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US4066804A Expired / Lapsed US ⏱️ 0.0 years remaining

Metal deposition process

Assignee: Imperial Chemical Industries Ltd
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Filing: 1974-10-01
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Granted: 1978-01-03
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Expires: 1994-10-01
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Abstract

Abstract Metal is deposited on a substrate containing neutral radicals, radical cations or neutral molecules (the latter being derived from a dication normally stable in aqueous media), by contacting the substrate with an electroless plating solution, optionally after sensitization with a salt of a platinum group metal silver or gold. The use of the process for data recording, particularly for the production of magnetic information carriers e.g. tapes or discs, metallizing plastic foam and for producing printed circuits is described.

Inventors

  • 👤 Timothy Douglas Andrews

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 06:59
CPC Classifications
H; H01; H01F; H01F41/00; H01F41/32; H01F41/34; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1612; C23C18/1633; C23C18/1635; C23C18/1639; C23C18/1641; C23C18/18; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2053; C23C18/206; C23C18/28; C23C18/30; G; G03; G03C; G03C1/00; G03C1/72; G03C1/73; G03C5/00; G03C5/58; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/38; H05K3/381

Claims Analysis

Total Claims: 23
Claim 1
Independent Claim 62 words
A process for the deposition of metal in or on substrate characterized in that the substrate contains or consists of, as active component, a polymeric compound comprising units derived from a cation of the general formula ##STR14## where R 1-12 are hydrogen, halogen or organic substituents and n = 0 or an integer, comprising contacting the substrate with an electroless plating solution.
Claim 2
Dependent Claim 62 words
A process for the deposition of metal in or on substrate characterized in that the substrate contains or consists of, as active component, a polymeric compound comprising units derived from a cation of the general formula ##STR14## where R 1-12 are hydrogen, halogen or organic substituents and n = 0 or an integer, comprising contacting the substrate with an electroless plating solution.
Claim 3
Dependent Claim 39 words
A process according to claim 1 in which the substrate is contacted first with a sensitiser comprising a solution of a compound of a metal of the platinum group, silver or gold and subsequently with the electroless plating solution.
Claim 4
Dependent Claim 38 words
A process according to claim 2 wherein said polymeric compound consists of units having the structure ##STR15## where R is a bipyridilium group selected from the group consisting of 4,4'-bipyridylium; 4,4'-biquinolinium; 1,2-bis(4-pyridyl) ethylene; 2,7-diazapyrinium; 2,2'-bipyridyl and 4-(4'-pyridyl) pyridinium.
Claim 5
Dependent Claim 20 words
A process according to claim 1 in which the active component is supported in a water soluble or swellable polymer.
Claim 6
Dependent Claim 23 words
A process according to claim 1 in which the active component is formed in situ from the cation by radiation or by heat.
Claim 7
Dependent Claim 70 words
A data recording process which comprises preparing a substrate, containing or consisting of, as active component, a polymeric compound comprising units derived from a cation of the general formula ##STR16## where R 1-12 are hydrogen, halogen or organic substituents and n = 0 or an integer, comprising contacting the substrate with an electroless plating solution, exposing said substrate to radiation or heat, and subsequently contacting with an electroless plating solution.
Claim 8
Dependent Claim 70 words
A data recording process which comprises preparing a substrate, containing or consisting of, as active component, a polymeric compound comprising units derived from a cation of the general formula ##STR16## where R 1-12 are hydrogen, halogen or organic substituents and n = 0 or an integer, comprising contacting the substrate with an electroless plating solution, exposing said substrate to radiation or heat, and subsequently contacting with an electroless plating solution.
Claim 9
Dependent Claim 36 words
A data recording process according to claim 6 in which the exposed material is contacted with a sensitising solution of a metal of the platinum group, silver or gold before contact with the electroless plating solution.
Claim 10
Dependent Claim 19 words
A data recording process according to claim 6 in which the plating solution is a ferromagnetic material plating solution.
