Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
59 words
A device comprising an n-type body of a Group III(a)-V(a) compound semiconductor material, an n ++ -layer of a Group III(a)-V(a) compound semiconductor material epitaxially grown on said body and substantially lattice-matched thereto, said layer having a carrier concentration in excess of 10 19 cm -3 , and a nonalloyed, ohmic metal contact formed on said n ++ -layer.
Claim 2
Independent Claim
59 words
A device comprising an n-type body of a Group III(a)-V(a) compound semiconductor material, an n ++ -layer of a Group III(a)-V(a) compound semiconductor material epitaxially grown on said body and substantially lattice-matched thereto, said layer having a carrier concentration in excess of 10 19 cm -3 , and a nonalloyed, ohmic metal contact formed on said n ++ -layer.
Claim 3
Dependent Claim
13 words
The device of claim 1 wherein said body and said layer comprise GaAs.
Claim 4
Dependent Claim
12 words
The device of claim 2 wherein said layer is doped with Sn.
Claim 5
Independent Claim
27 words
The device of claims 1 or 2 wherein said contact comprises a metal selected from the group consisting of Au, Sn, Pt, Mo, Ta, Ti and AuGe.
Claim 6
Independent Claim
31 words
The device of claims 1, 2, 3 or 4 wherein said n ++ -layer is epitaxially grown by MBE and said contact is deposited in situ after said layer is grown.
Claim 7
Dependent Claim
88 words
A field effect transistor comprising a semi-insulating semiconductor body of a Group III(a)-V(a) compound material, an n-type epitaxial channel layer of said material epitaxially grown on said body, a pair of stripe mesa n ++ -type source and drain zones of said material epitaxially grown on said channel layer and doped to a carrier concentration in excess of 10 19 cm -3 , nonalloyed, ohmic, metal source and drain contacts formed on said zones, and a metal gate contact formed on said channel layer and between said zones.
Claim 8
Dependent Claim
88 words
A field effect transistor comprising a semi-insulating semiconductor body of a Group III(a)-V(a) compound material, an n-type epitaxial channel layer of said material epitaxially grown on said body, a pair of stripe mesa n ++ -type source and drain zones of said material epitaxially grown on said channel layer and doped to a carrier concentration in excess of 10 19 cm -3 , nonalloyed, ohmic, metal source and drain contacts formed on said zones, and a metal gate contact formed on said channel layer and between said zones.
Claim 9
Dependent Claim
35 words
The transistor of claim 6 wherein said material comprises GaAs, and said source and drain contacts comprise a layer of metal selected from the group consisting of Au, Sn, Pt, Mo, Ta, Ti and AuGe.
Claim 10
Dependent Claim
13 words
The transistor of claim 6 wherein said source and drain contacts comprise AuGe-Ag-Au.
Claim 11
Dependent Claim
61 words
The transistor of claims 6, 7, or 8 wherein said n ++ -type zones are epitaxially grown by MBE in the form of a unitary layer, said source and drain contacts are deposited in situ in the form of a unitary layer, and said source and drain n ++ -type zones and ohmic contacts are formed by shaping said unitary layers.
Claim 12
Independent Claim
73 words
A method of forming a nonalloyed, ohmic contact on an n-type body of a Group III(a)-V(a) compound semiconductor material comprising the steps of (a) epitaxially growing an n ++ -layer of said material on said body so as to have a carrier concentration in excess of 10 19 cm -3 , and (b) depositing a metal layer on said n ++ -layer without heating above the eutectic temperature, thereby forming said ohmic contact.
Claim 13
Independent Claim
73 words
A method of forming a nonalloyed, ohmic contact on an n-type body of a Group III(a)-V(a) compound semiconductor material comprising the steps of (a) epitaxially growing an n ++ -layer of said material on said body so as to have a carrier concentration in excess of 10 19 cm -3 , and (b) depositing a metal layer on said n ++ -layer without heating above the eutectic temperature, thereby forming said ohmic contact.
Claim 14
Dependent Claim
33 words
The method of claim 10 wherein step (a) includes growing said n ++ -layer by MBE, and step (b) includes depositing said metal layer in situ after said n ++ -layer is grown.