Epoxide resin mixtures

Claim 1

A storage-stable, thermosetting mixture which comprises: (a) a polyimide containing in the molecule at least two radicals of the general formula ##STR11## wherein D represents a bivalent radical containing a carbon-carbon double bond; (b) 0.1 to 10 moles of an akenylphenol, an alkenylphenol ether or mixtures thereof per equivalent of said polyimide; (c) 0.1 to 10 moles per equivalent of said polyimides of an epoxide compound of a mixture of several epoxide compounds selected from the group consisting of: (α) glycidyl ethers of the formula ##STR12## wherein R 3 represents an allyl group or H atom, (β) glycidyl ethers of novolaks (X') which contain two or more epoxy groups of said glycidyl ethers additionally substituted on the aromatic nuclei with one or more allyl groups, (α) polyepoxy adducts (Y'), having two or more epoxy groups per molecule, produced by an advancement reaction of one or more diepoxide compounds with one or more bisphenols or said diepoxide compounds or bisphenols additionally substituted on the aromatic nuclei with one or more allyl groups, (δ) epoxide compounds (Z') produced by the reaction of one or more phenols or said phenols, additionally substituted on the aromatic nuclei with one or more allyl groups, with epichlorohydrin in an alkaline solution, and (d) up to 5 percent by weight, relative to the epoxide resin, of a curing accelerator for epoxide resins.