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US4142924A
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Fast-sweep growth method for growing layers using liquid phase epitaxy
Assignee: Massachusetts Institute of Technology
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Filing: 1976-12-16
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Granted: 1979-03-06
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Expires: 1996-12-16
Abstract
Abstract A uniform and thin layer of a semiconductor is grown on a semiconductor substrate by an improved liquid phase epitaxy growth method. The growth solution is supercooled and is pushed rapidly over the substrate on which the layer of solute is grown. In GaAs the amount of supercooling is typically 3° to 5° C. and a constant thickness ultra-thin layer (about 0.18 microns) is grown on top of a GaAs substrate.
Inventors
- 👤 Jaw J. Hsieh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 05:32
CPC Classifications
C; C30; C30B; C30B19/00; C30B19/06; C30B19/063; C30B19/08; H; H10; H10P; H10P14/00; H10P14/20; H10P14/26; H10P14/263; H10P14/265; H10P14/29; H10P14/2901; H10P14/2907; H10P14/2911; H10P14/34; H10P14/3402; H10P14/3414; H10P14/3421; H10P14/3438; H10P14/3441; H10P14/3442; H10P14/3444; H10P14/3446
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
146 words
A liquid phase epitaxy method for growing a thin film of a first semiconductor on a second semiconductor substrate comprising: supercooling a solution comprising the compound of said first semiconductor to a temperature below the equilibrium temperature of said solution, heating said substrate to the temperature of said supercooled solution, sliding said solution over and in contact with said substrate at a speed where the growth time during which they are in contact is such that growth of the film by mechanical convection of the solution-substrate interface caused by sliding the solution over and in contact with the substrate dominates that growth of the film which occurs by the diffusion mechanism during the time that the solution is in contact with the substrate, whereby an ultra-thin layer of said first semiconductor compound from the solution is formed on said second semiconductor substrate during said growth time.
Claim 2
Dependent Claim
146 words
A liquid phase epitaxy method for growing a thin film of a first semiconductor on a second semiconductor substrate comprising: supercooling a solution comprising the compound of said first semiconductor to a temperature below the equilibrium temperature of said solution, heating said substrate to the temperature of said supercooled solution, sliding said solution over and in contact with said substrate at a speed where the growth time during which they are in contact is such that growth of the film by mechanical convection of the solution-substrate interface caused by sliding the solution over and in contact with the substrate dominates that growth of the film which occurs by the diffusion mechanism during the time that the solution is in contact with the substrate, whereby an ultra-thin layer of said first semiconductor compound from the solution is formed on said second semiconductor substrate during said growth time.
Claim 3
Dependent Claim
149 words
A liquid phase epitaxy method for growing a thin film of a first semiconductor on a second semiconductor substrate comprising: heating a solution comprising the compound of said first semiconductor to a temperature which is at least as high as the equilibrium temperature, heating a substrate to a lower temperature than equilibrium temperature, sliding said solution over and in contact with said substrate at a speed where the growth time during which they are in contact is such that growth of the film by mechanical convection of the solution-substrate interface caused by sliding the solution over and in contact with the substrate dominates that growth of the film which occurs by the diffusion mechanism during the time that the solution is in contact with the substrate, whereby an ultra-thin layer of said first semiconductor compound from the solution is formed on said second semiconductor substrate during said growth time.
Claim 4
Dependent Claim
149 words
A liquid phase epitaxy method for growing a thin film of a first semiconductor on a second semiconductor substrate comprising: heating a solution comprising the compound of said first semiconductor to a temperature which is at least as high as the equilibrium temperature, heating a substrate to a lower temperature than equilibrium temperature, sliding said solution over and in contact with said substrate at a speed where the growth time during which they are in contact is such that growth of the film by mechanical convection of the solution-substrate interface caused by sliding the solution over and in contact with the substrate dominates that growth of the film which occurs by the diffusion mechanism during the time that the solution is in contact with the substrate, whereby an ultra-thin layer of said first semiconductor compound from the solution is formed on said second semiconductor substrate during said growth time.
Claim 5
Dependent Claim
156 words
A liquid phase epitaxy method for growing a thin film of a first semiconductor on a second semiconductor substrate comprising: heating said substrate and a solution comprising the compound of said first semiconductor to a temperature higher then the equilibrium temperature of the solution, cooling said substrate and said solution to a temperature below the equilibrium temperature of the solution, sliding said solution over and in contact with said substrate at a speed where the growth time during which they are in contact is such that growth of the film by mechanical convection of the solution-substrate interface caused by sliding the solution over and in contact with the substrate dominates that growth of the film which occurs by the diffusion mechanism during the time that the solution is in contact with the substrate, whereby an ultra-thin layer of said first semiconductor compound from the solution is formed on said second semiconductor substrate during said growth time.
Claim 6
Dependent Claim
156 words
A liquid phase epitaxy method for growing a thin film of a first semiconductor on a second semiconductor substrate comprising: heating said substrate and a solution comprising the compound of said first semiconductor to a temperature higher then the equilibrium temperature of the solution, cooling said substrate and said solution to a temperature below the equilibrium temperature of the solution, sliding said solution over and in contact with said substrate at a speed where the growth time during which they are in contact is such that growth of the film by mechanical convection of the solution-substrate interface caused by sliding the solution over and in contact with the substrate dominates that growth of the film which occurs by the diffusion mechanism during the time that the solution is in contact with the substrate, whereby an ultra-thin layer of said first semiconductor compound from the solution is formed on said second semiconductor substrate during said growth time.
Claim 7
Dependent Claim
25 words
The method of claim 3 wherein: said solution comprises group III and V elements of the periodic table and the substrate comprises a III-V compound.
Claim 8
Dependent Claim
35 words
The method of claim 4 wherein: said group III elements are selected from the group consisting of In and Ga, and said group V elements are selected from the group consisting of As, P, Sb.
Claim 9
Dependent Claim
17 words
The method of claim 4 wherein: said solution comprises Ga and GaAs, and said substrate comprises GaAs.
Claim 10
Dependent Claim
22 words
The method of claim 4 wherein: said solution and said substrate have doping elements added to make them of opposite conductivity types.
Claim 11
Dependent Claim
28 words
The method of claim 4 wherein: said solution and said substrate comprise at least one of the group III and at least one of the group V elements.
Claim 12
Dependent Claim
55 words
The method of claim 3 wherein: said solution comprises Ga and GaAs whose equilibrium temperature range is 803° to 805° C., said substrate comprises GaAs, said supercooling temperature is the range of 3° to 5° C., the growth time is in the range of 0.05 to 0.1 sec, and the growth temperature is 800° C.
References Cited (Backward Citations)
US3981764A
Cited
US3950195A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-03-05 | 1982-09-04 | 1983-03-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-03-05 | 1986-09-04 | 1987-03-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-03-05 | 1990-09-04 | 1991-03-06 | $7700.00 | Window Closed / Lapsed |