Patent US4151547A successfully refreshed from Google Patents.
US4151547A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Arrangement for heat transfer between a heat source and a heat sink
Assignee: General Electric Co
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Filing: 1977-09-07
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Granted: 1979-04-24
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Expires: 1997-09-07
Abstract
Abstract An arrangement for improving the transfer of heat from a heat source to a heat sink. The improvement is provided by the use of a malleable dimpled wafer which is deformed between the heat source and heat sink so as to improve the direct contacting of the juxtaposed adjacent surfaces of the heat source and heat sink, thereby resulting in improved thermal conductivity therebetween.
Inventors
- 👤 John M. Rhoades
- 👤 Patrick J. Montanino
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 14:18
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/258; H10W40/60; H10W40/611; H10W40/231; H10W40/235; H10W40/242
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
61 words
A heat transfer arrangement comprising: (a) a heat source; (b) a heat sink; and (c) a malleable wafer having a plurality of dimples thereon, said dimpled wafer being deformed between said heat source and said heat sink during emplacement therebetween for providing increased direct contacting of the adjacent heat sink and heat source surfaces, whereby to improve the thermal conductivity therebetween.
Claim 2
Dependent Claim
61 words
A heat transfer arrangement comprising: (a) a heat source; (b) a heat sink; and (c) a malleable wafer having a plurality of dimples thereon, said dimpled wafer being deformed between said heat source and said heat sink during emplacement therebetween for providing increased direct contacting of the adjacent heat sink and heat source surfaces, whereby to improve the thermal conductivity therebetween.
Claim 3
Dependent Claim
16 words
A heat transfer arrangement according to claim 1, wherein said heat source is a power transistor.
Claim 4
Dependent Claim
20 words
A heat transfer arrangement according to claim 2, wherein said power transistor is housed within a TO 3 type package.
Claim 5
Dependent Claim
30 words
A heat transfer arrangement according to claim 1, wherein said wafer has an areal dimension approximately the same as the areal dimension of the adjacent surface of said heat source.
Claim 6
Dependent Claim
19 words
A heat transfer arrangement according to claim 1, wherein said wafer is dimpled to approximately its same normal thickness.
Claim 7
Dependent Claim
36 words
A heat transfer arrangement according to claim 1, wherein said deformed wafer is in contact with approximately a minimum of 50% of the adjacent juxtaposed surface of each of said heat sink and said heat source.
Claim 8
Dependent Claim
44 words
A heat transfer arrangement according to claim 1, wherein said dimples of said wafer number approximately 21 per lineal inch, and are spaced apart by a distance of approximately 10 to 60 mils center to center, while said wafer is approximately 5 mils thick.
Claim 9
Dependent Claim
20 words
A heat transfer arrangement according to claim 1, wherein the yield strength of said wafer is less than 1000 psi.
Claim 10
Dependent Claim
26 words
A heat transfer arrangement according to claim 1, wherein said wafer is comprised of a material selected from a group comprising gold, silver, zinc and lead.
Claim 11
Dependent Claim
20 words
A heat transfer arrangement according to claim 1, wherein said dimples of said wafer extend from a top surface thereof.
Claim 12
Dependent Claim
32 words
A heat transfer arrangement according to claim 10, further comprising an adhesive attached to the top surface of said wafer to bond the top surface of said wafer to said heat source.
Claim 13
Dependent Claim
45 words
A heat transfer arrangement according to claim 1, wherein said dimples of said wafer are arranged in rows, and each of said rows of dimples is staggered with respect to an adjacent row of dimples to maximize the density of said dimples on said wafer.
References Cited (Backward Citations)
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US3928907A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-04-23 | 1982-10-23 | 1983-04-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-04-23 | 1986-10-23 | 1987-04-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-04-23 | 1990-10-23 | 1991-04-24 | $7700.00 | Window Closed / Lapsed |