Evaporated solderable multilayer contact for silicon semiconductor

Claim 1

A method of forming an improved solderable multilayer electrode on a silicon body comprising the steps of: vacuum depositing an aluminum layer at least about 3000 angstroms thick onto a surface of a silicon body, heating said silicon body and said aluminum layer to shallowly alloy said aluminum layer with the silicon of said body at their interface and reduce electrical resistance between said layer and said body, thereafter evaporating onto said alloyed aluminum layer a continuous film of manganese having an average thickness of at least about 800 angstroms, and evaporating nickel onto said manganese film to form a nickel layer at least about 3000 angstroms thick.

Claim 2

A method of forming an improved solderable multilayer electrode on a silicon body comprising the steps of: vacuum depositing an aluminum layer at least about 3000 angstroms thick onto a surface of a silicon body, heating said silicon body and said aluminum layer to shallowly alloy said aluminum layer with the silicon of said body at their interface and reduce electrical resistance between said layer and said body, thereafter evaporating onto said alloyed aluminum layer a continuous film of manganese having an average thickness of at least about 800 angstroms, and evaporating nickel onto said manganese film to form a nickel layer at least about 3000 angstroms thick.

Claim 3

A method of forming a more adherent low resistance solderable multilayer electrode on a silicon surface comprising the steps of: vacuum depositing an aluminum layer about 3000- 15,000 angstroms thick onto a silicon surface, microalloying said aluminum layer to said silicon surface, wherein the electrical resistance therebetween is reduced and the aluminum layer is more intimately bonded to said silicon surface, thereafter evaporating manganese onto said microalloyed aluminum layer to form a manganese layer about 800- 2500 angstroms thick, and without exposing said manganese layer to air, evaporating nickel onto said manganese layer to form a nickel layer thickness of about 3000- 5000 angstroms.

Claim 4

A method of forming a more adherent low resistance solderable multilayer electrode on a silicon surface comprising the steps of: vacuum depositing an aluminum layer about 3000- 15,000 angstroms thick onto a silicon surface, microalloying said aluminum layer to said silicon surface, wherein the electrical resistance therebetween is reduced and the aluminum layer is more intimately bonded to said silicon surface, thereafter evaporating manganese onto said microalloyed aluminum layer to form a manganese layer about 800- 2500 angstroms thick, and without exposing said manganese layer to air, evaporating nickel onto said manganese layer to form a nickel layer thickness of about 3000- 5000 angstroms.