US4091138A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Insulating film, sheet, or plate material with metallic coating and method for manufacturing same
Assignee: Sumitomo Bakelite Co Ltd
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Filing: 1976-02-04
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Granted: 1978-05-23
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Expires: 1996-02-04
Abstract
Abstract This invention provides a method for forming a dense, electrically conductive, metallic coating having a sufficient adherence without use of an adhesive on an insulating film, sheet, or plate such as plastic film, plastic rigid sheet, or ceramics by the cluster ion plating procedure which comprises heating a crucible containing a vapor deposition metal at a temperature of 200° to 2,500° C in a vacuum of 1 × 10 -4 Torr. to 1 × 10 -7 Torr. to generate a metal cluster through a small hole of the crucible, ionizing the metal cluster by the impact of electrons, and electrostatically accelerating the resulting cluster ion and depositing the same on a base material; a method for directly forming an electric circuit on the base material without use of adhesive according to the above-said method, wherein the base material is covered with a mask in the sheet form; and a method for efficiently increasing the thickness of the metallic coatings formed by the above methods, by further deposition of a metal by a vacuum deposition procedure or by an ion plating procedure similar to the said cluster ion plating, except that the crucible has an ejecting hole of a larger diameter so that practically the cluster is no more formed. The invention also provides the products manufactured by the above methods.
Inventors
- 👤 Toshinori Takagi
- 👤 Tatsuichiro Nishiyama
- 👤 Unosuke Uchida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 21:08
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/14; H05K3/146; C; C23; C23C; C23C14/00; C23C14/02; C23C14/22; C23C14/24; C23C14/32; H01; H01B; H01B13/00; H01B13/0026; Y; Y10; Y10S; Y10S148/00; Y10S148/025; Y10S148/045; Y10S148/169; Y10S174/00; Y10S174/13; Y10S174/33; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/31504; Y10T428/31678; Y10T428/31681
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
187 words
A coated material comprising an insulating substrate of polyester of polyimide having on at least one surface a metallic copper coating deposited from the vapor phase by cluster ion plating, said plating being obtained by (1) providing a small hole on the top of a crucible containing the copper to be deposited, the diameter of the hole being 1 to 30% of the inner diameter of the crucible, (2) heating the crucible under vacuum to a temperature at which said copper is sufficiently vaporized to eject the copper vapor from said small hole, thereby forming clusters each being an aggregate of about 1,000 metal atoms, (3) allowing electrons, generated from a red-hot ionizing heater separately provided by applying a DC voltage between the heater and an ionizing anode, to collide against the clusters, thereby ionizing some of the clusters, and (4) accelerating the ionized clusters by applying a DC voltage sufficiently high to increase adherence of the clusters to the substrate, said accelerating voltage being applied between the ionizing anode and an extraction-electrode, thereby depositing the accelerated ionized clusters together with un-ionized clusters on the insulating substrate.
Claim 2
Dependent Claim
187 words
A coated material comprising an insulating substrate of polyester of polyimide having on at least one surface a metallic copper coating deposited from the vapor phase by cluster ion plating, said plating being obtained by (1) providing a small hole on the top of a crucible containing the copper to be deposited, the diameter of the hole being 1 to 30% of the inner diameter of the crucible, (2) heating the crucible under vacuum to a temperature at which said copper is sufficiently vaporized to eject the copper vapor from said small hole, thereby forming clusters each being an aggregate of about 1,000 metal atoms, (3) allowing electrons, generated from a red-hot ionizing heater separately provided by applying a DC voltage between the heater and an ionizing anode, to collide against the clusters, thereby ionizing some of the clusters, and (4) accelerating the ionized clusters by applying a DC voltage sufficiently high to increase adherence of the clusters to the substrate, said accelerating voltage being applied between the ionizing anode and an extraction-electrode, thereby depositing the accelerated ionized clusters together with un-ionized clusters on the insulating substrate.
Claim 3
Dependent Claim
30 words
The coated material according to claim 1, wherein the thickness of the metallic coating deposited by the cluster ion plating is increased further by vapordeposition or sputtering of a metal.
Claim 4
Dependent Claim
30 words
The coated material according to claim 2, wherein the metal for vapor-deposition or sputtering is the same as that of the metallic coating deposited by the cluster ion plating method.
