Polyoxypropylene polyamine polyamide thermoplastic adhesives
Abstract
Abstract A novel thermoplastic adhesive having a melting point between about 20° C to about 180° C. is disclosed which is comprised of a resinous polyamide reaction product of a polyoxypropylene polyamine selected from diamines, triamines, or mixtures thereof having an average molecular weight of about 190 to about 3,000 and an aliphatic or aromatic dicarboxylic acid, ester or anhydride. The thermoplastic adhesive of the invention is prepared by mixing and reacting the polyoxypropylene polyamine and the dicarboxylic acid, ester or anhydride at a molar ratio of from about 0.25:1 to about 4.0:1 at a temperature of from about 175° to about 270° C. for about 1 to about 12 hours. Other components, e.g., a minor amount of polyepoxide resin having an epoxide equivalent weight of about 150 to about 600, a compatible plasticizing agent, filler and the like, may be added to the polyamide reaction product to provide a formulated thermoplastic adhesive having a broad range of hardness, flexibility and compatibility, and capable of bonding together a variety of substrates.
Inventors
- 👤 Howard P. Klein
Bibliographic Details
Claims Analysis
Total Claims: 8References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
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| 3.5 Years (Year 4) | 1982-01-08 | 1982-07-10 | 1983-01-09 | $2000.00 | Window Closed / Lapsed |
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