US4151058A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing a layer of amorphous silicon usable in an electronic device
Assignee: Thales SA
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Filing: 1978-06-05
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Granted: 1979-04-24
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Expires: 1998-06-05
Abstract
Abstract A method aiming at imparting to the amorphous silicon properties which are compatible with the possibility of modifying by doping or field effect the position of the Fermi level in the volume of the amorphous silicon, a prime requirement for the operation of semiconductor devices. The method comprises a first step of depositing a layer of amorphous silicon onto a substrate under conditions ensuring the purity of the deposit obtained, then a second step wherein the deposit is subjected to a heat treatment consisting in maintaining the deposit in the atmosphere of a plasma containing atomic hydrogen for saturating the existing broken chemical bonds responsible for a parasitic electric conductivity.
Inventors
- 👤 Daniel Kaplan
- 👤 Gonzalo Velasco
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 17:52
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/06; C23C14/14; C23C14/58; C23C14/5826; H; H10; H10D; H10D62/00; H10D62/40; H10F; H10F71/00; H10F71/10; H10F71/103; H10P; H10P14/00; H10P14/20; H10P14/22; H10P14/29; H10P14/2901; H10P14/2902; H10P14/2905; H10P14/34; H10P14/3402; H10P14/3404; H10P14/3411; H10P95/00; H10P95/94; Y; Y02; Y02E; Y02E10/00; Y02E10/50; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
79 words
A method for manufacturing a layer of high resistive amorphous silicon onto a substrate, said method comprising at least the following steps: (a) depositing under a partitial vacuum without adding hydrogen a layer of amorphous silicon onto said substrate; (b) maintaining said layer at a temperature between 100° C. and the temperature of crystallization of the amorphous silicon in an atmosphere of a plasma containing hydrogen or one of its isotopes to increase the resistivity of said amorphous silicon.
Claim 2
Independent Claim
79 words
A method for manufacturing a layer of high resistive amorphous silicon onto a substrate, said method comprising at least the following steps: (a) depositing under a partitial vacuum without adding hydrogen a layer of amorphous silicon onto said substrate; (b) maintaining said layer at a temperature between 100° C. and the temperature of crystallization of the amorphous silicon in an atmosphere of a plasma containing hydrogen or one of its isotopes to increase the resistivity of said amorphous silicon.
Claim 3
Dependent Claim
30 words
A method as claimed in claim 1, wherein, at step (a), amorphous silicon is deposited by cathodic sputtering on a substrate maintained at a temperature of more than 100° C.
Claim 4
Dependent Claim
37 words
A method as claimed in claim 1, wherein, at step (b), the plasma is created by an electric field of a frequency between 10 and 100 MHz in hydrogen at a pressure between 0.01 and 1 Torr.
Claim 5
Dependent Claim
36 words
A method as claimed in claim 1, wherein, at step (b), the substrate is placed on a support made of molybdenum or fused silica and the temperature of said substrate is between 100° and 400° C.
Claim 6
Dependent Claim
39 words
A method as claimed in claim 3, wherein, at step (b), the frequency of the electric field is of 50 MHz, the pressure of hydrogen is of 0.1 Torr and the duration of the treatment is of 2 hours.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-04-23 | 1982-10-23 | 1983-04-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-04-23 | 1986-10-23 | 1987-04-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-04-23 | 1990-10-23 | 1991-04-24 | $7700.00 | Window Closed / Lapsed |