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US4059451A
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Electroless copper plating solution
Assignee: Panasonic Holdings Corp
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Filing: 1976-07-12
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Granted: 1977-11-22
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Expires: 1996-07-12
Abstract
Abstract An electroless copper plating solution comprising a copper salt, complexing agent, reducing agent, alkali hydroxide and aliphatic perfluorocarbon-containing non-ionic surface active agent is suitable for producing copper deposition having high ductility and good appearance, and further such a solution is very stable even at a high temperature.
Inventors
- 👤 Masahiro Oita
- 👤 Hyogo Hirohata
- 👤 Nobuhiro Hamasaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 15:44
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
117 words
An electroless copper plating solution comprising 0.001 to 0.30 mole/l of copper salt, 0.001 to 0.60 mole/l of a complexing agent for cupric ions, 0.0005 to 0.75 mole/l of a reducing agent to reduce cupric ions, 0.05 to 2.0 mole/l of alkali hydroxide, and 0.001 to 1.0 g/l of R f SO 2 N(R')R(C 2 H 4 O) m H, wherein R f is a perfluoroalkyl group containing 3 to 12 carbon atoms, R is an alkylene bridging group containing 1 to 12 carbon atoms, R' is a member selected from the group consisting of a hydrogen atom and an alkyl group containing 1 to 10 carbon atoms, and m is an integer of 1 to 15.
Claim 2
Dependent Claim
117 words
An electroless copper plating solution comprising 0.001 to 0.30 mole/l of copper salt, 0.001 to 0.60 mole/l of a complexing agent for cupric ions, 0.0005 to 0.75 mole/l of a reducing agent to reduce cupric ions, 0.05 to 2.0 mole/l of alkali hydroxide, and 0.001 to 1.0 g/l of R f SO 2 N(R')R(C 2 H 4 O) m H, wherein R f is a perfluoroalkyl group containing 3 to 12 carbon atoms, R is an alkylene bridging group containing 1 to 12 carbon atoms, R' is a member selected from the group consisting of a hydrogen atom and an alkyl group containing 1 to 10 carbon atoms, and m is an integer of 1 to 15.
Claim 3
Dependent Claim
55 words
An electroless copper plating solution according to claim 9, wherein the amount of said copper salt is 0.005 to 0.12 mole/l, the amount of said complexing agent is 0.006 to 0.35 mole/l, the amount of said reducing agent is 0.005 to 0.5 mole/l, and the amount of said alkali hydroxide is 0.1 to 0.5 mole/l.
Claim 4
Dependent Claim
40 words
An electroless copper plating solution according to claim 1, wherein said R f SO 2 N(R')R(C 2 H 4 O) m H is C 8 F 17 SO 2 N(CH 3 )CH 2 (C 2 H 4 O) 14 H.
Claim 5
Dependent Claim
21 words
An electroless copper plating solution according to claim 1, wherein said solution has a bath temperature of 50° to 100° C.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-11-21 | 1981-05-23 | 1981-11-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-11-21 | 1985-05-23 | 1985-11-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-11-21 | 1989-05-23 | 1989-11-22 | $7700.00 | Window Closed / Lapsed |