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Method of making a thin film thermal print head

Assignee: International Business Machines Corp
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Filing: 1978-05-24
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Granted: 1979-09-25
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Expires: 1998-05-24
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Abstract

Abstract A thin film thermal print head is fabricated using radio frequency (rf) or direct current (DC) sputtering within a vacuum chamber into which is introduced a partial pressure of argon and nitrogen. Without breaking the vacuum, three consecutive layers comprising respectively tantalum nitride, gold, and tantalum nitride are sputter deposited and a diffusion barrier formed on a glazed substrate material. After these steps the desired land patterns are formed by photo lithographic techniques and chemical etching and finally sealant and abrasion resistant coatings are applied.

Inventors

  • 👤 Jerome B. Haase
  • 👤 James M. Thompson
  • 👤 Adrian M. Tobin
  • 👤 William R. Wichmann

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 15:48
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/315; B41J2/32; B41J2/335; B41J2/33555; B41J2/3357; B41J2/3359

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 108 words
A method of forming a thermal printing device comprising placing a glazed ceramic substrate in a chamber; evacuating said chamber and thereafter introducing into said chamber a partial pressure of argon and nitrogen; sputtering a layer of tantalum nitride onto the glazed surface of said ceramic substrate; allowing said tantalum nitride coated glazed ceramic substrate to remain in said partial pressure of argon and nitrogen for a discrete period of time to permit an oxy-nitride diffusion barrier to form at the surface of said tantalum nitride; and applying a stable conductive material over the oxy-nitride film by sputtering in said chamber without opening said chamber to the atmosphere.
Claim 2
Independent Claim 108 words
A method of forming a thermal printing device comprising placing a glazed ceramic substrate in a chamber; evacuating said chamber and thereafter introducing into said chamber a partial pressure of argon and nitrogen; sputtering a layer of tantalum nitride onto the glazed surface of said ceramic substrate; allowing said tantalum nitride coated glazed ceramic substrate to remain in said partial pressure of argon and nitrogen for a discrete period of time to permit an oxy-nitride diffusion barrier to form at the surface of said tantalum nitride; and applying a stable conductive material over the oxy-nitride film by sputtering in said chamber without opening said chamber to the atmosphere.
Claim 3
Dependent Claim 60 words
The method of forming a thermal printing device of claim 1 further comprising applying a layer of tantalum nitride over said stable conductive material by sputtering without opening said chamber to the atmosphere, whereby during a single evacuation of said chamber the tantalum nitride, diffusion barrier, stable conductive material and tantalum nitride layers respectively are applied to said ceramic substrate.
Claim 4
Dependent Claim 31 words
The method of forming a thermal printing device of claim 2 wherein said step of applying a stable conductive material comprises the sputtering of metallic gold over said oxy-nitride diffusion barrier.
Claim 5
Dependent Claim 61 words
The method of forming a thermal printing device of claim 3 further comprising the steps of selectively etching said layer using photo lithographic techniques and chemical etching to form a predetermined land pattern including thermal print resistance elements and coating at least a portion of the land pattern with an abrasion resistant coating, said portion including said thermal print resistant element.
Claim 6
Dependent Claim 33 words
The method of forming the thermal printing device of claim 4 wherein said coating step includes applying a first coating of sealing material and subsequently applying a second coating of abrasion resisting material.

References Cited (Backward Citations)

US3400066A Cited
US3558461A Cited
JPS4814599B1 Cited
US3973106A Cited
US4105892A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1982-09-24 1983-03-26 1983-09-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1986-09-24 1987-03-26 1987-09-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1990-09-24 1991-03-26 1991-09-25 $7700.00 Window Closed / Lapsed

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