Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
138 words
A semiconducting device comprising: a substrate comprising a PbTe crystal of n-type conductivity; an epitaxial buffer layer of Pb.sub.(1-x) X x Te of n-type conductivity on said substrate, wherein X is a Group VI element selected from the group consisting of S and Se and wherein x is a value greater than 0 but less than 0.1; an epitaxial active layer of Pb.sub.(1-y) Sn y Te on said buffer layer, wherein y is a value greater than 0 but less than 0.3, said active layer forming a heterojunction between said active layer and said buffer layer; a p-n junction located outside said buffer layer in either said active layer or in said heterojunction, the n side of said p-n junction being adjacent said buffer layer; and electrical contact means coupled to said substrate and to said active layer.
Claim 2
Dependent Claim
138 words
A semiconducting device comprising: a substrate comprising a PbTe crystal of n-type conductivity; an epitaxial buffer layer of Pb.sub.(1-x) X x Te of n-type conductivity on said substrate, wherein X is a Group VI element selected from the group consisting of S and Se and wherein x is a value greater than 0 but less than 0.1; an epitaxial active layer of Pb.sub.(1-y) Sn y Te on said buffer layer, wherein y is a value greater than 0 but less than 0.3, said active layer forming a heterojunction between said active layer and said buffer layer; a p-n junction located outside said buffer layer in either said active layer or in said heterojunction, the n side of said p-n junction being adjacent said buffer layer; and electrical contact means coupled to said substrate and to said active layer.
Claim 3
Dependent Claim
149 words
A focal plane comprising: a plurality of mesa photodiodes on a PbTe substrate of n-type conductivity, and wherein each of said mesa diodes comprises: an epitaxial buffer layer of Pb.sub.(1-x) X x Te of n-type conductivity on said substrate, wherein X is a Group VI element selected from the group consisting of S and Se and wherein x is a value greater than 0 but less than 0.1; an epitaxial active layer of Pb.sub.(1-y) Sn y Te on said buffer layer, wheren y is a value greater than 0 but less than 0.3, said active layer forming a heterojunction between said active layer and said buffer layer; a p-n junction located outside said buffer layer in either said active layer or in said heterojunction, the n side of said p-n junction being adjacent said buffer layer; and electrical contact means coupled to said substrate and to said active layer.
Claim 4
Dependent Claim
149 words
A focal plane comprising: a plurality of mesa photodiodes on a PbTe substrate of n-type conductivity, and wherein each of said mesa diodes comprises: an epitaxial buffer layer of Pb.sub.(1-x) X x Te of n-type conductivity on said substrate, wherein X is a Group VI element selected from the group consisting of S and Se and wherein x is a value greater than 0 but less than 0.1; an epitaxial active layer of Pb.sub.(1-y) Sn y Te on said buffer layer, wheren y is a value greater than 0 but less than 0.3, said active layer forming a heterojunction between said active layer and said buffer layer; a p-n junction located outside said buffer layer in either said active layer or in said heterojunction, the n side of said p-n junction being adjacent said buffer layer; and electrical contact means coupled to said substrate and to said active layer.
Claim 5
Dependent Claim
120 words
A photodiode comprising: a substrate comprising a PbTe crystal of n-type conductivity; an epitaxial buffer layer of Pb.sub.(1-x) S x Te of n-type conductivity on said substrate, wherein x is a value greater than 0 but less than 0.1; an epitaxial active layer of Pb.sub.(1-y) Sn y Te on said buffer layer, wherein y is a value greater than 0 but less than 0.3, said active layer forming a heterojunction between said active layer and said buffer layer; a p-n junction located outside said buffer layer in either said active layer or in said heterojunction, the n side of said p-n junction being adjacent said buffer layer; and electrical contact means coupled to said substrate and to said active layer.
Claim 6
Dependent Claim
120 words
A photodiode comprising: a substrate comprising a PbTe crystal of n-type conductivity; an epitaxial buffer layer of Pb.sub.(1-x) S x Te of n-type conductivity on said substrate, wherein x is a value greater than 0 but less than 0.1; an epitaxial active layer of Pb.sub.(1-y) Sn y Te on said buffer layer, wherein y is a value greater than 0 but less than 0.3, said active layer forming a heterojunction between said active layer and said buffer layer; a p-n junction located outside said buffer layer in either said active layer or in said heterojunction, the n side of said p-n junction being adjacent said buffer layer; and electrical contact means coupled to said substrate and to said active layer.
Claim 7
Dependent Claim
120 words
A photodiode comprising: a substrate comprising a PbTe crystal of n-type conductivity; an epitaxial buffer layer of Pb.sub.(1-x) Se x Te on n-type conductivity on said substrate, wherein x is a value greater than 0 but less than 0.1; an epitaxial active layer of Pb.sub.(1-y) Sn y Te on said buffer layer, wherein y is a value greater than 0 but less than 0.3, said active layer forming a heterojunction between said active layer and said buffer layer; a p-n junction located outside said buffer layer in either said active layer or in said heterojunction, the n side of said p-n junction being adjacent said buffer layer; and electrical contact means coupled to said substrate and to said active layer.
Claim 8
Dependent Claim
120 words
A photodiode comprising: a substrate comprising a PbTe crystal of n-type conductivity; an epitaxial buffer layer of Pb.sub.(1-x) Se x Te on n-type conductivity on said substrate, wherein x is a value greater than 0 but less than 0.1; an epitaxial active layer of Pb.sub.(1-y) Sn y Te on said buffer layer, wherein y is a value greater than 0 but less than 0.3, said active layer forming a heterojunction between said active layer and said buffer layer; a p-n junction located outside said buffer layer in either said active layer or in said heterojunction, the n side of said p-n junction being adjacent said buffer layer; and electrical contact means coupled to said substrate and to said active layer.
Claim 9
Independent Claim
165 words
A method of fabricating a semiconducting device comprising the steps of: providing a substrate comprising PbTe crystal of n-type conductivity; epitaxially growing a buffer layer of Pb.sub.(1-x) X x Te n-type conductivity on said substrate, wherein X is a Group VI element selected from the group consisting of S and Se and wherein x is a value greater than 0 but less than 0.1; epitaxially growing an active layer of Pb.sub.(1-y) Sn y Te on said buffer layer, wherein y is a value greater than 0 but less than 0.3, said active layer forming a heterojunction between said active layer and said buffer layer; annealing said substrate, buffer layer, and active layer at approximately 450° C. for approximately 20 hours to form a p-n junction located outside said buffer layer in either said active layer or in said heterojunction, the n side of said p-n junction being adjacent said buffer layer; and depositing electrical contact means coupled to said substrate and to said active layer.
Claim 10
Independent Claim
165 words
A method of fabricating a semiconducting device comprising the steps of: providing a substrate comprising PbTe crystal of n-type conductivity; epitaxially growing a buffer layer of Pb.sub.(1-x) X x Te n-type conductivity on said substrate, wherein X is a Group VI element selected from the group consisting of S and Se and wherein x is a value greater than 0 but less than 0.1; epitaxially growing an active layer of Pb.sub.(1-y) Sn y Te on said buffer layer, wherein y is a value greater than 0 but less than 0.3, said active layer forming a heterojunction between said active layer and said buffer layer; annealing said substrate, buffer layer, and active layer at approximately 450° C. for approximately 20 hours to form a p-n junction located outside said buffer layer in either said active layer or in said heterojunction, the n side of said p-n junction being adjacent said buffer layer; and depositing electrical contact means coupled to said substrate and to said active layer.