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US4006045A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for producing high power semiconductor device using anodic treatment and enhanced diffusion

Assignee: International Business Machines Corp
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Filing: 1976-02-13
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Granted: 1977-02-01
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Expires: 1996-02-13
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Abstract

Abstract A high power semiconductor device is formed by providing a semiconductor substrate of N - conductivity, rendering the backside of same porous as by subjecting same to anodic treatment carried out in a concentrated solution of hydrofluoric acid, converting the porous region to an N + region, as by arsenic diffusion and forming an active device by conventional techniques in the top surface of the substrate. The method permits usage of high quality N - substrates and at the same time eliminates the requirement of growing thick epitaxial layers.

Inventors

  • 👤 Joseph A. Aboaf
  • 👤 Robert W. Broadie
  • 👤 Edward M. Hull
  • 👤 H. Bernhard Pogge

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 12:52
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/10; H10D62/13; H10D62/137; H10D62/40; H10P; H10P32/00; H10P32/10; H10P32/12; H10P32/17; H10P32/171; H10P50/00; Y; Y10; Y10S; Y10S438/00; Y10S438/928; Y10S438/96

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 99 words
In the method of producing a semiconductor device, the steps comprising: providing a semiconductor substrate having a top and back surface; forming a porous portion by anodic treatment within said substrate extending inwardly of said back surface; forming a protective insulating layer on the top surface of said substrate; doping said porous portion to a region o higher conductivity than said substrate; forming a protective layer on the back surface of said substrate; removing the top protective insulating layer from said substrate; and, introducing impurities into the top surface of said substrate so as to form a semiconductor device.
Claim 2
Dependent Claim 99 words
In the method of producing a semiconductor device, the steps comprising: providing a semiconductor substrate having a top and back surface; forming a porous portion by anodic treatment within said substrate extending inwardly of said back surface; forming a protective insulating layer on the top surface of said substrate; doping said porous portion to a region o higher conductivity than said substrate; forming a protective layer on the back surface of said substrate; removing the top protective insulating layer from said substrate; and, introducing impurities into the top surface of said substrate so as to form a semiconductor device.
Claim 3
Dependent Claim 24 words
The invention by claim 1 wherein said substrate portion is rendered porous by anodic treatment carried out in a concentrated solution of hydrofluoric acid.
Claim 4
Dependent Claim 27 words
The invention defined by claim 1 wherein silicon dioxide is pyrolytically deposited on the top surface of said substrate to form said top surface protective insulating layer.
Claim 5
Dependent Claim 30 words
The invention defined by claim 1 wherein said porous portion is converted to a region of higher conductivity by diffusing an impurity into said porous portion through said back surface.
Claim 6
Dependent Claim 25 words
The invention defined by claim 1 wherein a polycrystalline silicon layer is deposited over the back surface of said substrate to form a protective layer.
Claim 7
Dependent Claim 24 words
The invention defined by claim 1 wherein said substrate is of N - conductivity and said region of higher conductivity is N + .
Claim 8
Dependent Claim 42 words
The invention defined in claim 1 including forming a porous portion within said substrate extending inwardly of said back surface such that said porous portion includes void areas on the order of 15% as measured by weight loss in said porous portion.

References Cited (Backward Citations)

US3535170A Cited
US3494809A Cited
US3640806A Cited
US3723201A Cited
US3919060A Cited
US3929529A Cited
US3954523A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-02-01 1980-08-02 1981-02-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-02-01 1984-08-02 1985-02-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-02-01 1988-08-02 1989-02-01 $7700.00 Window Closed / Lapsed

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