Claim 11
Dependent Claim 22 words
A data recording process according to claim 8 in which the plating solution is selected from cobalt/phosphorus, nickel/phosphorus and cobalt/nickel/phosphorus plating solutions.
Claim 12
Dependent Claim 24 words
A data recording process according to claim 8 wherein the imagewise distribution of polymeric compound is a series of discrete tracks on the support.
Claim 13
Dependent Claim 22 words
A data recording process according to claim 6 in which the support is a non-magnetic disc bearing a coating containing said salt.
Claim 14
Dependent Claim 22 words
A data recording process according to claim 6 in which the support is a polymeric film bearing a coating containing said salt.
Claim 15
Dependent Claim 20 words
A data recording process according to claim 12 in which the support is a tape formed from a linear polyester.
Claim 16
Dependent Claim 40 words
A data recording process according to claim 6 wherein said polymeric compound consists of units having the structure ##STR17## where R is a bipyridilium group selected from the group consisting of 4,4'-bipyridylium; 4,4'-biquinolinium; 1,2-bis(4-pyridyl) ethylene; 2,7-diazapyrinium; 2,2'-bipyridyl and 4-(4'-pyridyl) pyridinium.
Claim 17
Independent Claim 62 words
A method of producing metallised foam which includes the steps of introducing an active polymeric compound comprising units derived from a cation of the general formula ##STR18## wherein R 1-12 ae hydrogen, halogen, or organic substituents and n = 0 or an integer into a plastics foam and electroless plating, consolidating the deposited metal by electroplating and optionally removing the plastics material.
Claim 18
Independent Claim 62 words
A method of producing metallised foam which includes the steps of introducing an active polymeric compound comprising units derived from a cation of the general formula ##STR18## wherein R 1-12 ae hydrogen, halogen, or organic substituents and n = 0 or an integer into a plastics foam and electroless plating, consolidating the deposited metal by electroplating and optionally removing the plastics material.
Claim 19
Dependent Claim 42 words
A method of producing metallised foam according to claim 15 wherein said polymeric compound consists of units having the structure ##STR19## where R is a bipyridilium group selected from the group consisting of 4,4'-bipyridylium; 4,4'-biquinolinium; 1,2-bis(4-pyridyl) ethylene; 2,7-diazapyrinium; 2,2'-bipyridyl and 4-(4'-pyridyl) pyridinium.
Claim 20
Independent Claim 68 words
A method of producing printed circuits for electrical or electronic devices in which a circuitwise distribution of a polymer compound comprising of units of an active component derived from a cation of the general formula ##STR20## where R 1-12 are hydrogen, halogen or organic substituents and n=0 or an integer is formed on a base support material, electroless plating, and building up the metallic layer by further plating.
Claim 21
Independent Claim 68 words
A method of producing printed circuits for electrical or electronic devices in which a circuitwise distribution of a polymer compound comprising of units of an active component derived from a cation of the general formula ##STR20## where R 1-12 are hydrogen, halogen or organic substituents and n=0 or an integer is formed on a base support material, electroless plating, and building up the metallic layer by further plating.
Claim 22
Dependent Claim 42 words
A method of producing printed circuits according to claim 17 wherein said polymeric compound consists of units having the structure ##STR21## where R is a bipyridilium group selected from the group consisting of 4,4'-bipyridylium; 4,4'-biquinolinium; 1,2-bis(4-pyridyl) ethylene; 2,7-diazapyrinium; 2,2'-bipyridyl and 4-(4'-pyridyl) pyridinium.
Claim 23
Dependent Claim 52 words
A method according to claim 17 for the production of circuits having regions of differing resistivity in which a first circuitwise distribution of active components is plated with a first metal and then a second circuitwise distribution of active component is plated with a second metal of higher resistivity than the first.

References Cited (Backward Citations)

US3111424A Cited
US3083118A Cited
US2979422A Cited
US3033703A Cited
US3429706A Cited
US3035944A Cited
US3222218A Cited
US3222210A Cited
US3326719A Cited
US3436468A Cited
US3579428A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1981-01-02 1981-07-04 1982-01-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1985-01-02 1985-07-04 1986-01-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1989-01-02 1989-07-04 1990-01-03 $7700.00 Window Closed / Lapsed

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