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US4007074A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making an epitaxial growth layer of GaAs1-x Px compound semiconductor

Assignee: Hitachi Ltd
•
Filing: 1971-01-08
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Granted: 1977-02-08
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Expires: 1991-01-08
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Abstract

Abstract A layer of GaAs1-xPx (0<x<1) is epitaxially grown on GaAs which is disposed in a reaction tube at a different location from the Ga source by maintaining the GaAs at a temperature range of from about 750 DEG C. to about 850 DEG C., maintaining the Ga source at a temperature higher than that of the GaAs, introducing As4 gas, PCl3 gas and H2 gas or AsCl3 gas, P4 gas and H2 gas into the reaction tube from the Ga source side, whereby said gases react with the Ga source and produce GaCl gas, and contacting said gases including the GaCl gas with the surface of the GaAs.

Inventors

  • 👤 Masahiko Ogirima
  • 👤 Toshimitu Shinoda
  • 👤 Yuichi Ono
  • 👤 Hajime Kusumoto

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 16:35
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; Y; Y10; Y10S; Y10S148/00; Y10S148/04; Y10S148/041; Y10S148/056; Y10S148/057; Y10S148/065; Y10S148/067; Y10S148/072; Y10S438/00; Y10S438/914; Y10S438/925

Claims Analysis

Total Claims: 21
Claim 1
Independent Claim 180 words
A method of making an epitaxial growth layer of GaAs 1-x P x (0<x<1) compound semiconductor on a seed material that is crystallographically compatible with the layer, comprising the steps of: disposing a source material including Ga and said seed material in a reaction tube spaced from each other; maintaining said source material at a temperature higher than that of said seed material; heating element As to a temperature so as to obtain a controlled amount of As 4 gas; heating elemental P to a temperature so as to obtain a controlled amount of P 4 gas; introducing a gaseous material selected from the group consisting of a mixture of PCl 3 , As 4 gas produced from said heated elemental As and H 2 gas, or a mixture of P 4 gas produced from said heated elemental P, AsCl 3 , and H 2 gas into the reaction tube so as to contact at least said gaseous material with said source material, whereby a reaction gas including GaCl is produced; and contacting said reaction gas with said seed material.
Claim 2
Independent Claim 180 words
A method of making an epitaxial growth layer of GaAs 1-x P x (0<x<1) compound semiconductor on a seed material that is crystallographically compatible with the layer, comprising the steps of: disposing a source material including Ga and said seed material in a reaction tube spaced from each other; maintaining said source material at a temperature higher than that of said seed material; heating element As to a temperature so as to obtain a controlled amount of As 4 gas; heating elemental P to a temperature so as to obtain a controlled amount of P 4 gas; introducing a gaseous material selected from the group consisting of a mixture of PCl 3 , As 4 gas produced from said heated elemental As and H 2 gas, or a mixture of P 4 gas produced from said heated elemental P, AsCl 3 , and H 2 gas into the reaction tube so as to contact at least said gaseous material with said source material, whereby a reaction gas including GaCl is produced; and contacting said reaction gas with said seed material.
Claim 3
Dependent Claim 25 words
The method of claim 1, wherein said source material includes a member selected from the group consisting of GaAs and GaP having a dopant therein.
Claim 4
Dependent Claim 15 words
The method of claim 2, wherein said source material includes GaAs having a dopant therein.
Claim 5
Dependent Claim 15 words
The method of claim 2, wherein said source material includes GaP having a dopant therein.
Claim 6
Dependent Claim 13 words
The method of claim 1, wherein said gaseous material includes PCl 3 .
Claim 7
Dependent Claim 13 words
The method of claim 1, wherein said gaseous material includes AsCl 3 .
Claim 8
Dependent Claim 41 words
The method of claim 1, wherein said gaseous material is introduced into the reaction tube so as to contact with the source material, and As 4 gas or P 4 gas is introduced into the reaction zone in the reaction tube.
Claim 9
Dependent Claim 25 words
The method of claim 7, wherein said source material includes a material selected from the group consisting of GaAs and GaP having a dopant therein.
Claim 10
Dependent Claim 33 words
The method of claim 1, wherein the temperature of said source material is maintained at about 900° to 950°C. and the temperature of said seed material is maintained at about 800° to 820°C.
Claim 11
Dependent Claim 33 words
The method of claim 1, wherein the temperature of said source material is maintained at about 750° to 1000°C. and the temperature of said seed material is maintained at about 750° to 850°C.
Claim 12
Dependent Claim 17 words
