Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
100 words
Method for forming a self-aligned guard ring surrounding a Schottky barrier device comprising: opening a region in an insulator to expose a silicon surface; depositing a Schottky barrier forming metal through said opening; heat treating the structure to form the metal silicide contact for said Schottky barrier device wherein there is a volume shrinkage forming a narrow annulus of exposed silicon around said metal silicide contact; removing any said metal that has not been reacted to said metal silicide; and ion implanting an ion of opposite polarity to the exposed silicon to form a guardring surrounding the Schottky barrier device.
Claim 2
Dependent Claim
100 words
Method for forming a self-aligned guard ring surrounding a Schottky barrier device comprising: opening a region in an insulator to expose a silicon surface; depositing a Schottky barrier forming metal through said opening; heat treating the structure to form the metal silicide contact for said Schottky barrier device wherein there is a volume shrinkage forming a narrow annulus of exposed silicon around said metal silicide contact; removing any said metal that has not been reacted to said metal silicide; and ion implanting an ion of opposite polarity to the exposed silicon to form a guardring surrounding the Schottky barrier device.
Claim 3
Dependent Claim
18 words
The method of claim 1 wherein said silicon substrate is N type and said ion is P type.
Claim 4
Dependent Claim
18 words
The method of claim 1 wherein said silicon substrate is P type and said ion is N type.
Claim 5
Dependent Claim
27 words
The method of claim 2 wherein the dosage of said ion is greater than about 10 14 per cm 2 at between about 50 and 100 keV.
Claim 6
Dependent Claim
11 words
The method of claim 4 wherein the said ion is boron.
Claim 7
Dependent Claim
24 words
The method of claim 1 wherein the said heat treatment is in the order of 500°to 600° C for more than about 30 minutes.
Claim 8
Dependent Claim
24 words
The method of claim 6 wherein the resistivity of the surface of said substrate is within the range of about 0.1 to 10.0 ohm-cm.
Claim 9
Dependent Claim
35 words
The method of claim 7 wherein the substrate is N type and said ion is P type, and the surface concentration of said guardring is between about 10 18 to 10 19 atoms/cm 3 .
Claim 10
Dependent Claim
19 words
The method of claim 1 wherein a diffusion barrier layer is formed over said guardring in said silicon surface.
Claim 11
Dependent Claim
24 words
The method of claim 9 wherein said metal silicide contact is composed of platinum silicide and said diffusion barrier layer is composed of chromium.
Claim 12
Dependent Claim
16 words
The method of claim 10 wherein aluminum metal is formed over the surface of said contact.
Claim 13
Dependent Claim
19 words
The method of claim 1 wherein the deposited contact metal has a thickness between about 400 and 600 A.
Claim 14
Dependent Claim
11 words
The method of claim 12 wherein the deposited metal is platinum.
Claim 15
Dependent Claim
23 words
The method of claim 12 wherein aqua regia is used to remove any said metal which has not reacted to said metal silicide.
Claim 16
Dependent Claim
33 words
The method of claim 1 wherein the energy applied in said implantation is sufficient for the ions to penetrate said metal silicide and to form a shallow implanted region under said metal silicide.
Claim 17
Dependent Claim
17 words
The method of claim 15 wherein said metal silicide is platinum silicide and said ion is boron.