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US4078102A Expired / Lapsed US ⏱️ 0.0 years remaining

Process for stripping resist layers from substrates

Assignee: International Business Machines Corp
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Filing: 1976-10-29
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Granted: 1978-03-07
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Expires: 1996-10-29
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Abstract

Abstract Organic polymer resist layers are stripped from substrates by treating the layers with a mixture of an aldehyde or a ketone and an alcoholic solution of a compound selected from the group consisting of ammonium, alkali metal, and alkaline earth metal hydroxides and carbonates.

Inventors

  • 👤 Diana Jean Bendz
  • 👤 Gerald Andrei Bendz

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 13:11
CPC Classifications
C; C09; C09D; C09D9/00; G; G03; G03F; G03F7/00; G03F7/26; G03F7/42; G03F7/422; G03F7/425

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 80 words
A process for removing an organic polymer resist layer from a substrate comprising treating the layer with a mixture consisting essentially of an alcoholic solution of an activator compound selected from the group consisting of ammonium, alkali metal, and alkaline earth metal hydroxides and carbonates and an aldehyde or ketone in proportions to provide between about 0.005 mole to 0.1 mole of activator compound per mole of aldehyde or ketone so as to remove said resist layer from said substrate.
Claim 2
Dependent Claim 80 words
A process for removing an organic polymer resist layer from a substrate comprising treating the layer with a mixture consisting essentially of an alcoholic solution of an activator compound selected from the group consisting of ammonium, alkali metal, and alkaline earth metal hydroxides and carbonates and an aldehyde or ketone in proportions to provide between about 0.005 mole to 0.1 mole of activator compound per mole of aldehyde or ketone so as to remove said resist layer from said substrate.
Claim 3
Dependent Claim 21 words
The process of claim 1 wherein the process is carried out at a temperature of from about 30° to 100° C.
Claim 4
Dependent Claim 14 words
The process of claim 1 wherein the activator compound is a strong inorganic base.
Claim 5
Dependent Claim 11 words
The process of claim 3 wherein the base is sodium hydroxide.
Claim 6
Dependent Claim 11 words
The process of claim 1 wherein the mixture includes an aldehyde.
Claim 7
Dependent Claim 11 words
The process of claim 1 wherein the mixture includes a ketone.
Claim 8
Dependent Claim 10 words
The process of claim 6 wherein the ketone is cyclohexanone.
Claim 9
Dependent Claim 27 words
The process of claim 1 wherein the alcoholic solution of the activator compound is a saturated solution in an alcohol which contains 1 to 4 carbon atoms.
Claim 10
Dependent Claim 25 words
The process of claim 1 wherein the proportions provide between about 0.006 mole to 0.01 mole of activator compound per mole of aldehyde or ketone.
Claim 11
Dependent Claim 82 words
A process for removing an organic polymer resist layer from a substrate having a pattern of metal conductor lines formed on its surface comprising treating the layer with a mixture consisting essentially of a saturated isopropyl alcohol solution of sodium hydroxide and cyclohexanone, in proportions to provide between about 0.006 mole to 0.01 mole of activator compound per mole of aldehyde or ketone, at a temperature of about 80° C with agitation so as to remove said resist layer from said substrate.
Claim 12
Dependent Claim 82 words
A process for removing an organic polymer resist layer from a substrate having a pattern of metal conductor lines formed on its surface comprising treating the layer with a mixture consisting essentially of a saturated isopropyl alcohol solution of sodium hydroxide and cyclohexanone, in proportions to provide between about 0.006 mole to 0.01 mole of activator compound per mole of aldehyde or ketone, at a temperature of about 80° C with agitation so as to remove said resist layer from said substrate.

References Cited (Backward Citations)

US3625763A Cited
US3813309A Cited
US3930857A Cited
US3871929A Cited
US3988256A Cited
US3980587A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1981-03-06 1981-09-05 1982-03-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1985-03-06 1985-09-05 1986-03-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1989-03-06 1989-09-05 1990-03-07 $7700.00 Window Closed / Lapsed

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