The method of claim 9, wherein the temperature of the elemental As is maintained at about 400°C.
Claim 13
Dependent Claim 17 words
The method of claim 9, wherein the temperature of the elemental P is maintained at about 320°C.
Claim 14
Dependent Claim 19 words
The method of claim 10, wherein the temperature of the elemental As is maintained at about 350° to 500°C.
Claim 15
Dependent Claim 19 words
The method of claim 10, wherein the temperature of the elemental P is maintained at about 250° to 350°C.
Claim 16
Dependent Claim 30 words
The method of claim 1, wherein the x value of the GaAs 1-x P x compound is controlled by controlling the temperature of the elemental As or the elemental P.
Claim 17
Independent Claim 179 words
A method of forming an epitaxial growth layer of GaAs 1-x P x (0<x<1) compound semiconductor on a GaAs substrate, comprising the steps of: disposing a source material including Ga and said GaAs in a reaction tube spaced from each other; maintaining the temperature of the GaAs at about 750° to 850° C.; maintaining the Ga source at a temperature higher than that of the GaAs; heating elemental As in a temperature range from about 350° to 500° C. so as to obtain a controlled amount of As 4 gas; heating elemental P in a temperature range from about 250° to 350° C. so as to obtain a controlled amount of P 4 gas; introducing PCl 3 gas, As 4 gas having the controlled amount and H 2 gas, or AsCl 3 gas, P 4 gas having the controlled amount and H 2 gas, into the reaction tube from the Ga source side, whereby said gases react with the Ga source and produce GaCl gas; and contacting said gases including the GaCl gas with the surface of the GaAs.
Claim 18
Independent Claim 179 words
A method of forming an epitaxial growth layer of GaAs 1-x P x (0<x<1) compound semiconductor on a GaAs substrate, comprising the steps of: disposing a source material including Ga and said GaAs in a reaction tube spaced from each other; maintaining the temperature of the GaAs at about 750° to 850° C.; maintaining the Ga source at a temperature higher than that of the GaAs; heating elemental As in a temperature range from about 350° to 500° C. so as to obtain a controlled amount of As 4 gas; heating elemental P in a temperature range from about 250° to 350° C. so as to obtain a controlled amount of P 4 gas; introducing PCl 3 gas, As 4 gas having the controlled amount and H 2 gas, or AsCl 3 gas, P 4 gas having the controlled amount and H 2 gas, into the reaction tube from the Ga source side, whereby said gases react with the Ga source and produce GaCl gas; and contacting said gases including the GaCl gas with the surface of the GaAs.
Claim 19
Dependent Claim 17 words
The method of claim 16 wherein said source material includes GaAs or GaP having a dopant therein.
Claim 20
Independent Claim 144 words
A method of making an epitaxial growth layer of GaAs 1-x P x (0<x<1) compound semiconductor on a seed material that is crystalographically compatible with the layer, comprising the steps of: disposing a source material including Ga and said seed material into a reaction tube spaced from each other; maintaining said source material at a temperature higher than that of said seed material; maintaining elemental As at a temperature for obtaining As 4 gas having a certain amount; maintaining elemental P at a temperature for obtaining P 4 gas having a certain amount; introducing PCl 3 gas, As 4 gas having said certain amount and H 2 gas or AsCl 3 gas, P 4 gas having said certain amount and H 2 gas into the reaction tube, whereby a reaction gas including GaCl is produced; and contacting the certain gas with said seed material.
Claim 21
Independent Claim 144 words
A method of making an epitaxial growth layer of GaAs 1-x P x (0<x<1) compound semiconductor on a seed material that is crystalographically compatible with the layer, comprising the steps of: disposing a source material including Ga and said seed material into a reaction tube spaced from each other; maintaining said source material at a temperature higher than that of said seed material; maintaining elemental As at a temperature for obtaining As 4 gas having a certain amount; maintaining elemental P at a temperature for obtaining P 4 gas having a certain amount; introducing PCl 3 gas, As 4 gas having said certain amount and H 2 gas or AsCl 3 gas, P 4 gas having said certain amount and H 2 gas into the reaction tube, whereby a reaction gas including GaCl is produced; and contacting the certain gas with said seed material.

References Cited (Backward Citations)

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US3312570A Cited
US3146137A Cited
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US3441000A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-02-08 1980-08-09 1981-02-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-02-08 1984-08-09 1985-02-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-02-08 1988-08-09 1989-02-08 $7700.00 Window Closed / Lapsed

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