12-24 | 1992-06-24 | $7700.00 | Window Closed / Lapsed |