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US4070444A Expired / Lapsed US ⏱️ 0.0 years remaining

Low cost, high volume silicon purification process

Assignee: Motorola Solutions Inc
•
Filing: 1976-07-21
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Granted: 1978-01-24
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Expires: 1996-07-21
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Abstract

Abstract Truly amorphous silicon having a low level of undesired impurities, and therefore suitable for semiconductor applications, may be prepared by the present process. Impure silicon, for example, metallurgical grade silicon, is prepared at an elevated temperature, e.g., above 1400° C. The impure silicon and at least one binary silicon fluoride compound, e.g., silicon tetrafluoride, are chemically combined at the elevated temperature to form silicon difluoride gas. The silicon difluoride gas is polymerized. The silicon difluoride polymer is then thermally decomposed to produce the purified, amorphous silicon and binary silicon fluoride by-products. The binary silicon fluorides are recycled in the process to be chemically combined with the impure silicon. That step and the succeeding steps serve to reduce the level of unwanted impurities in the silicon produced by at least several orders of magnitude.

Inventors

  • 👤 William Martell Ingle

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 18:29
CPC Classifications
C; C01; C01B; C01B33/00; C01B33/02; C01B33/08

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 159 words
A process of producing pure semiconductor grade silicon which comprises: chemically combining metallurgical grade silicon and at least one binary silicon fluoride compound to form silicon difluoride gas, forming a polymer of said silicon difluoride at a partial pressure of said silicon difluoride gas greater than about 150 microns Hg and at a first temperature of from about -45° C to about +200° C which will allow formation of said polymer in a continuous form on a substrate having a different coefficient of thermal expansion than that of said polymer, cooling said polymer and said substrate to a second lower temperature which will allow said polymer to be separated easily from said substrate, thermally decomposing the silicon difluoride polymer to produce silicon and a binary silicon fluoride compound, and introducing said binary silicon fluoride compound from said thermal decomposition to said step of combining with silicon, these process steps serving to remove unwanted impurities from said metallurgical grade silicon.
Claim 2
Dependent Claim 159 words
A process of producing pure semiconductor grade silicon which comprises: chemically combining metallurgical grade silicon and at least one binary silicon fluoride compound to form silicon difluoride gas, forming a polymer of said silicon difluoride at a partial pressure of said silicon difluoride gas greater than about 150 microns Hg and at a first temperature of from about -45° C to about +200° C which will allow formation of said polymer in a continuous form on a substrate having a different coefficient of thermal expansion than that of said polymer, cooling said polymer and said substrate to a second lower temperature which will allow said polymer to be separated easily from said substrate, thermally decomposing the silicon difluoride polymer to produce silicon and a binary silicon fluoride compound, and introducing said binary silicon fluoride compound from said thermal decomposition to said step of combining with silicon, these process steps serving to remove unwanted impurities from said metallurgical grade silicon.
Claim 3
Dependent Claim 15 words
The process of claim 1 in which said binary silicon fluoride compound is silicon tetrafluoride.
Claim 4
Dependent Claim 27 words
The process of claim 1 in which the thermal decomposition of said polymer takes place in a vacuum at a temperature of at least about 400° C.
Claim 5
Dependent Claim 26 words
The process of claim 1 wherein said silicon is supplied to the process as molten silicon directly from a furnace in which said silicon is obtained.
Claim 6
Dependent Claim 152 words
A process for producing pure silicon, which comprises: chemically combining raw material silicon and at least one binary silicon fluoride compound to form silicon difluoride gas, forming an initial quantity of a polymer of said silicon difluoride gas including impurities present in said raw material silicon or said silicon difluoride gas at a first temperature from about -45° C to about 200° C and a partial pressure of said silicon difluoride gas greater than about 150 microns Hg, forming an additional quantity of the polymer of said silicon difluoride gas at a second temperature lower than said first temperature, said additional quantity of silicon difluoride polymer being substantially free of impurities present in said silicon difluoride gas or said raw material silicon, and thermally decomposing said additional quantity of said silicon difluoride polymer to produce silicon substantially free of the impurities present in said silicon difluoride gas or said raw material silicon.
Claim 7
Dependent Claim 152 words
A process for producing pure silicon, which comprises: chemically combining raw material silicon and at least one binary silicon fluoride compound to form silicon difluoride gas, forming an initial quantity of a polymer of said silicon difluoride gas including impurities present in said raw material silicon or said silicon difluoride gas at a first temperature from about -45° C to about 200° C and a partial pressure of said silicon difluoride gas greater than about 150 microns Hg, forming an additional quantity of the polymer of said silicon difluoride gas at a second temperature lower than said first temperature, said additional quantity of silicon difluoride polymer being substantially free of impurities present in said silicon difluoride gas or said raw material silicon, and thermally decomposing said additional quantity of said silicon difluoride polymer to produce silicon substantially free of the impurities present in said silicon difluoride gas or said raw material silicon.
Claim 8
Dependent Claim 19 words
The process of claim 5 in which said second temperature is between about -45° C and about -160° C.
Claim 9
Dependent Claim 47 words
The process of claim 5 in which said additional quantity of said silicon difluoride polymer is formed on a substrate having a different coefficient of thermal expansion than said polymer, and the temperature of said polymer is changed to facilitate removal of said polymer from said substrate.
Claim 10
Dependent Claim 15 words
The process of claim 5 in which said binary silicon fluoride compound is silicon tetrafluoride.
Claim 11
Dependent Claim 26 words
The process of claim 5 wherein said silicon is supplied to the process as molten silicon directly from a furnace in which said silicon is obtained.
Claim 12
Dependent Claim 22 words
The process of claim 5 wherein said initial quantity of polymer is formed in a baffle for the removal of particulate impurities.
Claim 13
Dependent Claim 38 words
The process of claim 1 wherein said pure silicon produced is dense, continuous, non porous and gives no diffraction peaks when scanned on an x-ray diffractometer and shows no structural features when examined under a scanning electron microscope.
Claim 14
Dependent Claim 38 words
The process of claim 5 wherein said pure silicon produced is dense, continuous, non porous and gives no diffraction peaks when scanned on an x-ray diffractometer and shows no structural features when examined under a scanning electron microscope.

References Cited (Backward Citations)

FR1094760A Cited
CH327712A Cited
US2840588A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1981-01-23 1981-07-25 1982-01-24 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1985-01-23 1985-07-25 1986-01-24 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1989-01-23 1989-07-25 1990-01-24 $7700.00 Window Closed / Lapsed

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