US3615732A
Expired / Lapsed
US
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Electroless copper plating
Assignee: Shipley Co Inc
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Filing: 1968-08-13
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Granted: 1971-10-26
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Expires: 1988-08-13
Abstract
Abstract An electroless copper plating solution comprising a source of cupric ions, hydroxyl radicals, formaldehyde or a formaldehyde precursor preferably paraformaldehyde, and a complexing agent for copper, said solution characterized by the addition of a hydrogen inclusion retarding agent and at least one member selected from the group consisting of a formaldehyde addition agent and a salt of a Group VIII metal of the Periodic Chart of the Elements. The electroless copper plating solution is capable of providing a rapid rate of copper deposition dependent upon the selection of the complexing agent without sacrifice in tensile properties of the copper deposit. The copper plate deposited from the electroless solution of this invention is distinguishable from prior art electroless copper deposits by substantially improved bending or ductility properties.
Inventors
- 👤 Charles R Shipley Jr
- 👤 Lucia H Shipley
- 👤 Michael Gulla
- 👤 Oleh B Dutkewych
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 08:38
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40; C23C18/405
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
25 words
The copper plating solution of claim 1 having as additive at least one hydrogen inclusion retarding agent and a salt of a Group VIII metal.
Claim 2
Dependent Claim
22 words
The copper plating solution of claim 1 having as additive at least one hydrogen inclusion retarding agent and a formaldehyde addition agent.
Claim 3
Dependent Claim
29 words
The copper plating solution of claim 1 having as additive at least one hydrogen inclusion retarding agent, a salt of a Group VIII metal and a formaldehyde addition agent.
Claim 4
Dependent Claim
72 words
The copper plating solution of claim 1 having the following formulation: copper salt 0.02 to 0.12 moles formaldehyde 0.1 to 1 moles complexing agent 1 to 3 times the moles of cupric ion free hydroxide 0.1 to 0.8 moles hydrogen inclusion retarding agent 5 to 250 p.p.m. formaldehyde addition 0.1 to 1 times the moles agent of formaldehyde Group VIII metal salt 30 to 1000 p.p.m. Water to 1 liter of solution
Claim 5
Dependent Claim
14 words
The copper plating solution of claim 1 where the cyanide compound is sodium cyanide.
Claim 6
Dependent Claim
15 words
The copper plating solution of claim 1 where the hydrogen inclusion retarding agent is As2O3.
Claim 7
Dependent Claim
15 words
The copper plating solution of claim 1 where the hydrogen inclusion retarding agent is V2O5.
Claim 8
Dependent Claim
125 words
In an electroless copper solution comprising a source of cupric ions, hydroxyl radicals, formaldehyde And sufficient complexing agent to render said cupric ions soluble in alkaline solution, the improvement comprising an additive in the solution comprising at least one hydrogen inclusion retarding agent and at least one solution soluble member selected from the group consisting of a formaldehyde addition agent and a salt of a Group VIII metal of the Periodic Chart of the Elements; said hydrogen inclusion retarding agent, and Group VIII metal salt being present in solution in minor amounts sufficient to improve ductility of a copper deposit and said formaldehyde addition agent being present in an amount of from 0.1 moles per mole of formaldehyde to that amount that restricts copper deposition.
Claim 9
Dependent Claim
23 words
The copper plating solution of claim 9 having as additive at least one hydrogen inclusion retarding agent, and the Group VIII metal salt.
Claim 10
Dependent Claim
22 words
The copper plating solution of claim 9 having as additive at least one hydrogen inclusion retarding agent and the formaldehyde addition agent.
Claim 11
Dependent Claim
27 words
The copper plating solution of claim 9 having as additive the hydrogen inclusion retarding agent, the formaldehyde addition agent and the salt of the Group VIII metal.
Claim 12
Dependent Claim
26 words
The copper plating solution of claim 9 where the salt of the Group VIII metal is selected from the group consisting of NiSO4, Fe2(SO4)3 and H2PtCl6.
Claim 13
Dependent Claim
22 words
The copper solution of claim 9 where the formaldehyde addition agent is selected from the group consisting of Na2SO3, NaHSO3, and Na2HPO3.5H2O.
Claim 14
Dependent Claim
15 words
The copper plating solution of claim 9 where the hydrogen inclusion retarding agent is NaCN.
Claim 15
Dependent Claim
23 words
The copper plating solution of claim 9 where the hydrogen inclusion retarding agent is selected from the group consisting of V2O5 and As2O3.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-10-25 | 1975-04-26 | 1975-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-10-25 | 1979-04-26 | 1979-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-10-25 | 1983-04-26 | 1983-10-26 | $7700.00 | Window Closed / Lapsed |