Process for the production of a planar conductor path system for integrated semiconductor circuits

Claim 2

Process for the production of a planar conductor path system for integrated semiconductor circuits which includes first applying a metal layer to substantially one entire surface of a base, covering the metal with a layer of masking material, removing all of the masking layer except over those areas where the conductor paths are to be, and thereafter oxidixing electrolessly in an acqueous solution the metal layer underneath the exposed surface.

Claim 3

Process for the production of a planar conductor path system for integrated semiconductor circuits which includes first applying a metal layer to substantially one entire surface of a base, covering the metal layer with a non-porous metal oxide, covering the non-porous metal oxide layer with a photo-lacquer layer, exposing and developing the photo-lacquer layer to leave portions of the non-porous metal oxide above where the metal layer is to form the conductor path, and converting the exposed metal layer portions not covered by the remaining non-porous oxide into a porous oxide electrolessly in an aqueous solution.

Claim 4

Process for the production of a planar conductor path system for integrated semiconductor circuits which includes first applying a metal layer to substantially one entire surface of a base, covering the metal layer with a non-porous metal oxide, covering the non-porous metal oxide layer with a photo-lacquer layer, exposing and developing the photo-lacquer layer to leave portions of the non-porous metal oxide above where the metal layer is to form the conductor path, and converting the exposed metal layer portions not covered by the remaining non-porous oxide into a porous oxide electrolessly in an aqueous solution.

Claim 5

Process according to claim 2, in which said porous oxide layer is covered by an insulating layer, and providing openings through said insulating layer and through said non-porous layer to said conductor path thereby to provide electric connections to the conductor path system.

Claim 6

Process for the production of a planar conductor path system for integrated semiconductor circuits which includes first applying a metal layer to substantially one entire surface of a base, covering the metal layer with a photo-lacquer layer, by a photo-lithographic step providing openings through said lacquer layer over the regions of the metal layer where the conductor path is to be formed, providing a non-porous oxide in said openings on said metal layer, removing the remaining portions of the lacquer layer, converting electrolessly in an aqueous solution the portions of the metal layer not lying beneath said non-porous oxide layer into a porous oxide layer, and providing a protective oxide layer by sputtering over the porous oxide layer and over the remaining non-porous oxide portions, and providing openings through said protective layer and through said non-porous oxide layer to the conductor path.

Claim 7

Process for the production of a planar conductor path system for integrated semiconductor circuits which includes first applying a metal layer to substantially one entire surface of a base, covering the metal layer with a photo-lacquer layer, by a photo-lithographic step providing openings through said lacquer layer over the regions of the metal layer where the conductor path is to be formed, providing a non-porous oxide in said openings on said metal layer, removing the remaining portions of the lacquer layer, converting electrolessly in an aqueous solution the portions of the metal layer not lying beneath said non-porous oxide layer into a porous oxide layer, and providing a protective oxide layer by sputtering over the porous oxide layer and over the remaining non-porous oxide portions, and providing openings through said protective layer and through said non-porous oxide layer to the conductor path.

Claim 8

Process for the production of a planar conductor path system for integrated semiconductor circuits which includes first applying a metal layer to substantially one entire surface of a base, covering the metal layer with a photo-lacquer layer, by a photo-lithographic process removing all portions of the photo-lacquer layer except over regions where the conductor path is to be formed, converting electrolessly in an aqueous solution all exposed portions of said metal layer to a porous oxide except where the metal layer is covered by said remaining photo-lacquer layer, removing the remaining portions of said photo-lacquer layer, covering said porous oxide layer with a protective oxide coating, and providing openings through said protective oxide layer to the conductor paths.

Claim 9

Process for the production of a planar conductor path system for integrated semiconductor circuits which includes first applying a metal layer to substantially one entire surface of a base, covering the metal layer with a photo-lacquer layer, by a photo-lithographic process removing all portions of the photo-lacquer layer except over regions where the conductor path is to be formed, converting electrolessly in an aqueous solution all exposed portions of said metal layer to a porous oxide except where the metal layer is covered by said remaining photo-lacquer layer, removing the remaining portions of said photo-lacquer layer, covering said porous oxide layer with a protective oxide coating, and providing openings through said protective oxide layer to the conductor paths.

Claim 10

Process according to claim 1, in which the base comprises a silicon dioxide layer applied to a semiconductor body.

Claim 11

Process according to claim 1, in which the base is a silicon semiconductor layer.

Claim 12

Process according to claim 1, in which the metal layer is aluminum.

Claim 13

Process according to claim 1, in which the metal layer is an aluminum alloy.

Claim 14

Process according to claim 1, in which the masking layer is Al 2 O 3 .

Claim 15

Process according to claim 1, in which the aqueous solution is 1% hexamethylene tetramine in water.

Claim 16

Process according to claim 11, in which the oxidation of the metal layer by the aqueous solution is carried out at a temperature of 90° C. for approximately one hour.