High efficiency wide band surface acoustic wave coupler processors

Claim 2

Signal processing apparatus comprising: first transmission line means having input means and a first plurality of tap means and characterized by a propagation velocity therethrough significantly dependent upon temperature over a range of operating temperatures, second transmission line means having output means and a second plurality of spaced tap means and characterized by a propagation velocity therethrough substantially independent of temperature over said range of operating temperatures, and a pluraity of electrical conductor means for coupling respective ones of said first plurality of spaced tap means to corresponding ones of said second plurality of spaced tap means, said signal processing apparatus being characterized by a resultant propagation time from said input means to said output means substantially independent of temperature over said range of operating temperatures.

Claim 3

Apparatus as described in claim 1 wherein: said first transmission line means comprises first acoustic surface wave transmission line means employing a first substrate of a first piezoelectric material, said second transmission line means comprises second acoustic surface wave transmission line means employing a second substrate of a second piezoelectric material, said first plurality of tap means comprises plural interdigital electrode tap means disposed at a surface of said first substrate, and said second plurality of tap means comprises plural interdigital electrode means disposed at a surface of said second substrate.

Claim 4

Apparatus as described in claim 2 wherein: said first substrate material has a first piezoelectric coupling coefficient, and said second substrate material has a second piezoelectric coupling coefficient substantially lower than said first piezoelectric coupling coefficient.

Claim 5

Apparatus as described in claim 3 wherein: said first substrate material is LiNbO 3 , and said second substrate material is quartz.

Claim 6

Signal processing apparatus comprising: first substrate means for propagating a first acoustic wave having a first velocity characteristic at a surface thereof, first transducer means for launching an acoustic wave along a first propagation track at said first substrate surface in a predetermined direction, second substrate means for propagating a second acoustic wave having a second velocity characteristic at a surface thereof, second transducer means for converting into an electrical output an acoustic wave propagating along a second propagation track at said second surface substrate, said first and second substrate means being disposed in generally coplanar side-by-side relation, a first array of interdigital electrode tap means disposed at said first substrate surface, each disposed across said first propagation track, a second array of interdigital electrode tap means disposed at said second substrate surface, each disposed across said second propagation track, and an array of electrical conductors connecting corresponding ones of said first array of interdigital electrode tap means to respective ones of said second array of interdigital electrode tap means, said signal processing apparatus being characterized by a resultant propagation time through said first array, said array of electrical conductors, and said third array substantially independent of temperature over a range of operating temperatures.

Claim 7

Signal processing apparatus comprising: first substrate means for propagating a first acoustic wave having a first velocity characteristic at a surface thereof, first transducer means for launching an acoustic wave along a first propagation track at said first substrate surface in a predetermined direction, second substrate means for propagating a second acoustic wave having a second velocity characteristic at a surface thereof, second transducer means for converting into an electrical output an acoustic wave propagating along a second propagation track at said second surface substrate, said first and second substrate means being disposed in generally coplanar side-by-side relation, a first array of interdigital electrode tap means disposed at said first substrate surface, each disposed across said first propagation track, a second array of interdigital electrode tap means disposed at said second substrate surface, each disposed across said second propagation track, and an array of electrical conductors connecting corresponding ones of said first array of interdigital electrode tap means to respective ones of said second array of interdigital electrode tap means, said signal processing apparatus being characterized by a resultant propagation time through said first array, said array of electrical conductors, and said third array substantially independent of temperature over a range of operating temperatures.

Claim 8

Apparatus as described in claim 5 wherein: said first velocity characteristic is representative of a propagation velocity of said first substrate surface wave significantly dependent upon temperature over a range of operating temperatures, and said second velocity characteristic is representative of a propagation velocity of said second substrate surface wave substantially independent over said range of operating temperatures.

Claim 9

Apparatus as described in claim 6 wherein said first substrate means has a surface acoustic wave piezoelectric coupling coefficient substantially greater than the surface acoustic wave piezoelectric coupling coefficient of said second substrate means.