Abstract A beam lead packaged semiconductor structure having the beam leads of the beam lead semiconductor chip bonded directly to the thinned coplanar tips of lead frame leads which are supported on, and bonded to, an insulating support forming a portion of the package envelope and having substantially the same thermal coefficient expansion as the lead frame metal. The package is constructed by producing thinned coplanar lead tips integral with a lead frame structure, bonding each lead of a beam lead device to a thinned tip of a lead frame lead at a plurality of points, bonding ceramic covers of the package to both sides of the lead frame beam lead device to hermetically seal the package, with one cover being bonded to the thinned tips beneath the regions where the beam leads of the semiconductor chip are bonded to the thinned tips of the lead frame lead to rigidly support the chip in the package and then removing the lead frame from the outer ends of the lead frame leads and forming the outer portions of said leads to fit the desired socket configuration.
A semiconductor package comprising: (a) a rigid insulating support; (b) a lead frame having a plurality of leads disposed in a plane, such lead frame being disposed on and bonded to the insulating support, each one of the plurality of leads having an end portion which extends beyond the edge of said insulating support to form a pin for insertion into an integrated circuit socket and another end portion which is thinner than the major portion of said lead, such thinner end portion being supported on the insulating support; and (c) a semiconductor device having at least one active semiconductor element and having single, planar, beam lead conductive members of substantially uniform thickness extending beyond the edges of said device, such planar beam lead conductive members being disposed in the plane of the plurality of leads and being supported on and bonded directly to the thinner end portion of said leads.
Claim 2
Dependent Claim
151 words
A semiconductor package comprising: (a) a rigid insulating support; (b) a lead frame having a plurality of leads disposed in a plane, such lead frame being disposed on and bonded to the insulating support, each one of the plurality of leads having an end portion which extends beyond the edge of said insulating support to form a pin for insertion into an integrated circuit socket and another end portion which is thinner than the major portion of said lead, such thinner end portion being supported on the insulating support; and (c) a semiconductor device having at least one active semiconductor element and having single, planar, beam lead conductive members of substantially uniform thickness extending beyond the edges of said device, such planar beam lead conductive members being disposed in the plane of the plurality of leads and being supported on and bonded directly to the thinner end portion of said leads.
Claim 3
Dependent Claim
31 words
The semiconductor package according to claim 1 wherein the thermal coefficient of expansion of the lead frame is substantially the same as the thermal coefficient of expansion of the insulating support.
Claim 4
Dependent Claim
16 words
The semiconductor package according to claim 2 wherein said semiconductor device comprises a beam lead structure.
Claim 5
Dependent Claim
26 words
The semiconductor package according to claim 1 wherein said support comprises an alumina body having a planar surface bonded to the thinner ends of said leads.
Claim 6
Dependent Claim
25 words
The semiconductor package according to claim 4 wherein leads from said semiconductor structure are bonded to said leads of said package adjacent said planar surface.