Claim 5
Dependent Claim
37 words
The coated material according to claim 1, wherein the metallic coating constitutes a printed circuit obtained by etching the metallic coating to remove the unnecessary part thereof or directly obtained by a masking method during the deposition.
Claim 6
Dependent Claim
28 words
The coated material according to claim 4, wherein the thickness of the metallic coating constituting a printed circuit is increased further by vapordeposition or sputtering of a metal.
Claim 7
Dependent Claim
24 words
The coated material according to claim 5, wherein the metal for vapor deposition or sputtering is the same as that of the metallic coating.
Claim 8
Independent Claim
220 words
A method for manufacturing a coated substrate which comprises depositing a metallic coating from the vapor phase on at least one surface of an insulating substrate by a cluster ion plating method comprising the steps of (1) providing a small hole on top of a crucible containing a metal to be plated, the diameter of the hole being 1 to 30% of the inner diameter of the crucible, (2) heating the crucible under a vacuum of 1 ×10 -4 to 1 × 10 -7 Torr to a temperature at which said metal is sufficiently vaporized to eject the metal vapor from said small hole, thereby forming clusters each being an aggregate of about 1,000 metal atoms, (3) applying a DC voltage of 10 to 1,000 V between a red-hot ionizing heater provided separately and an ionizing anode to cause an electron current of 10 mA to flow therebetween, thereby generating electrons and allowing the electrons to collide against the clusters to ionize some of the clusters, and (4) applying a DC voltage of 10 to 3,000 V between the ionizing anode and an extraction electrode to accelerate the ionized cluster so that the ion density on the insulating substrate becomes 0.1 μA/cm 2 to several mA/cm 2 to deposit the ionized clusters together with un-ionized clusters on the insulating substrate.
Claim 9
Independent Claim
220 words
A method for manufacturing a coated substrate which comprises depositing a metallic coating from the vapor phase on at least one surface of an insulating substrate by a cluster ion plating method comprising the steps of (1) providing a small hole on top of a crucible containing a metal to be plated, the diameter of the hole being 1 to 30% of the inner diameter of the crucible, (2) heating the crucible under a vacuum of 1 ×10 -4 to 1 × 10 -7 Torr to a temperature at which said metal is sufficiently vaporized to eject the metal vapor from said small hole, thereby forming clusters each being an aggregate of about 1,000 metal atoms, (3) applying a DC voltage of 10 to 1,000 V between a red-hot ionizing heater provided separately and an ionizing anode to cause an electron current of 10 mA to flow therebetween, thereby generating electrons and allowing the electrons to collide against the clusters to ionize some of the clusters, and (4) applying a DC voltage of 10 to 3,000 V between the ionizing anode and an extraction electrode to accelerate the ionized cluster so that the ion density on the insulating substrate becomes 0.1 μA/cm 2 to several mA/cm 2 to deposit the ionized clusters together with un-ionized clusters on the insulating substrate.
Claim 10
Dependent Claim
29 words
The method for manufacturing a coated substrate according to claim 7, wherein the thickness of the metallic coating is increased further by vapor deposition or sputtering of a metal.
Claim 11
Dependent Claim
41 words
The method for manufacturing a coated substrate according to claim 7, wherein the metallic coating constitutes a printed circuit obtained by etching the metallic coating to remove the unnecessary part thereof or directly obtained by a masking method, during the deposition.
Claim 12
Dependent Claim
32 words
The method for manufacturing a coated substrate according to claim 9, wherein the thickness of the metallic coating constituting the printed circuit is increased further by vapor deposition or sputtering a metal.
Claim 13
Dependent Claim
74 words
The method for manufacturing a coated substrate according to claim 7, wherein the substrate is a thermoplastic resin film having a melting point of 80° C or more, a dielectric breakdown voltage of 200 V or more per 50 μ in thickness, a water absorption of 5% or less after immersion in water at 20° C for 24 hrs, and a heat-shrinkage of 10% or less after treatment at 80° C for 2 hrs.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-05-22 | 1981-11-21 | 1982-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-05-22 | 1985-11-21 | 1986-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-05-22 | 1989-11-21 | 1990-05-23 | $7700.00 | Window Closed / Lapsed |