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US4139857A Expired / Lapsed US ⏱️ 0.0 years remaining

Schottky barrier type solid-state element

Assignee: Futaba Corp
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Filing: 1976-07-15
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Granted: 1979-02-13
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Expires: 1996-07-15
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Abstract

Abstract A Schottky barrier type solid-state element and a method of producing the same, the Schottky barrier type solid-state element comprising a Schottky barrier type element portion consisting of a metallic board and a semiconductor film layer provided on the metallic board, the metallic board being formed of such a metal as can form a Schottky barrier between itself and the semiconductor film layer, and a semiconductor-side terminal electrode provided on the external surface of the semiconductor film layer so as to obtain an ohmic contact therewith, wherein at least the semiconductor film layer is formed by what is called the ionized-cluster-beam deposition process.

Inventors

  • 👤 Toshinori Takagi
  • 👤 Kiyoshi Morimoto
  • 👤 Yukihiko Utamura

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 00:15
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/20; H10P14/29; H10P14/2901; H10P14/2921; H10D; H10D62/00; H10D62/40; H10F; H10F10/00; H10F10/10; H10F10/18; H10F71/00; H10F71/121; H10P14/22; H10P14/2922; H10P14/2923; H10P14/34; H10P14/3402; H10P14/3404; H10P14/3411; H10P14/3438; H10P14/3441; H10P14/3442; H10P14/3444; Y; Y02; Y02E; Y02E10/00; Y02E10/50; Y02E10/547; Y02P; Y02P70/00; Y02P70/50

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 205 words
A flexible Schottky barrier type solid-state element comprising: a flexible film substrate board; a first metallic film layer deposited on said flexible film substrate board by the ionized-cluster-beam deposition process wherein a material to be deposited is vaporized into a vapor, injected into a vacuum region of about 10 -2 Torr or less to form aggregates of said vapor called clusters, said clusters are bombarded with electrons to produce ionized clusters, and said ionized clusters are accelerated by an electric field such that they impinge on a surface, thereby forming a film layer of said material on said surface, said first metallic film layer forming an ohmic contact semiconductor-side terminal electrode; a semiconductor film layer deposited on said first metallic film layer by said ionized-cluster-beam deposition process, a second metallic film layer deposited on said semiconductor film layer by said ionized-cluster-beam deposition process, said second metallic film layer and said semiconductor film layer forming a Schottky barrier at the boundary therebetween; a current-collecting metallic-board-side terminal electrode provided on one portion of said second metallic film; and a reflection preventative film layer provided on another portion of said second metallic film; whereby said Schottky solid state element can be folded or rolled into a compact size.
Claim 2
Dependent Claim 205 words
A flexible Schottky barrier type solid-state element comprising: a flexible film substrate board; a first metallic film layer deposited on said flexible film substrate board by the ionized-cluster-beam deposition process wherein a material to be deposited is vaporized into a vapor, injected into a vacuum region of about 10 -2 Torr or less to form aggregates of said vapor called clusters, said clusters are bombarded with electrons to produce ionized clusters, and said ionized clusters are accelerated by an electric field such that they impinge on a surface, thereby forming a film layer of said material on said surface, said first metallic film layer forming an ohmic contact semiconductor-side terminal electrode; a semiconductor film layer deposited on said first metallic film layer by said ionized-cluster-beam deposition process, a second metallic film layer deposited on said semiconductor film layer by said ionized-cluster-beam deposition process, said second metallic film layer and said semiconductor film layer forming a Schottky barrier at the boundary therebetween; a current-collecting metallic-board-side terminal electrode provided on one portion of said second metallic film; and a reflection preventative film layer provided on another portion of said second metallic film; whereby said Schottky solid state element can be folded or rolled into a compact size.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1982-02-12 1982-08-14 1983-02-13 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1986-02-12 1986-08-14 1987-02-13 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1990-02-12 1990-08-14 1991-02-13 $7700.00 Window Closed / Lapsed

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