Flame-retardant metal-clad dielectric sheeting comprising a non-woven fibrous layer provided with dimensional stability under etching and soldering conditions by a polyester-diepoxide adhesive

Claim 2

Metal-clad dielectric sheeting useful in the manufacture of printed circuitry comprising a non-woven web and an electrically conductive metallic layer adhered to at least one surface of said web by an adhesive system; said web comprising at least 10 pounds per ream of a fiber blend that comprises high tensile strength and heat resistant discontinuous fibers compacted and held together with a matrix of film-forming binder composition that accounts for about 5 to about 75 weight percent of the web; wherein substantially all of said fibers have a softening point above 450° F.; and wherein at least 5 weight percent of the fibers resist distortion when exposed for 10 seconds to a molten solder bath heated to 500° F., at least 30 weight percent of the fibers exhibiting a tensile elongation of at least 20% and a tenacity of at least 3.5 grams per denier, and at least 40 weight percent of the fibers exhibiting a moisture regain of less than about 3 weight percent; said adhesive system comprising a polyester diepoxide comprising a polyester formed from an acid selected from the group consisting of sebasic adipic, and azelaic acids and neopentyl glycol which is end-capped with a moderately brominated bisphenol A-epichlorohydrin epoxy resin; sufficient highly brominated epoxy resin to provide at least about 14 percent by weight solids bromine in said adhesive system, about 5.0 percent by weight solids antimony trioxide, and sufficient polyanhydride curing agent, selected from the group consisting of polyazelaic, polysebasic, and polyadipic polyanhydrides, to provide an anhydride equivalence to epoxide equivalence in said adhesive system of from about 0.85 to about 1.2 to 1; said metal-clad dielectric sheeting exhibiting no more than a 2-mil per inch change in dimensions upon etch-removal of part or all of the electrically conductive layer, and exhibiting no more than a 10 mil per inch change in dimensions and substantially no blistering when exposed for 10 seconds to a molten solder bath heated to 450° F.

Claim 3

The dielectric sheeting of claim 1 wherein said adhesive system further includes an epoxy resin having a molecular weight of less than about 12,000.

Claim 4

Sheeting of claim 1 in which between 30 and 95 weight-percent of the fiber blend is drawn polyester fibers, between 5 and 60 weight-percent of the fiber blend is aromatic polyamide fibers that resist distortion when exposed for 10 seconds to a molten solder bath heated to 500° F., and up to 70 weight-percent of the fiber blend is acrylic fibers that resist distortion when exposed for 10 seconds to a molten solder bath heated to 500° F.

Claim 5

Sheeting of claim 3 in which said aromatic polyamide fibers comprise poly(p-phenylene terephthalamide) fibers.

Claim 6

Sheeting of claim 3 in which about 80 weight-percent of the fiber blend is said drawn polyester fibers and about 20 weight-percent of the fiber blend is said aromatic polyamide staple fibers.

Claim 7

Sheeting of claim 1 in which said polymeric binder material comprises an acrylic-based binder material.

Claim 8

Sheeting of claim 1 in which said polymeric binder material is crosslinked.

Claim 9

Sheeting of claim 1 in which the conductive layer comprises copper.

Claim 10

A non-woven web useful as a dielectric backing for flexible printed circuitry comprising a fiber blend that comprises high tensile-strength and heat-resistant discontinuous staple fibers that substantially all have a softening point above 450° F. compacted and held together with a crosslinked film-forming polymeric binder material; said web having a layer of adhesive on at least one surface thereof, said adhesive comprising a polyester diepoxide; said polyester diepoxide comprising a polyester formed from an acid selected from the group consisting of azelaic, adipic, and sebasic acids and neopentyl glycol, which is end-capped with a moderately borminated bisphenol A-epichlorohydrin epoxy resin; sufficient highly borminated epoxy resin to provide at least about 14 percent by weight solids bromine in said adhesive, about 5.0 percent by weight solids antimony trioxide, and sufficient polyanhydride curing agent, selected from the group consisting of polyazelaic, polyadipic, and polysebasic acids, to provide an anhydride equivalence to epoxide equivalence in said adhesive of from about 0.85 to about 1.2 to 1; the fibers being present in an amount of at least 10 pounds per ream and the binder material being present in an amount of 5 to 75 weight-percent of the web; between 30 and 95 weight-percent of the fiber blend being drawn polyester fibers, between 5 and 60 weight-percent of the fiber blend being aromatic polyamide staple fibers, and up to 70 weight-percent of the fiber blend being acrylic fibers; both the aromatic polyamide and acrylic fibers resisting distortion when exposed for 10 seconds to a molten solder bath heated to 500° F.; the polymeric binder material being solid and nontacky at room temperature, at least initially softening and flowing slightly under the heat and pressure of the compacting operation, and in film form being foldable upon itself without cracking and resisting distortion when heated for 10 seconds in a molten solder bath heated to 500° F.; and the web upon lamination to an electrically conductive metallic layer forming a metal-clad dielectric sheeting that exhibits less than a 2 mil per inch change in dimensions upon etch-removal of part or all of the electrically conductive layer, and less than a 10 mil per inch change in dimensions and substantially no blistering when exposed for 10 seconds to a molten solder bath heated to 450° F.

Claim 11

A non-woven web useful as a dielectric backing for flexible printed circuitry comprising a fiber blend that comprises high tensile-strength and heat-resistant discontinuous staple fibers that substantially all have a softening point above 450° F. compacted and held together with a crosslinked film-forming polymeric binder material; said web having a layer of adhesive on at least one surface thereof, said adhesive comprising a polyester diepoxide; said polyester diepoxide comprising a polyester formed from an acid selected from the group consisting of azelaic, adipic, and sebasic acids and neopentyl glycol, which is end-capped with a moderately borminated bisphenol A-epichlorohydrin epoxy resin; sufficient highly borminated epoxy resin to provide at least about 14 percent by weight solids bromine in said adhesive, about 5.0 percent by weight solids antimony trioxide, and sufficient polyanhydride curing agent, selected from the group consisting of polyazelaic, polyadipic, and polysebasic acids, to provide an anhydride equivalence to epoxide equivalence in said adhesive of from about 0.85 to about 1.2 to 1; the fibers being present in an amount of at least 10 pounds per ream and the binder material being present in an amount of 5 to 75 weight-percent of the web; between 30 and 95 weight-percent of the fiber blend being drawn polyester fibers, between 5 and 60 weight-percent of the fiber blend being aromatic polyamide staple fibers, and up to 70 weight-percent of the fiber blend being acrylic fibers; both the aromatic polyamide and acrylic fibers resisting distortion when exposed for 10 seconds to a molten solder bath heated to 500° F.; the polymeric binder material being solid and nontacky at room temperature, at least initially softening and flowing slightly under the heat and pressure of the compacting operation, and in film form being foldable upon itself without cracking and resisting distortion when heated for 10 seconds in a molten solder bath heated to 500° F.; and the web upon lamination to an electrically conductive metallic layer forming a metal-clad dielectric sheeting that exhibits less than a 2 mil per inch change in dimensions upon etch-removal of part or all of the electrically conductive layer, and less than a 10 mil per inch change in dimensions and substantially no blistering when exposed for 10 seconds to a molten solder bath heated to 450° F.